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1. 发明授权

US06908685B2 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate 有权
标题翻译：聚酰亚胺膜，制造方法和具有聚酰亚胺膜基材的金属互连板
公开(公告)号：US06908685B2
公开(公告)日：2005-06-21
申请号：US10343277
申请日：2001-08-23
申请人： Kenji Uhara , Kouichi Sawasaki , Naofumi Yasuda , Brian C. Auman , John D. Summers
发明人： Kenji Uhara , Kouichi Sawasaki , Naofumi Yasuda , Brian C. Auman , John D. Summers
IPC分类号： C08G73/10 , H05K1/03 , B32B15/08 , B32B27/08 , C08L77/00
CPC分类号： H05K1/0346 , C08G73/1042 , Y10S428/901 , Y10T428/24917 , Y10T428/31678 , Y10T428/31721
摘要： The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
摘要翻译：本发明提供一种聚酰亚胺膜，其由均苯四酸二酐制备的聚酰胺酸与10至60mol％的苯二胺和40至90mol％的3,4'-氧二苯胺（基于总二胺）组合。聚酰亚胺薄膜通过在其表面上提供金属互连作为柔性电路中的金属互连板基板，芯片级封装（CSP），球栅阵列（BGA）或带自动键合（TAB）高弹性模量，低热膨胀系数，碱蚀刻性和成膜性之间的平衡。

2. 发明授权

US06555238B2 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate 失效
公开(公告)号：US06555238B2
公开(公告)日：2003-04-29
申请号：US09927647
申请日：2001-08-10
申请人： Kenji Uhara , Naofumi Yasuda , Kouichi Sawasaki
发明人： Kenji Uhara , Naofumi Yasuda , Kouichi Sawasaki
IPC分类号： B32B1508
CPC分类号： C08J5/18 , C08G73/1042 , C08G73/1071 , C08J2379/08 , H05K1/0346 , Y10T428/31681 , Y10T428/31721 , Y10T428/31725
摘要： A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

3. 发明授权

US06548179B2 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate 失效
标题翻译：聚酰亚胺膜，制造方法和具有聚酰亚胺膜基材的金属互连板
公开(公告)号：US06548179B2
公开(公告)日：2003-04-15
申请号：US09925211
申请日：2001-08-09
申请人： Kenji Uhara , Naofumi Yasuda , Kouichi Sawasaki
发明人： Kenji Uhara , Naofumi Yasuda , Kouichi Sawasaki
IPC分类号： B32B2700
CPC分类号： C08J5/18 , C08G73/1042 , C08J2379/08 , H05K1/0346 , Y10T428/24802 , Y10T428/24917 , Y10T428/31721
摘要： A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4′-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
摘要翻译：通过将苯均二酸二酐与苯二胺，亚甲基二苯胺和3,4'-氧二苯胺以特定摩尔比组合共聚制备聚酰亚胺膜。聚酰亚胺薄膜通过在其表面上提供金属互连作为柔性电路中的金属互连板基板，芯片级封装（CSP），球栅阵列（BGA）或带自动键合（TAB）高弹性模量，低热膨胀系数，碱蚀刻性和成膜性之间的平衡。

4. 发明申请

US20060009615A1 Polyamic acids, polyimide films and polymide-metal laminates and methods for making same 审中-公开
标题翻译：聚酰胺酸，聚酰亚胺薄膜和聚酰亚胺金属层压板及其制造方法
公开(公告)号：US20060009615A1
公开(公告)日：2006-01-12
申请号：US11170226
申请日：2005-06-29
申请人： Kenji Uhara
发明人： Kenji Uhara
IPC分类号： C08G73/00
CPC分类号： H05K1/0346 , C08G73/1042 , C08G73/1067
摘要： A polyamic acid obtained by the reaction of an aromatic diamine containing 1-100 mol percent of a carboxy-4,4′-diaminobiphenyl and an aromatic tetracarboxylic dianhydride or derivative thereof is provided. A polyimide is obtained from the imidization of the polyamic acid. Methods for obtaining the polyamic acid, the polyimide, a polyimide film, and a polyimide film-metal laminate are also disclosed. The polyimide film-metal laminate has a high peel strength of at least 10N/cm when laminated to a metal foil using an adhesive, and as such can generally be used as a flexible circuit substrate.
摘要翻译：提供通过含有1-100摩尔％的羧基-4,4'-二氨基联苯和芳族四羧酸二酐或其衍生物的芳族二胺反应获得的聚酰胺酸。从聚酰胺酸的酰亚胺化得到聚酰亚胺。还公开了获得聚酰胺酸，聚酰亚胺，聚酰亚胺膜和聚酰亚胺膜 - 金属层压体的方法。聚酰亚胺膜 - 金属层压体当使用粘合剂层合到金属箔上时具有至少10N / cm的高剥离强度，因此通常可以用作柔性电路基板。

5. 发明授权

US06828390B2 Polyimide substrates having an interpenetrating network morphology and methods relating thereto 有权
标题翻译：具有互穿网络形态的聚酰亚胺基片及其相关的方法
公开(公告)号：US06828390B2
公开(公告)日：2004-12-07
申请号：US10331234
申请日：2002-12-30
申请人： Kenji Uhara
发明人： Kenji Uhara
IPC分类号： C08L7908
CPC分类号： C08J5/18 , C08J2379/08 , C08L79/08 , C08L2205/02 , H05K1/0346 , C08L2666/20
摘要： A high modulus, dimensionally stable film formed via an interpenetrating polyimide network of two polyimide structures, interlocked and bonded on a molecular level. The polyimide components are made from a dianhydride and a diamine. The dianhydrides used are tetravalent aromatic structures represented by where X is a divalent organic group selected from among —CO—, —O—, —S—, —SO2—, —CH2—, —C(CH3)2—, and —C(CF3)2— and diamines used are divalent aromatic structure represented by wherein Y is a divalent organic group selected from the group consisting of —CO—, —O—, —S—, —SO2—, —CH2—, —C(CH3)2—, and —C(CF3)2—. The end capping agent is a carboxylic anhydride or a silylating agent. The second polyimide is polymerized in the presence of the first polymer thus forming a single phase system.
摘要翻译：通过两个聚酰亚胺结构的互穿聚酰亚胺网络形成的高模量，尺寸稳定的膜，在分子水平上互锁并结合。聚酰亚胺组分由二酐和二胺制成。使用的二酐是四价芳族结构，其中X是选自-CO - ， - O - ， - S - ， - SO 2 - ， - CH 2 - ， - C（CH 3）2 - 和-C（ CF 3）2-和二胺使用二价芳族结构，其中Y是选自-CO - ， - O - ， - S - ， - SO 2 - ， - CH 2 - ， - C（CH 3） 2-和-C（CF 3）2 - 。封端剂是羧酸酐或甲硅烷基化剂。第二聚酰亚胺在第一聚合物的存在下聚合，从而形成单相系统。

6. 发明授权

US07452610B2 Multi-layer polyimide films and flexible circuit substrates therefrom 有权
标题翻译：多层聚酰亚胺膜和柔性电路基板
公开(公告)号：US07452610B2
公开(公告)日：2008-11-18
申请号：US11170224
申请日：2005-06-29
申请人： Kenji Uhara
发明人： Kenji Uhara
IPC分类号： B32B15/08 , B32B27/00
CPC分类号： B32B27/00 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/281 , B32B2307/5825 , B32B2457/08 , H05K1/0346 , H05K1/036 , H05K1/0393 , H05K2201/0154 , Y10T428/31681 , Y10T428/31721
摘要： A multi-layer polyimide film including two or more laminated polyimide film layers is provided, with at least one of the two or more polyimide film layers is obtained by imidizing a polyamic acid derived from the reaction of at least one aromatic diamine containing 1-100 mol percent of carboxy-4,4′-diaminobiphenyl represented by the following formula, wherein m and n represent integers of 4 or less, including 0, and (m+n) is an integer of 1 or greater, and at least one aromatic tetracarboxylic dianhydride or a derivative thereof. Methods for obtaining a multi-layer polyimide film laminate can exhibit a peel strength of 10N/cm when laminated to a metal foil using an adhesive and can have a water absorption value of less than 3.0 weight percent.
摘要翻译：提供了包含两层或更多层叠聚酰亚胺膜层的多层聚酰亚胺膜，其中两个或更多个聚酰亚胺膜层中的至少一个通过酰亚胺化来自至少一种含1-100个芳族二胺的芳族二胺的聚酰胺酸摩尔百分比由下式表示的羧基-4,4'-二氨基联苯，其中m和n表示4或更小的整数，包括0，（m + n）是1或更大的整数，和至少一个芳族四羧酸二酐或其衍生物。获得多层聚酰亚胺膜层叠体的方法当使用粘合剂层合到金属箔上时可以表现出10N / cm的剥离强度，并且可以具有小于3.0重量％的吸水值。

7. 发明授权

US06277495B1 Polyimide film, a method for its manufacture and a polyimide film containing metal laminated plate 失效
标题翻译：聚酰亚胺膜，其制造方法和含有金属层压板的聚酰亚胺膜
公开(公告)号：US06277495B1
公开(公告)日：2001-08-21
申请号：US09115133
申请日：1998-07-14
申请人： Koichi Sawasaki , Kenji Uhara , Michihiro Kubo
发明人： Koichi Sawasaki , Kenji Uhara , Michihiro Kubo
IPC分类号： B32B1508
CPC分类号： B32B15/08 , B32B7/12 , B32B27/281 , B32B2307/202 , B32B2379/08 , B32B2439/00 , B32B2457/08 , C08G73/1042 , C08G73/1064 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , G02B5/3083 , H05K1/0346 , Y10T428/31681 , Y10T428/31721
摘要： A polyimide film of birefringence less than 0.01 is formed by drawing a copolymerized polyimide comprising a block component and a random component which are molecularly bonded, wherein the block component of copolymerized polyimide comprises an aromatic diamine compound having a rigid structure and an aromatic tetracarboxylic acid compound and wherein the random component of copolymerized polyimide comprises an aromatic diamine compound having a flexible structure and at least two aromatic tetracarboxylic acid components. The resulting polyimide film has high elasticity, a low thermal expansion equivalent to that of metal and low water absorbing properties. A method for its manufacture and a metal laminated plate having improved curl properties in which the polyimide is used as the base material are also disclosed.
摘要翻译：双折射小于0.01的聚酰亚胺膜通过拉伸含有分子结合的嵌段组分和无规组分的共聚聚酰亚胺形成，其中共聚聚酰亚胺的嵌段组分包含具有刚性结构的芳族二胺化合物和芳族四羧酸化合物并且其中共聚聚酰亚胺的无规组分包含具有柔性结构的芳族二胺化合物和至少两种芳族四羧酸组分。所得聚酰亚胺膜具有高弹性，与金属相当的低热膨胀性和低吸水性。还公开了其制造方法和具有改进卷曲性能的金属层压板，其中使用聚酰亚胺作为基材。

8. 发明授权

US07273661B2 Electrically conductive polyimide compositions having a carbon nanotube filler component and methods relating thereto 有权
标题翻译：具有碳纳米管填料组分的导电聚酰亚胺组合物及其相关方法
公开(公告)号：US07273661B2
公开(公告)日：2007-09-25
申请号：US10612184
申请日：2003-07-02
申请人： Hideki Moriyama , Kenji Uhara
发明人： Hideki Moriyama , Kenji Uhara
IPC分类号： B32B5/16 , B32B27/06
CPC分类号： C08J5/005 , B82Y10/00 , B82Y30/00 , C08J5/18 , C08J2379/08 , C08K3/041 , C08K2201/011 , H05K1/0259 , H05K1/0393 , H05K1/167 , H05K2201/0154 , H05K2201/026 , H05K2201/0323 , Y10T428/25 , Y10T428/26 , Y10T428/263 , Y10T428/31681 , Y10T428/31721 , C08L79/08
摘要： This invention is directed to polyimide films having a carbon nanotube filler to provide a surface resistivity in a range from 50 ohm/square to 1.0×1015 ohms/square. The electrically conductive polyimides of the present invention have an excellent balance of properties relative to conventional polyimides having a conductive filler, due at least in part to the film's water content, degree of imidization and polymer orientation.
摘要翻译：本发明涉及具有碳纳米管填料的聚酰亚胺膜，以提供50欧姆/平方至1.0×10 15欧姆/平方的表面电阻率。由于至少部分由于膜的水含量，酰亚胺化程度和聚合物取向，本发明的导电聚酰亚胺相对于具有导电填料的常规聚酰亚胺具有优异的性能平衡。

9. 发明申请

US20070003773A1 Multi-layer polyimide films and flexible circuit substrates therefrom 有权
标题翻译：多层聚酰亚胺膜和柔性电路基板
公开(公告)号：US20070003773A1
公开(公告)日：2007-01-04
申请号：US11170224
申请日：2005-06-29
申请人： Kenji Uhara
发明人： Kenji Uhara
IPC分类号： B32B27/00
CPC分类号： B32B27/00 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/281 , B32B2307/5825 , B32B2457/08 , H05K1/0346 , H05K1/036 , H05K1/0393 , H05K2201/0154 , Y10T428/31681 , Y10T428/31721
摘要： A multi-layer polyimide film including two or more laminated polyimide film layers is provided, with at least one of the two or more polyimide film layers is obtained by imidizing a polyamic acid derived from the reaction of at least one aromatic diamine containing 1-100 mol percent of carboxy-4,4′-diaminobiphenyl represented by the following formula, wherein m and n represent integers of 4 or less, including 0, and (m+n) is an integer of 1 or greater, and at least one aromatic tetracarboxylic dianhydride or a derivative thereof. Methods for obtaining a multi-layer polyimide film laminate can exhibit a peel strength of 10N/cm when laminated to a metal foil using an adhesive and can have a water absorption value of less than 3.0 weight percent.
摘要翻译：提供了包含两层或更多层叠聚酰亚胺膜层的多层聚酰亚胺膜，其中两个或更多个聚酰亚胺膜层中的至少一个通过酰亚胺化来自至少一种含1-100个芳族二胺的芳族二胺的聚酰胺酸摩尔百分比由下式表示的羧基-4,4'-二氨基联苯，其中m和n表示4或更小的整数，包括0，（m + n）是1或更大的整数，和至少一个芳族四羧酸二酐或其衍生物。获得多层聚酰亚胺膜层叠体的方法当使用粘合剂层合到金属箔上时可以表现出10N / cm的剥离强度，并且可以具有小于3.0重量％的吸水值。

10. 发明授权

US06916544B2 Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto 有权
标题翻译：用于柔性电路或类似组件的层压材料及其相关方法
公开(公告)号：US06916544B2
公开(公告)日：2005-07-12
申请号：US10150233
申请日：2002-05-17
申请人： Hideki Moriyama , Kenji Uhara , Meredith L. Dunbar , James R. Edman
发明人： Hideki Moriyama , Kenji Uhara , Meredith L. Dunbar , James R. Edman
IPC分类号： B32B15/088 , B32B15/08 , B32B27/34 , C08G73/10 , H05K1/03
CPC分类号： B32B27/34 , C08G73/101 , C08G73/1014 , H05K1/0346 , Y10S428/91 , Y10T428/31681 , Y10T428/31721
摘要： A laminate having improved resistance to separation failure when incorporated into a flexible circuit structure. The laminate comprising a highly bondable polyimide and is preferably formed from a polyamic acid comprising a tetracarboxylic acid component, a diamine component, and 0.1 to 5.0 mole % of a dicarboxylic acid component, with respect to the tetracarboxylic acid component, and wherein the adhesive strength of the laminate is greater than 10 N/cm, and more preferably greater than 19 N/cm.
摘要翻译：当结合到柔性电路结构中时，具有改进的对分离失败的抵抗力的层压板。所述层压体包含高粘合性聚酰亚胺，优选由四羧酸成分，二胺成分和相对于所述四羧酸成分为0.1〜5.0摩尔％的二羧酸成分的聚酰胺酸形成，其中，所述粘合强度的层压体大于10N / cm，更优选大于19N / cm。

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