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1. 发明授权

US08193633B2 Heat conductive sheet and method for producing same, and powder module 有权
标题翻译：导热片及其制造方法和粉末组件
公开(公告)号：US08193633B2
公开(公告)日：2012-06-05
申请号：US12675549
申请日：2008-09-12
申请人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
发明人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
IPC分类号： H01L23/34 , H01L23/10
CPC分类号： H01L23/3737 , F28F2013/006 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2924/01019 , H01L2924/181 , Y10T29/4935 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.
摘要翻译：提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有大于20体积％的二次聚集粒子各自具有50μm以上的粒径。导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

2. 发明申请

US20100226095A1 HEAT CONDUCTIVE SHEET AND POWER MODULE 有权
标题翻译：热传导片和功率模块
公开(公告)号：US20100226095A1
公开(公告)日：2010-09-09
申请号：US12675549
申请日：2008-09-12
申请人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
发明人： Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
IPC分类号： H05K7/20 , F28F7/00 , B21D53/02
CPC分类号： H01L23/3737 , F28F2013/006 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2924/01019 , H01L2924/181 , Y10T29/4935 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.
摘要翻译：提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有大于20体积％的二次聚集粒子各自具有50μm以上的粒径。导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

3. 发明授权

US08236666B2 Semiconductor device and process for producing same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08236666B2
公开(公告)日：2012-08-07
申请号：US12664751
申请日：2007-12-05
申请人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
发明人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
IPC分类号： H01L21/00 , H01L21/46 , H01L21/30
CPC分类号： H01L23/3737 , H01L23/16 , H01L23/3121 , H01L23/3735 , H01L23/5386 , H01L23/562 , H01L2224/48091 , H01L2924/09701 , H01L2924/19107 , H05K1/056 , H05K3/041 , H05K3/202 , H05K3/44 , H05K2201/0209 , H05K2201/09745 , H05K2201/09881 , H01L2924/00014
摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.
摘要翻译：提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。该半导体器件的绝缘性和可靠性优异。

4. 发明申请

US20100201002A1 SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100201002A1
公开(公告)日：2010-08-12
申请号：US12664751
申请日：2007-12-05
申请人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
发明人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
IPC分类号： H01L23/36 , H01L21/58 , H01L23/31
CPC分类号： H01L23/3737 , H01L23/16 , H01L23/3121 , H01L23/3735 , H01L23/5386 , H01L23/562 , H01L2224/48091 , H01L2924/09701 , H01L2924/19107 , H05K1/056 , H05K3/041 , H05K3/202 , H05K3/44 , H05K2201/0209 , H05K2201/09745 , H05K2201/09881 , H01L2924/00014
摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.
摘要翻译：提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。该半导体器件的绝缘性和可靠性优异。

5. 发明授权

US09029438B2 Thermosetting resin composition, B-stage heat conductive sheet, and power module 有权
标题翻译：热固性树脂组合物，B级导热片和电源模块
公开(公告)号：US09029438B2
公开(公告)日：2015-05-12
申请号：US13576065
申请日：2010-12-28
申请人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
发明人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
IPC分类号： C08G59/40 , C08K3/10 , H01L23/373 , H01L25/07 , H01L23/495 , H01L23/00
CPC分类号： C08K3/10 , H01L23/3737 , H01L23/49568 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 μm to 80 μm. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
摘要翻译：提供一种包含无机填料和热固性树脂基质组分的热固性树脂组合物，其中无机填料包括由鳞状氮化硼的初级颗粒形成的二次烧结颗粒，并且至少一些二次烧结颗粒各自具有最大空腔直径为5μm〜80μm。热固性树脂组合物可用于提供通过控制诸如空隙和裂纹等缺陷及其尺寸的缺陷而导致电绝缘性能并且具有优异导热性的导热片。

6. 发明申请

US20130012621A1 THERMOSETTING RESIN COMPOSITION, B-STAGE HEAT CONDUCTIVE SHEET, AND POWER MODULE 有权
标题翻译：热固性树脂组合物，B级导热片和电源模块
公开(公告)号：US20130012621A1
公开(公告)日：2013-01-10
申请号：US13576065
申请日：2010-12-28
申请人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
发明人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
IPC分类号： C08L63/02 , C08L63/00 , C08L79/08 , C08L71/10 , C08L79/04 , C08L83/00 , C08K3/38 , C08L67/00
CPC分类号： C08K3/10 , H01L23/3737 , H01L23/49568 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 μm to 80 μm. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
摘要翻译：提供一种包含无机填料和热固性树脂基质组分的热固性树脂组合物，其中无机填料包括由鳞状氮化硼的初级颗粒形成的二次烧结颗粒，并且至少一些二次烧结颗粒各自具有最大空腔直径为5μm〜80μm。热固性树脂组合物可用于提供通过控制诸如空隙和裂纹等缺陷及其尺寸的缺陷而导致电绝缘性能并且具有优异导热性的导热片。

7. 发明申请

US20120039045A1 POWER MODULE AND METHOD FOR DETECTING INSULATION DEGRADATION THEREOF 审中-公开
标题翻译：用于检测其绝缘降解的功率模块和方法
公开(公告)号：US20120039045A1
公开(公告)日：2012-02-16
申请号：US13265446
申请日：2010-04-01
申请人： Xiaohong Yin , Takashi Nishimura , Kei Yamamoto , Kazuhiro Tada , Tatsuya Okuda , Takeshi Oi
发明人： Xiaohong Yin , Takashi Nishimura , Kei Yamamoto , Kazuhiro Tada , Tatsuya Okuda , Takeshi Oi
IPC分类号： H05K7/20
CPC分类号： G01R31/129 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01004 , H01L2924/01077 , H01L2924/01087 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A method and device for detecting insulation degradation of a power module, which detects, in advance, degradation of an insulating sheet based on a current change immediately before breakdown of an insulation characteristic from a current value of a current flowing through the insulating sheet, thereby detecting a failure of a power module caused by the degradation of insulation. The device includes: a current detector sampling and detecting a current value of a current flowing through an insulating sheet of the power module at a predetermined time interval; a calculator determining, based on the current value, a state in which the insulation characteristic of the insulating sheet is so degraded that the breakdown is imminent, and outputting a degradation determination result of YES when it is determined that the insulating sheet is in the state immediately before the breakdown; a current storage storing a current value i(n−1) at a previous sampling time point; and an alarm generating an alarm in response to the degradation determination result of YES. The calculator outputs the degradation determination result of YES when a present current value in exceeds ten times the previous current value i(n−1).
摘要翻译：一种用于检测功率模块的绝缘劣化的方法和装置，其预先根据绝缘特性从流过绝缘片的电流的当前值立即根据电流变化检测绝缘片，从而检测由绝缘劣化引起的电源模块的故障。该装置包括：电流检测器，以预定的时间间隔对流过功率模块的绝缘片的电流的电流值进行采样和检测; 基于当前值，计算器确定绝缘片的绝缘特性劣化的状态，使得击穿即将发生，并且当确定绝缘片处于该状态时，输出劣化判定结果为“是” 紧急故障前; 存储在先前采样时间点的当前值i（n-1）的当前存储器; 以及响应于劣化判定结果为“是”而产生警报的报警。当当前值超过前一个当前值i（n-1）的十倍时，计算器输出劣化判定结果为“是”。

8. 发明申请

US20130306991A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20130306991A1
公开(公告)日：2013-11-21
申请号：US13980692
申请日：2011-04-22
申请人： Mamoru Terai , Seiki Hiramatsu , Tatsuo Ota , Hiroya Ikuta , Takashi Nishimura
发明人： Mamoru Terai , Seiki Hiramatsu , Tatsuo Ota , Hiroya Ikuta , Takashi Nishimura
IPC分类号： H01L23/28 , H01L29/16
CPC分类号： H01L23/28 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4903 , H01L2224/73265 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00014 , H01L2924/2076 , H01L2924/00012
摘要： A semiconductor device includes: a semiconductor-element substrate in which a front-surface electrode pattern is formed on a surface of an insulating substrate and a back-surface electrode is formed on another surface; semiconductor elements affixed to the surface of the front-surface electrode pattern opposite the insulating substrate; and a sealing resin member which covers the semiconductor element and the semiconductor-element substrate, wherein at a position of the front-surface electrode pattern where the position has potential equivalent to that of the front-surface electrode pattern at a position where a semiconductor element is bonded, an insulating terminal table formed with a conductive relay terminal and an insulating member that insulates the relay terminal and the front-surface electrode pattern from each other are provided, and wiring from the semiconductor element to the outside is led out via the relay terminal.
摘要翻译：半导体器件包括：在绝缘基板的表面上形成有前表面电极图案和在其他表面上形成背面电极的半导体元件基板; 固定在与绝缘基板相对的前表面电极图案表面的半导体元件; 以及覆盖半导体元件和半导体元件基板的密封树脂部件，其中，在前表面电极图案的位置具有与前表面电极图案的电位相当的电位的位置，在半导体元件设置有形成有导电继电器端子和绝缘构件的绝缘端子台，其使继电器端子和前表面电极图案彼此绝缘，并且从半导体元件到外部的布线经由继电器引出终奌站。

9. 发明授权

US09153512B2 Semiconductor device with an insulating terminal table 有权
标题翻译：具有绝缘端子台的半导体器件
公开(公告)号：US09153512B2
公开(公告)日：2015-10-06
申请号：US13980692
申请日：2011-04-22
申请人： Mamoru Terai , Seiki Hiramatsu , Tatsuo Ota , Hiroya Ikuta , Takashi Nishimura
发明人： Mamoru Terai , Seiki Hiramatsu , Tatsuo Ota , Hiroya Ikuta , Takashi Nishimura
IPC分类号： H01L23/28 , H01L29/16 , H01L25/07 , H01L25/18
CPC分类号： H01L23/28 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4903 , H01L2224/73265 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00014 , H01L2924/2076 , H01L2924/00012
摘要： A semiconductor device includes: a semiconductor-element substrate in which a front-surface electrode pattern is formed on a surface of an insulating substrate and a back-surface electrode is formed on another surface; semiconductor elements affixed to the surface of the front-surface electrode pattern opposite the insulating substrate; and a sealing resin member which covers the semiconductor element and the semiconductor-element substrate, wherein at a position of the front-surface electrode pattern where the position has potential equivalent to that of the front-surface electrode pattern at a position where a semiconductor element is bonded, an insulating terminal table formed with a conductive relay terminal and an insulating member that insulates the relay terminal and the front-surface electrode pattern from each other are provided, and wiring from the semiconductor element to the outside is led out via the relay terminal.
摘要翻译：半导体器件包括：在绝缘基板的表面上形成有前表面电极图案和在其他表面上形成背面电极的半导体元件基板; 固定在与绝缘基板相对的前表面电极图案表面的半导体元件; 以及覆盖半导体元件和半导体元件基板的密封树脂部件，其中，在前表面电极图案的位置具有与前表面电极图案的电位相当的电位的位置，在半导体元件设置有形成有导电继电器端子和绝缘构件的绝缘端子台，其使继电器端子和前表面电极图案彼此绝缘，并且从半导体元件到外部的布线经由继电器引出终奌站。

10. 发明授权

US09205111B2 Process for producing engineered targeted T cell and medicine 有权
标题翻译：生产工程化靶向T细胞和药物的方法
公开(公告)号：US09205111B2
公开(公告)日：2015-12-08
申请号：US10583860
申请日：2004-12-22
申请人： Takashi Nishimura , Masaki Yasukawa
发明人： Takashi Nishimura , Masaki Yasukawa
IPC分类号： C12N5/00 , C12N5/08 , C12N15/63 , C07H21/04 , A01N63/00 , A61K39/395 , A61K48/00 , A61K35/26 , A61K39/00 , C12N5/0783 , C12N15/85 , C12N5/16
CPC分类号： A61K35/26 , A61K39/0011 , A61K39/395 , A61K2039/5156 , C07H21/04 , C12N5/0636 , C12N5/16 , C12N15/63 , C12N15/85
摘要： A novel process for preparing tumor-specific T cells is disclosed. According to the invention, antitumor-active, tumor-specific T cells are prepared by transducing a TCR gene from a tumor-specific CTL into antitumor-active T cells that have been nonspecifically activated, thus enabling tumor-specific cellular immunotherapy to be carried out from even small amounts of blood. MHC class I-restricted, tumor-specific Th cells are obtained by the method, allowing for the production of cells that react with tumor cells expressing an MHC class I molecule and show a helper activity and an antitumor activity.
摘要翻译：公开了一种制备肿瘤特异性T细胞的新方法。根据本发明，通过将来自肿瘤特异性CTL的TCR基因转导至非特异性激活的抗肿瘤活性T细胞来制备抗肿瘤活性的肿瘤特异性T细胞，从而能够进行肿瘤特异性细胞免疫治疗从少量的血液。通过该方法获得MHC I类限制性肿瘤特异性Th细胞，允许产生与表达MHC I类分子的肿瘤细胞反应并显示辅助活性和抗肿瘤活性的细胞。

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