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1. 发明授权

US08550875B2 Method of operating substrate processing apparatus and substrate processing apparatus 有权
公开(公告)号：US08550875B2
公开(公告)日：2013-10-08
申请号：US13474898
申请日：2012-05-18
申请人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
发明人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
IPC分类号： B24B49/00
CPC分类号： H01L21/67751 , B24B37/345
摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.

2. 发明申请

US20120231703A1 METHOD OF OPERATING SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：基板加工装置和基板加工装置的操作方法
公开(公告)号：US20120231703A1
公开(公告)日：2012-09-13
申请号：US13474898
申请日：2012-05-18
申请人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
发明人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
IPC分类号： B24B51/00
CPC分类号： H01L21/67751 , B24B37/345
摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.
摘要翻译：一种操作基板处理装置的方法，在装置中发生非致命故障时，使得可以继续进行基板的部分装置操作以清洁和恢复基板或者容易地从装置排出基板，而不停止整个设备，从而降低了衬底变得不可处理的风险。操作具有研磨部，清洗部和转印机构的基板处理装置的方法包括：根据所述部位，在检测到所述研磨部，所述清洗部和所述转印机构中的任何一个的故障的情况下对基板进行分类的故障和基板在基板处理装置中的位置; 并且在检测到故障之后对每个基板执行操作，该操作根据基板的分类而变化。

3. 发明授权

US08202139B2 Method of operating substrate processing apparatus and substrate processing apparatus 有权
标题翻译：操作基板处理装置和基板处理装置的方法
公开(公告)号：US08202139B2
公开(公告)日：2012-06-19
申请号：US12320251
申请日：2009-01-22
申请人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
发明人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
IPC分类号： B24B49/00
CPC分类号： H01L21/67751 , B24B37/345
摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.
摘要翻译：一种操作基板处理装置的方法，在装置中发生非致命故障时，使得可以继续进行基板的部分装置操作以清洁和恢复基板或者容易地从装置排出基板，而不停止整个设备，从而降低了衬底变得不可处理的风险。操作具有研磨部，清洗部和转印机构的基板处理装置的方法包括：根据所述部位，在检测到所述研磨部，所述清洗部和所述转印机构中的任何一个的故障的情况下对基板进行分类的故障和基板在基板处理装置中的位置; 并且在检测到故障之后对每个基板执行操作，该操作根据基板的分类而变化。

4. 发明申请

US20090186557A1 Method of operating substrate processing apparatus and substrate processing apparatus 有权
标题翻译：操作基板处理装置和基板处理装置的方法
公开(公告)号：US20090186557A1
公开(公告)日：2009-07-23
申请号：US12320251
申请日：2009-01-22
申请人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
发明人： Hiroomi Torii , Hiroaki Nishida , Hiroyuki Kaneko , Misao Date , Takashi Mitsuya , Takamasa Nakamura
IPC分类号： B24B1/00 , B08B7/00
CPC分类号： H01L21/67751 , B24B37/345
摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.
摘要翻译：一种操作基板处理装置的方法，在装置中发生非致命故障时，使得可以继续进行基板的部分装置操作以清洁和恢复基板或者容易地从装置排出基板，而不停止整个设备，从而降低了衬底变得不可处理的风险。操作具有研磨部，清洗部和转印机构的基板处理装置的方法包括：根据所述部位，在检测到所述研磨部，所述清洗部和所述转印机构中的任何一个的故障的情况下对基板进行分类的故障和基板在基板处理装置中的位置; 并且在检测到故障之后对每个基板执行操作，该操作根据基板的分类而变化。

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