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    • 8. 发明授权
    • Conductive bonding agent and a conductive connecting method
    • 导电粘合剂和导电连接方法
    • US5180888A
    • 1993-01-19
    • US713822
    • 1991-06-12
    • Kazuhiro SugiyamaYoshinori Atsumi
    • Kazuhiro SugiyamaYoshinori Atsumi
    • G02F1/13G02F1/1339G02F1/1345H01R4/04H05K3/32H05K3/36
    • H01R4/04G02F1/1345H05K3/323G02F1/1339G02F1/13452H01R12/57H05K2201/0221H05K2201/0224H05K2201/0233H05K2201/09036H05K2201/10681H05K3/361
    • In a conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch, a conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles in the planar direction are not broken and remain as they are. In this conductive connecting structure, even if the ratio of fine connecting particles is increased, and adjacent fine connecting particles are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness.
    • 在用于电连接具有以小间距布置的多个连接端子的第一和第二电子部件的导电连接结构中,在第一和第二电子部件的多个连接端子之间插入导电粘接剂。 通过在绝缘粘合剂中混合多个细连接颗粒来制备导电剂。 每个细连接颗粒被设计成使得在其表面上形成有镀层的细导电颗粒或细绝缘颗粒被由热压接合断裂的材料构成的绝缘层覆盖。 当导电粘合剂在第一和第二电子部件的连接端子之间经受热压接时,由各个精细连接端子推动的细连接颗粒的部分被破坏。 然而,平面方向上的细连接颗粒的绝缘层不会断裂并保持原样。 在该导电连接结构中,即使细连接粒子的比例增加,相邻的细连接粒子彼此接触,也可以在平面方向上保持绝缘性,而仅在厚度方向上获得传导 。