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    • 2. 发明授权
    • Semiconductor light-emitting devices
    • 半导体发光器件
    • US06278137B1
    • 2001-08-21
    • US09035333
    • 1998-03-05
    • Kenji ShimoyamaNobuyuki HosoiKatsushi FujiiAtsunori YamauchiHideki GotohYoshihito Sato
    • Kenji ShimoyamaNobuyuki HosoiKatsushi FujiiAtsunori YamauchiHideki GotohYoshihito Sato
    • H01L3300
    • H01L33/30H01S5/3211H01S5/32325
    • The present invention provides a semiconductor light-emitting device including a first clad layer comprising a first conductive type of AlGaAsP compound, a second clad layer that is located next to the first clad layer, comprises a first conductive type of AlGaInP compound and has a thickness of up to 0.5 &mgr;m, an active layer that is located next to the second clad layer and comprises a first or second conductive type AlGaInP or GaInP, a third clad layer that is located next to the active layer, comprises a second conductive type of AlGaInP compound and has a thickness of up to 0.5 &mgr;m, and a fourth clad layer that is located next to the third clad layer and comprises a second conductive type of AlGaAsP compound, and/or a light-extracting layer that comprises a second conductive type AlGaP or GaP and has a thickness of 1 &mgr;m to 100 &mgr;m.
    • 本发明提供一种半导体发光器件,包括:第一覆盖层,包括第一导电类型的AlGaAsP化合物,位于第一覆盖层旁边的第二覆盖层,包括第一导电型AlGaInP化合物, 高达0.5μm的有源层,位于第二覆盖层的旁边并且包括第一或第二导电型AlGaInP或GaInP,位于有源层旁边的第三覆盖层包括第二导电类型的AlGaInP 并且具有高达0.5μm的厚度,以及位于第三覆盖层旁边并且包括第二导电型AlGaAsP化合物的第四覆盖层和/或包含第二导电型AlGaP的光提取层 或GaP,并且具有1μm至100μm的厚度。