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    • 2. 发明授权
    • Expandable ABS resin beads and process for producing the same
    • 可膨胀的ABS树脂珠及其制造方法
    • US5837740A
    • 1998-11-17
    • US531603
    • 1995-09-21
    • Kenji HaraguchiTakanori SuzukiYoshinari Itoh
    • Kenji HaraguchiTakanori SuzukiYoshinari Itoh
    • C08J9/18
    • C08J9/18C08J2355/02Y10T428/249989Y10T428/2998
    • Expandable ABS resin beads containing a volatile blowing agent are disclosed which have an internal-water content of 5% by weight or lower and, when expanded in an expansion ratio of 30, give expanded beads each having a non-expanded surface layer having a thickness of not more than 50 .mu.m. A process for producing the expandable ABS resin beads is also disclosed which comprises dispersing ABS resin beads into an aqueous medium in a closed vessel and impregnating a volatile blowing agent into the ABS resin beads, said aqueous medium containing an electrolyte at least during the impregnation of the volatile blowing agent, with the concentration of the electrolyte in the aqueous medium being from 0.01 to 2 mol/l. The expandable resin beads are capable of giving an expanded molded article excellent in chemical resistance and toughness and especially in surface appearance and heat resistance.
    • 公开了含有挥发性发泡剂的可发性ABS树脂珠,其内含水量为5重量%以下,当以30的发泡倍率膨胀时,得到各自具有非发泡表面层的发泡珠,其厚度为 不超过50亩。 还公开了一种用于生产可膨胀ABS树脂珠粒的方法,其包括将ABS树脂珠粒分散在密闭容器中的水性介质中,并将挥发性发泡剂浸渍到ABS树脂珠粒中,所述水性介质至少在浸渍期间含有电解质 挥发性发泡剂,水介质中电解质的浓度为0.01〜2mol / l。 可膨胀树脂珠能够赋予耐化学性和韧性优异,特别是表面外观和耐热性优异的发泡成型体。
    • 3. 发明授权
    • Expandable styrene resin beads and process for producing the same
    • 可发性苯乙烯树脂珠及其制造方法
    • US5693683A
    • 1997-12-02
    • US699823
    • 1996-08-19
    • Hiroki ShinozakiMasayuki TanakaYonezo UedaTakanori Suzuki
    • Hiroki ShinozakiMasayuki TanakaYonezo UedaTakanori Suzuki
    • C08F2/18C08F12/00C08J9/00C08J9/20
    • C08J9/0061C08J9/20C08J2325/00C08J2433/00
    • An expandable styrene resin bead containing voids therein, wherein the number of the voids present in the area from the surface of the bead to a depth of 0.1 mm along the radial direction is not more than 100 per mm.sup.2 as counted on a cross section passing through approximately the center of the bead. A process for producing expandable styrene resin beads by suspension polymerization is also disclosed in which a styrene monomer is suspended in an aqueous medium in the presence of an initiator and a suspending agent, and a blowing agent is incorporated into polymer beads produced, wherein an alkali metal salt or ammonium salt of persulfuric acid is added to the reaction system in an amount of 0.5 to 30 ppm based on the aqueous medium while the degree of conversion of said monomer is in the range of from 0 to 30%, and an electrolyte is added to the reaction system in a concentration of 0.02 to 5.0 mol/l based on the aqueous medium when the degree of conversion is 30% or higher. The expandable styrene resin bead does not require aging and, when pre-expanded, show little variation in the state of the cells, i.e., expandable styrene resin beads which hardly undergo influences of storage conditions.
    • 在其中含有空隙的可膨胀苯乙烯树脂珠,其中存在于从珠粒表面到沿径向方向0.1mm深度的区域中的空隙数不超过每mm 2 100个, 大约是珠的中心。 还公开了通过悬浮聚合制备可发性苯乙烯树脂珠的方法,其中在引发剂和悬浮剂存在下将苯乙烯单体悬浮在水性介质中,并将发泡剂引入所制备的聚合物珠中,其中碱 过硫酸的金属盐或铵盐以相对于水性介质为0.5〜30ppm的量添加到反应体系中,而所述单体的转化率为0〜30%,电解质为 当转化率为30%以上时,基于水性介质,以0.02〜5.0mol / l的浓度添加到反应体系中。 可发性苯乙烯树脂珠不需要老化,并且当预扩展时,细胞状态几乎没有变化,即几乎不受储存条件影响的可发性苯乙烯树脂珠。
    • 7. 发明申请
    • IMAGE PICKUP MODULE AND CAMERA
    • 图像拾取模块和摄像机
    • US20120044415A1
    • 2012-02-23
    • US13212935
    • 2011-08-18
    • Koji TsudukiShin HasegawaTadashi KosakaYasuhiro MatsukiTakanori SuzukiAkiya Nakayama
    • Koji TsudukiShin HasegawaTadashi KosakaYasuhiro MatsukiTakanori SuzukiAkiya Nakayama
    • H04N5/225H01L27/146
    • H01L27/14618H01L27/14636H01L2224/13H04N5/2253
    • An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.
    • 图像拾取模块包括盖构件,包括光电二极管的图像拾取装置芯片,布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件,布置在侧面的重新布线基板 与图像拾取装置芯片的盖构件相对的连接构件,用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件,图像拾取装置芯片和固定构件包围的空间。 图像拾取器件芯片包括半导体衬底。 半导体衬底包括穿透衬底的通孔电极。 当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时,通孔电极和连接构件布置在固定区域中。
    • 8. 发明申请
    • SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP DEVICE
    • 固态图像拾取器件和图像拾取器件
    • US20110205414A1
    • 2011-08-25
    • US13033376
    • 2011-02-23
    • Katsuhisa MochidukiTakanori SuzukiFujio Ito
    • Katsuhisa MochidukiTakanori SuzukiFujio Ito
    • H04N5/335H01L31/0203
    • H01L27/14618H01L2924/0002H04N5/335H01L2924/00
    • A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident.
    • 一种固态摄像装置,包括:树脂封装,其包括凹部; 设置在所述凹部中的固态图像拾取元件; 以及通过固定构件固定到所述凹部的盖,以覆盖所述固态图像拾取元件,其中:所述树脂封装包括与其一体化的基板; 所述基板包括第一突出部分,第二突出部分和分支部分,所述第一和第二突出部分从所述树脂封装的第一侧突出,并且所述分支部分设置在所述树脂封装内部并且设置在所述第一和第二突出部分之间 突出部分 并且当从光入射的方向观察时,所述固定构件的外周部设置在所述分支部的端部的内侧。
    • 9. 发明申请
    • JOINING METHOD FOR METAL MEMBERS
    • 金属成员接合方法
    • US20100264199A1
    • 2010-10-21
    • US12799066
    • 2010-04-16
    • Taisei WakisakaTakanori SuzukiTokuji Okumura
    • Taisei WakisakaTakanori SuzukiTokuji Okumura
    • B23K1/20
    • B23K1/19B23K35/282B23K2103/20
    • The present invention provides a joining method for metal members, including: preparing an Fe-based metal member of Fe-based material, and an Al-based metal member of Al-based material; providing a Zn-based brazing filler metal between the Fe-based metal member and the Al-based metal member; and joining the Fe-based metal member and the Al-based metal member, wherein the Zn-based brazing filler metal includes: 2.0 mass % or less of Al; and the balance of Zn and inevitable impurities, and in the joining, the Zn-based brazing filler metal is heated such that a liquid phase of the Zn-based brazing filler metal is generated, and in solidification of the Zn-based brazing filler metal in a condition of the liquid phase, Zn primary crystal or eutectic of Zn and Al is crystallized.
    • 本发明提供一种金属构件的接合方法,包括:制备Fe基材料的Fe基金属构件和Al基材料的Al基金属构件; 在Fe基金属构件和Al基金属构件之间提供Zn基钎料; 并且接合Fe基金属构件和Al基金属构件,其中所述Zn基钎料包括:2.0质量%以下的Al; 并且Zn和不可避免的杂质的平衡,并且在接合时,加热Zn基钎料,使得Zn系钎料的液相产生,并且在Zn系钎焊金属 在液相状态下,Zn原子晶或Zn和Al的共晶结晶化。