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1. 发明授权

US4406249A Apparatus for controlling electroless plating bath 失效
标题翻译：用于控制化学镀浴的设备
公开(公告)号：US4406249A
公开(公告)日：1983-09-27
申请号：US352550
申请日：1982-02-26
申请人： Ken Araki , Hiromitsu Sakai , Yutaka Sugiura
发明人： Ken Araki , Hiromitsu Sakai , Yutaka Sugiura
IPC分类号： C23C18/16 , G05D21/02 , B05D1/40 , B05D3/12
CPC分类号： G05D21/02 , C23C18/1617 , C23C18/1683 , C23C18/32 , C23C18/38 , C23C18/50
摘要： A method and an apparatus for controlling the content of an electroless plating bath such as an electroless nickel plating bath such that the bath is usable for an extended period of time without remaking are disclosed. The method comprises the steps of:continuously or intermittently measuring the concentration of at least one consumable ingredient of the electroless plating bath, andautomatically adding to the plating bath a first replenishing composition essentially consisting of the consumable ingredient after detecting that the measured value has reached a predetermined concentration; whilecontinuously or intermittently measuring one physical property of the electroless plating bath to determine the degree of aging of the bath, andautomatically discharging a predetermined volume of the plating solution and automatically adding to the plating bath a second replenishing composition containing unconsumable ingredients in an amount essentially corresponding to the lost amount by the discharging after detecting that the measured value has reached a predetermined value of the physical property.
摘要翻译：公开了一种用于控制化学镀浴的内容物的方法和装置，例如化学镀镍浴，使得浴可以延长的时间段而不需要重新制造。该方法包括以下步骤：连续或间歇地测量化学镀浴中至少一种可消耗成分的浓度，并且在检测到测量值已达到之后，自动向电镀槽中添加基本由消耗成分组成的第一补充组合物预定浓度; 同时连续地或间歇地测量化学镀浴的一个物理性质以确定浴的老化程度，并自动排出预定体积的镀液，并自动地向镀液中添加含有不可消耗的成分的第二补充组合物基本上对应于在检测到测量值达到物理特性的预定值之后通过放电的损失量。

2. 发明授权

US4406250A Apparatus for controlling electroless plating bath 失效
标题翻译：用于控制化学镀浴的设备
公开(公告)号：US4406250A
公开(公告)日：1983-09-27
申请号：US363115
申请日：1982-03-29
申请人： Ken Araki , Hiromitsu Sakai , Yutaka Sugiura
发明人： Ken Araki , Hiromitsu Sakai , Yutaka Sugiura
IPC分类号： C23C18/16 , C23C18/31 , C23C18/34 , C23C18/40 , C23C18/44 , G05D21/02 , C23C3/02
CPC分类号： C23C18/1617 , C23C18/1683 , G05D21/02
摘要： A method and an apparatus for controlling an electroless plating bath such as an electroless nickel plating bath capable of using the bath for an extended period of time without remake are disclosed. The method comprises the steps ofcontinuously or intermittently measuring the concentration of at least one consumable ingredient in the electroless plating bath, andautomatically adding to the plating bath a first replenishing composition essentially consisting of consumable ingredients after detecting that the measured value has reached a predetermined concentration; whilecontinuously or intermittently measuring the consumed amount of at least one consumable ingredient of the electroless plating bath to determine the degree of aging of the bath, andautomatically discharging the predetermined volume of the plating solution and automatically adding to the plating bath a second replenishing composition containing nonconsumable ingredients in an amount essentially corresponding to a lost amount by the discharging after detecting that the consumed amount of the consumable ingredients has reached a predetermined value.
摘要翻译：公开了一种用于控制化学镀浴的方法和装置，例如能够长时间使用浴而不进行再制造的化学镀镍浴。该方法包括以下步骤：连续或间歇地测量化学镀浴中的至少一种可消耗成分的浓度，并且在检测到测量值已经达到预定值之后，自动地向电镀槽中添加基本上由消耗成分组成的第一补充组合物浓度; 同时连续地或间歇地测量化学镀浴的至少一种消耗成分的消耗量，以确定浴的老化程度，并自动排出预定体积的镀液，并自动地向镀浴中添加第二补充组合物在检测到消耗成分的消耗量达到预定值之后，含有基本上对应于通过放电的损失量的非消耗性成分。

3. 发明授权

US4353933A Method for controlling electroless plating bath 失效
标题翻译：控制化学镀浴的方法
公开(公告)号：US4353933A
公开(公告)日：1982-10-12
申请号：US204046
申请日：1980-11-04
申请人： Ken Araki , Hiromitsu Sakai , Yutaka Sugiura
发明人： Ken Araki , Hiromitsu Sakai , Yutaka Sugiura
IPC分类号： C23C18/16 , G05D21/02 , B05D1/18
CPC分类号： G05D21/02 , C23C18/1617 , C23C18/1683 , C23C18/36 , C23C18/40
摘要： A method and an apparatus for controlling an electroless plating bath such as an electroless nickel plating bath such that the bath is useable for an extended period of time without remaking are disclosed. The method comprises the steps of:continuously or intermittently measuring the concentration of at least one consumable ingredient of the electroless plating bath, andautomatically adding to the plating bath a first replenishing composition essentially consisting of the consumable ingredient after detecting that the measured value has reached a predetermined concentration; whilecontinuously or intermittently measuring one physical property of the electroless plating bath to determine the degree of aging of the bath, andautomatically discharging a predetermined volume of the plating solution and automatically adding to the plating bath a second replenishing composition containing unconsumable ingredients in an amount essentially corresponding to the lost amount by the discharging after detecting that the measured value has reached a predetermined value of the physical property.
摘要翻译：公开了一种用于控制化学镀浴的方法和装置，例如化学镀镍浴，使得浴可长时间使用而不需要重新制造。该方法包括以下步骤：连续或间歇地测量化学镀浴中至少一种可消耗成分的浓度，并且在检测到测量值已达到之后，自动向电镀槽中添加基本由消耗成分组成的第一补充组合物预定浓度; 同时连续地或间歇地测量化学镀浴的一个物理性质以确定浴的老化程度，并自动排出预定体积的镀液，并自动地向镀液中添加含有不可消耗的成分的第二补充组合物基本上对应于在检测到测量值达到物理特性的预定值之后通过放电的损失量。

4. 发明授权

US4406248A Apparatus for controlling electroless plating bath 失效
标题翻译：用于控制化学镀浴的设备
公开(公告)号：US4406248A
公开(公告)日：1983-09-27
申请号：US352549
申请日：1982-02-26
申请人： Ken Araki , Hiromitsu Sakai , Yutaka Sugiura
发明人： Ken Araki , Hiromitsu Sakai , Yutaka Sugiura
IPC分类号： C23C18/16 , G05D21/02 , B05D1/40 , B05D3/12
CPC分类号： G05D21/02 , C23C18/1617 , C23C18/1683 , C23C18/36 , C23C18/40
摘要： A method and an apparatus for controlling the content of an electroless plating bath such as an electroless nickel plating bath such that the bath is useable for an extended period of time without remaking are disclosed. The method comprises the steps of:continuously or intermittently measuring the concentration of at least one consumable ingredient of the electroless plate bath, andautomatically adding to the plating bath a first replenishing composition essentially consisting of the consumable ingredient after detecting that the measured value has reached a predetermined concentration; whilecontinuously or intermittently measuring one physical property of the electroless plating bath to determine the degree of aging of the bath, andautomatically discharging a predetermined volume of the plating solution and automatically adding to the plating bath a second replenishing composition containing unconsumable ingredients in an amount essentially corresponding to the lost amount by the discharging after detecting that the measured value has reached a predetermined value of the physical property.
摘要翻译：公开了一种用于控制化学镀浴的含量的方法和装置，例如化学镀镍浴，使得浴可以延长的时间段而不需要重新制造。该方法包括以下步骤：连续或间歇地测量化学镀浴中的至少一种可消耗成分的浓度，并且在检测到测量值已达到之后，自动向电镀浴中添加基本由消耗成分组成的第一补充组合物预定浓度; 同时连续地或间歇地测量化学镀浴的一个物理性质以确定浴的老化程度，并自动排出预定体积的镀液，并自动地向镀液中添加含有不可消耗的成分的第二补充组合物基本上对应于在检测到测量值达到物理特性的预定值之后通过放电的损失量。

5. 发明授权

US4350717A Controlling electroless plating bath 失效
标题翻译：控制化学镀浴
公开(公告)号：US4350717A
公开(公告)日：1982-09-21
申请号：US204084
申请日：1980-11-04
申请人： Ken Araki , Hiromitsu Sakai , Yutaka Sugiura
发明人： Ken Araki , Hiromitsu Sakai , Yutaka Sugiura
IPC分类号： C23C18/16 , C23C18/31 , C23C18/34 , C23C18/40 , C23C18/44 , G05D21/02 , C23C3/02 , C23C3/00
CPC分类号： C23C18/1617 , C23C18/1683 , G05D21/02
摘要： A method and an apparatus for controlling an electroless plating bath such as an electroless nickel plating bath capable of using the bath for an extended period of time without remake are disclosed. The method comprises the steps of:continuously or intermittently measuring the concentration of at least one consumable ingredient in the electroless plating bath, andautomatically adding to the plating bath a first replenishing composition essentially consisting of consumable ingredients after detecting that the measured value has reached a predetermined concentration; whilecontinuously or intermittently measuring the consumed amount of at least one consumable ingredient of the electroless plating bath to determine the degree of aging of the bath, andautomatically discharging the predetermined volume of the plating solution and automatically adding to the plating bath a second replenishing composition containing unconsumable ingredients in an amount essentially corresponding to a lost amount by the discharging after detecting that the consumed amount of the consumable ingredients has reached a predetermined value.
摘要翻译：公开了一种用于控制化学镀浴的方法和装置，例如能够长时间使用浴而不进行再制造的化学镀镍浴。该方法包括以下步骤：连续或间歇地测量化学镀浴中的至少一种可消耗成分的浓度，并且在检测到测量值达到一定程度后，自动向电镀槽中添加基本上由消耗成分组成的第一补充组合物预定浓度; 同时连续地或间歇地测量化学镀浴的至少一种消耗成分的消耗量，以确定浴的老化程度，并自动排出预定体积的镀液，并自动地向镀浴中添加第二补充组合物在检测到消耗成分的消耗量达到预定值之后，通过排出物含有基本上对应于损失量的不消耗成分。

6. 发明授权

US5665324A Recovery of valuable substances 失效
标题翻译：回收贵重物质
公开(公告)号：US5665324A
公开(公告)日：1997-09-09
申请号：US502671
申请日：1995-07-14
申请人： Teruyoshi Izawa , Kazunori Kudo , Yoshihiro Kani , Ken Araki , Tamotsu Kato , Takashi Furui
发明人： Teruyoshi Izawa , Kazunori Kudo , Yoshihiro Kani , Ken Araki , Tamotsu Kato , Takashi Furui
IPC分类号： C02F1/58 , C01B25/32 , C01D5/00 , C01G53/00 , C02F1/62 , C23C18/31
CPC分类号： C01B25/32 , C01D5/00
摘要： Valuable substances are recovered from a spent electroless nickel plating solution containing a water-soluble nickel salt, organic complexing agent, hypophosphite, phosphite, and alkali metal ion by adding oxalic acid to the plating solution for causing a nickel ion to precipitate as nickel oxalate for removal and recovery; optionally adding a sulfide to the plating solution for causing a heavy metal ion to precipitate as a heavy metal sulfide for removal; adding a mineral acid and calcium oxide, calcium hydroxide, calcium carbonate, calcium sulfate, calcium chloride or a calcium salt of organic acid to the plating solution from which the nickel ion has been removed; firing solids of the solution in air for converting the alkali metal ion into an alkali metal salt of mineral acid, converting phosphorus into hydroxyapatite, and pyrolyzing off the organic material; and pouring a solid mixture of the alkali metal salt of mineral acid and hydroxyapatite into water for dissolving the alkali metal salt of mineral acid in water for separate recovery of hydroxyapatite and the alkali metal salt of mineral acid.
摘要翻译：从含有水溶性镍盐，有机络合剂，次磷酸盐，亚磷酸盐和碱金属离子的废化学镀镍溶液中回收贵重物质，通过向电镀液中加入草酸，使镍离子以草酸镍的形式沉淀，清除和恢复; 任选地向电镀溶液中加入硫化物，使重金属离子沉淀为重金属硫化物以除去; 向去除了镍离子的镀液中添加无机酸和氧化钙，氢氧化钙，碳酸钙，硫酸钙，氯化钙或有机酸的钙盐; 将空气中的溶液的固体烧成，将碱金属离子转化为无机酸的碱金属盐，将磷转化为羟基磷灰石，热解出有机物质; 将无机酸和羟基磷灰石的碱金属盐的固体混合物倒入水中，将无机酸的碱金属盐溶解在水中，分离回收羟基磷灰石和无机酸的碱金属盐。

7. 发明授权

US4650691A Electroless copper plating bath and method 失效
标题翻译：无电镀铜浴及方法
公开(公告)号：US4650691A
公开(公告)日：1987-03-17
申请号：US653848
申请日：1984-09-24
申请人： Akemi Kinoshita , Ken Araki , Hidemi Nawafune , Shozo Mizumoto
发明人： Akemi Kinoshita , Ken Araki , Hidemi Nawafune , Shozo Mizumoto
IPC分类号： C23C18/40
CPC分类号： C23C18/40
摘要： An electroless copper plating bath is prepared by adding both a metal-cyano-complex used as a stabilizer and an agent for complexing the metal of the metal-cyano-complex to an electroless copper plating bath containing cupric ion, an agent for complexing the cupric ion and a reducing agent, and an article to be plated is immersed in the bath.
摘要翻译：通过加入用作稳定剂的金属 - 氰基络合物和金属 - 氰基 - 络合物的金属与含有铜离子的化学镀铜浴络合剂的试剂制备化学镀铜浴，将铜离子和还原剂，将待镀制品浸入浴中。

8. 发明授权

US4541902A Analytical method for determining formaldehyde in electroless copper plating bath 失效
标题翻译：化学镀铜浴中甲醛测定的分析方法
公开(公告)号：US4541902A
公开(公告)日：1985-09-17
申请号：US668956
申请日：1984-11-07
申请人： Akemi Kinoshita , Ken Araki , Hidemi Nawafune , Shozo Mizumoto
发明人： Akemi Kinoshita , Ken Araki , Hidemi Nawafune , Shozo Mizumoto
IPC分类号： G01N27/26 , C23C18/31 , G01N31/16 , G01N27/46
CPC分类号： G01N31/164
摘要： An analytical method for determining by potentiometric titration formaldehyde in an electroless copper plating bath, which comprises using a hydroxylamine salt such as hydroxylamine hydrochloride as the titrant and using a silver electrode as the indicator electrode. This method can determine free formaldehyde in low concentration which takes part in the plating reaction.
摘要翻译：一种用于在化学镀铜浴中通过电位滴定甲醛测定的分析方法，其包括使用羟胺盐如盐酸羟胺作为滴定剂并使用银电极作为指示电极。该方法可以测定参与电镀反应的低浓度游离甲醛。

9. 发明授权

US4441965A Codeposition method 失效
标题翻译：代用方法
公开(公告)号：US4441965A
公开(公告)日：1984-04-10
申请号：US496396
申请日：1983-05-20
申请人： Sowjun Matsumura , Ken Araki , Tetsuo Otaka , Masumi Tanigawa
发明人： Sowjun Matsumura , Ken Araki , Tetsuo Otaka , Masumi Tanigawa
IPC分类号： C25D5/08 , C25D15/02
CPC分类号： C25D5/08 , C25D15/02
摘要： A method for codepositing a water-insoluble material with a metal from a plating solution having the metal ion dissolved and the water-insoluble material suspended therein, characterized by pumping at least one third per minute of the volume of the plating solution by means of a pump without entraining air bubbles, and injecting the thus pumped volume downward into the bath through a plurality of holes in the lower side of a sparger pipe connected to said pump and located at a lower level in a plating tank, thereby circulating and fluidizing the plating solution in which codeposition is being carried out.
摘要翻译：一种从金属离子溶解的金属溶液和悬浮于其中的水不溶性材料的电镀溶液共存非金属材料的方法，其特征在于，通过以下方式抽吸至少三分之一的电镀液体积：泵，而不夹带气泡，并且通过连接到所述泵并位于镀槽中的下层的分布管的下侧中的多个孔将如此泵送的体积向下注入浴中，从而使电镀液循环和流化正在执行共沉积的溶液。

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