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    • 9. 发明授权
    • Adhesive tape joining apparatus
    • 胶带接合装置
    • US07661454B2
    • 2010-02-16
    • US12030062
    • 2008-02-12
    • Masayuki YamamotoNaoki Ishii
    • Masayuki YamamotoNaoki Ishii
    • B32B37/00
    • H01L21/67132Y10T156/1343Y10T156/171Y10T156/1744
    • An apparatus of this invention includes: a workpiece holding mechanism that holds a ring frame and a wafer; a tape supplying device that supplies a continuous dicing tape or a continuous carrier tape to which a precut dicing tape is joined, to a joining position; a joining unit that joins the continuous dicing tape or the precut dicing tape separated from the carrier tape, to the ring frame and the semiconductor wafer; a tape cutting mechanism that cuts the dicing tape joined to the ring frame along a contour of the ring frame; and a residual tape collecting section that takes up and collects a residual tape after the cutting.
    • 本发明的装置包括:保持环形框架和晶片的工件保持机构; 向连接位置供给连续的切割带或将预切割切割带接合的连续载带的带供给装置; 连接单元,其将连续切割带或与载带分离的预切割切割带连接到环形框架和半导体晶片; 磁带切割机构,其沿着所述环形框架的轮廓切割结合到所述环形框架的切割带; 以及在切割后采集并收集残留胶带的残留胶带收集部。