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1. 发明申请

US20090209175A1 Polishing apparatus and substrate processing method 有权
标题翻译：抛光装置和基板处理方法
公开(公告)号：US20090209175A1
公开(公告)日：2009-08-20
申请号：US11631417
申请日：2005-07-21
申请人： Kenichiro Saito , Akihiro Yazawa , Masanori Sasaki , Takashi Mitsuya
发明人： Kenichiro Saito , Akihiro Yazawa , Masanori Sasaki , Takashi Mitsuya
IPC分类号： B24B49/12 , B24B37/04 , B24B7/20
CPC分类号： B24B37/0053 , B24B49/12
摘要： A polishing apparatus can detect escape of a substrate from a top ring during polishing. The polishing apparatus including: a polishing table (10) having a polishing pad (11); a top ring (21); and a substrate escape detection section for detecting escape of the substrate from the top ring, including a light irradiation member (26) for irradiating an area of the upper surface of the polishing pad with light, a controller (32) for controlling the light irradiation of the light irradiation member, an image-taking member (27) for taking an image of the area irradiated with the light, and an information processing member (31) for processing information outputted from the image-taking member, wherein said controller controls the light irradiation member in such a manner that it performs light irradiation at least for a period of time during which the substrate is regarded as being in contact with the polishing pad.
摘要翻译：抛光装置可以在抛光期间检测衬底从顶环的逸出。该抛光装置包括：抛光台（10），具有抛光垫（11）; 顶环（21）; 以及用于检测基板从顶环脱落的基板逃逸检测部，包括用于用光照射抛光垫的上表面的区域的光照射部件（26），用于控制光照射的控制器（32），用于拍摄照射光的区域的图像的摄像部件（27）和用于处理从摄像部件输出的信息的信息处理部件（31），其中所述控制器控制光照射部件至少在基板被认为与抛光垫接触的时间段内进行光照射。

2. 发明授权

US08128458B2 Polishing apparatus and substrate processing method 有权
标题翻译：抛光装置和基板处理方法
公开(公告)号：US08128458B2
公开(公告)日：2012-03-06
申请号：US11631417
申请日：2005-07-21
申请人： Kenichiro Saito , Akihiro Yazawa , Masanori Sasaki , Takashi Mitsuya
发明人： Kenichiro Saito , Akihiro Yazawa , Masanori Sasaki , Takashi Mitsuya
IPC分类号： B24B49/00
CPC分类号： B24B37/0053 , B24B49/12
摘要： A polishing apparatus detects the escape of a substrate from a top ring during polishing. The polishing apparatus includes a polishing table having a polishing pad, a top ring, and a substrate escape detection section for detecting escape of the substrate from the top ring. The detection section includes a light irradiation member for irradiating an area of the upper surface of the polishing pad with light, a controller for controlling the light irradiation of the light irradiation member, an image-taking member for taking an image of the area irradiated with the light, and an information processing member for processing information outputted from the image-taking member. The controller controls the light irradiation member in such a manner that it performs light irradiation at least for a period of time during which the substrate is regarded as being in contact with the polishing pad.
摘要翻译：抛光装置在抛光期间检测衬底从顶环的逸出。抛光装置包括具有抛光垫，顶环和用于检测基板从顶环的逸出的基板逸出检测部的抛光台。检测部分包括用于用光照射抛光垫的上表面的区域的光照射部件，用于控制光照射部件的光照射的控制器，用于拍摄被照射的区域的图像的摄像部件光，以及用于处理从摄像部件输出的信息的信息处理部件。控制器控制光照射部件，使得其至少在基板被认为与抛光垫接触的时间段内进行光照射。

3. 发明申请

US20110306274A1 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20110306274A1
公开(公告)日：2011-12-15
申请号：US13216576
申请日：2011-08-24
申请人： Tatsuya SASAKI , Naoshi Yamada , Yoshifumi Katsumata , Noburu Shimizu , Seiryo Tsuno , Takashi Mitsuya
发明人： Tatsuya SASAKI , Naoshi Yamada , Yoshifumi Katsumata , Noburu Shimizu , Seiryo Tsuno , Takashi Mitsuya
IPC分类号： B24B49/00
CPC分类号： B24B49/03 , B24B37/042 , H01L21/3212
摘要： A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.
摘要翻译：抛光装置具有：抛光部（302），被配置为对基板进行抛光;以及测量部（307），被配置为测量形成在基板上的膜的厚度。抛光装置还具有被配置为输入形成在待抛光的基板上的膜的期望厚度的接口（310）和被配置为在其中至少一个过去的基板上存储抛光速率数据的存储装置（308a）。抛光装置包括运算单元（308b），其通过使用加权平均法来计算抛光速率和基于抛光速率数据和期望厚度的最佳抛光时间，该加权平均法将抛光速率数据加权到最近抛光的基底上。

4. 发明授权

US08550875B2 Method of operating substrate processing apparatus and substrate processing apparatus 有权
公开(公告)号：US08550875B2
公开(公告)日：2013-10-08
申请号：US13474898
申请日：2012-05-18
申请人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
发明人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
IPC分类号： B24B49/00
CPC分类号： H01L21/67751 , B24B37/345
摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.

5. 发明授权

US08025759B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08025759B2
公开(公告)日：2011-09-27
申请号：US10559815
申请日：2004-07-01
申请人： Tatsuya Sasaki , Naoshi Yamada , Yoshifumi Katsumata , Noburu Shimizu , Seiryo Tsuno , Takashi Mitsuya
发明人： Tatsuya Sasaki , Naoshi Yamada , Yoshifumi Katsumata , Noburu Shimizu , Seiryo Tsuno , Takashi Mitsuya
IPC分类号： H01L21/304 , B24B37/04
CPC分类号： B24B49/03 , B24B37/042 , H01L21/3212
摘要： A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.
摘要翻译：抛光装置具有：抛光部（302），被配置为对基板进行抛光;以及测量部（307），被配置为测量形成在基板上的膜的厚度。抛光装置还具有被配置为输入形成在待抛光的基板上的膜的期望厚度的接口（310）和被配置为在其中至少一个过去的基板上存储抛光速率数据的存储装置（308a）。抛光装置包括运算单元（308b），其通过使用加权平均法来计算抛光速率和基于抛光速率数据和期望厚度的最佳抛光时间，该加权平均法将抛光速率数据加权到最近抛光的基底上。

6. 发明申请

US20060166503A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20060166503A1
公开(公告)日：2006-07-27
申请号：US10559815
申请日：2004-07-01
申请人： Tatsuya Sasaki , Naoshi Yamada , Yoshifumi Katsumata , Noburu Shimizu , Seiryo Tsuno , Takashi Mitsuya
发明人： Tatsuya Sasaki , Naoshi Yamada , Yoshifumi Katsumata , Noburu Shimizu , Seiryo Tsuno , Takashi Mitsuya
IPC分类号： B24B49/00 , H01L21/461 , B24B51/00
CPC分类号： B24B49/03 , B24B37/042 , H01L21/3212
摘要： A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.
摘要翻译：抛光装置具有：抛光部（302），被配置为对基板进行抛光;以及测量部（307），被配置为测量形成在基板上的膜的厚度。抛光装置还具有接口（310），其被配置为输入形成在待抛光的基板上的膜的期望厚度;以及存储装置（308a），被配置为将抛光速率数据存储在其中的至少一个过去的基板上。抛光装置包括运算单元（308b），其通过使用加权平均法来计算基于抛光速率数据和期望厚度的抛光速率和最佳抛光时间，该加权平均法将抛光速率数据加权到最近抛光的基底上。

7. 发明授权

US08398811B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08398811B2
公开(公告)日：2013-03-19
申请号：US13216576
申请日：2011-08-24
申请人： Tatsuya Sasaki , Naoshi Yamada , Yoshifumi Katsumata , Noburu Shimizu , Seiryo Tsuno , Takashi Mitsuya
发明人： Tatsuya Sasaki , Naoshi Yamada , Yoshifumi Katsumata , Noburu Shimizu , Seiryo Tsuno , Takashi Mitsuya
IPC分类号： B24B49/00
CPC分类号： B24B49/03 , B24B37/042 , H01L21/3212
摘要： A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.
摘要翻译：抛光装置具有：抛光部（302），被配置为对基板进行抛光;以及测量部（307），被配置为测量形成在基板上的膜的厚度。抛光装置还具有被配置为输入形成在待抛光的基板上的膜的期望厚度的接口（310）和被配置为在其中至少一个过去的基板上存储抛光速率数据的存储装置（308a）。抛光装置包括运算单元（308b），其通过使用加权平均法来计算抛光速率和基于抛光速率数据和期望厚度的最佳抛光时间，该加权平均法将抛光速率数据加权到最近抛光的基底上。

8. 发明申请

US20120231703A1 METHOD OF OPERATING SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：基板加工装置和基板加工装置的操作方法
公开(公告)号：US20120231703A1
公开(公告)日：2012-09-13
申请号：US13474898
申请日：2012-05-18
申请人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
发明人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
IPC分类号： B24B51/00
CPC分类号： H01L21/67751 , B24B37/345
摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.
摘要翻译：一种操作基板处理装置的方法，在装置中发生非致命故障时，使得可以继续进行基板的部分装置操作以清洁和恢复基板或者容易地从装置排出基板，而不停止整个设备，从而降低了衬底变得不可处理的风险。操作具有研磨部，清洗部和转印机构的基板处理装置的方法包括：根据所述部位，在检测到所述研磨部，所述清洗部和所述转印机构中的任何一个的故障的情况下对基板进行分类的故障和基板在基板处理装置中的位置; 并且在检测到故障之后对每个基板执行操作，该操作根据基板的分类而变化。

9. 发明授权

US08202139B2 Method of operating substrate processing apparatus and substrate processing apparatus 有权
标题翻译：操作基板处理装置和基板处理装置的方法
公开(公告)号：US08202139B2
公开(公告)日：2012-06-19
申请号：US12320251
申请日：2009-01-22
申请人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
发明人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
IPC分类号： B24B49/00
CPC分类号： H01L21/67751 , B24B37/345
摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.
摘要翻译：一种操作基板处理装置的方法，在装置中发生非致命故障时，使得可以继续进行基板的部分装置操作以清洁和恢复基板或者容易地从装置排出基板，而不停止整个设备，从而降低了衬底变得不可处理的风险。操作具有研磨部，清洗部和转印机构的基板处理装置的方法包括：根据所述部位，在检测到所述研磨部，所述清洗部和所述转印机构中的任何一个的故障的情况下对基板进行分类的故障和基板在基板处理装置中的位置; 并且在检测到故障之后对每个基板执行操作，该操作根据基板的分类而变化。

10. 发明申请

US20090186557A1 Method of operating substrate processing apparatus and substrate processing apparatus 有权
标题翻译：操作基板处理装置和基板处理装置的方法
公开(公告)号：US20090186557A1
公开(公告)日：2009-07-23
申请号：US12320251
申请日：2009-01-22
申请人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
发明人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
IPC分类号： B24B1/00 , B08B7/00
CPC分类号： H01L21/67751 , B24B37/345
摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.
摘要翻译：一种操作基板处理装置的方法，在装置中发生非致命故障时，使得可以继续进行基板的部分装置操作以清洁和恢复基板或者容易地从装置排出基板，而不停止整个设备，从而降低了衬底变得不可处理的风险。操作具有研磨部，清洗部和转印机构的基板处理装置的方法包括：根据所述部位，在检测到所述研磨部，所述清洗部和所述转印机构中的任何一个的故障的情况下对基板进行分类的故障和基板在基板处理装置中的位置; 并且在检测到故障之后对每个基板执行操作，该操作根据基板的分类而变化。

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