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1. 发明申请

US20110229289A1 VACUUM PROCESSING APPARATUS 有权
标题翻译：真空加工设备
公开(公告)号：US20110229289A1
公开(公告)日：2011-09-22
申请号：US13021827
申请日：2011-02-07
申请人： Keita Nogi , Hideaki Kondo , Susumu Tauchi , Teruo Nakata
发明人： Keita Nogi , Hideaki Kondo , Susumu Tauchi , Teruo Nakata
IPC分类号： H01L21/677
CPC分类号： H01L21/67201 , H01L21/67745
摘要： The apparatus includes a load lock adapted to store the workpiece inside and to be switched between atmosphere and vacuum; vacuum transport chambers connected to the load lock and to the corresponding process chambers in a state where the load lock and each of the process chambers are isolated mutually; transfer means for transferring the workpiece between each of the process chambers and the load lock via the corresponding vacuum transport chamber; load lock valves adapted to switch between interrupt and opening at a position between the load lock and the corresponding vacuum transport chambers; process chamber valves adapted to switch between interrupt and opening at a position between the process chambers and the corresponding vacuum transport chambers; and control means for controlling timing of the opening and closing of the valves whose timings are controlled in synchronization with the transfer of the workpieces.
摘要翻译：该装置包括适于将工件存储在大气和真空之间并在大气和真空之间切换的装载锁; 在负载锁定和每个处理室相互隔离的状态下连接到负载锁和相应处理室的真空输送室; 用于通过相应的真空传送室在每个处理室和装载锁之间传送工件的传送装置; 适于在装载锁和相应的真空传送室之间的位置处在中断和打开之间切换的装载锁定阀; 处理室阀适于在处理室和相应的真空输送室之间的位置处在中断和打开之间切换; 以及控制装置，用于控制与工件的传送同步地控制其定时的阀的打开和关闭的定时。

2. 发明授权

US09011065B2 Vacuum processing apparatus and operating method of vacuum processing apparatus 有权
标题翻译：真空处理装置和真空处理装置的操作方法
公开(公告)号：US09011065B2
公开(公告)日：2015-04-21
申请号：US12871333
申请日：2010-08-30
申请人： Susumu Tauchi , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
发明人： Susumu Tauchi , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67745 , H01L21/67769 , Y10S414/139
摘要： A vacuum processing apparatus which includes an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, and a second vacuum transfer chamber connected to the transfer intermediate chamber. At least one vacuum processing chamber is connected to the first vacuum transfer chamber, and two or more vacuum processing chambers are connected to a rear side of the second vacuum transfer chamber. A plurality of gate valves are disposed between the first vacuum transfer chamber and each of the lock chamber, the transfer intermediate chamber, and the vacuum processing chamber coupled to the first vacuum transfer chamber. A control unit is also provided for controlling operation of the gate valves.
摘要翻译：一种真空处理装置，包括具有用于传送晶片的多个盒架的大气传送室，用于存储晶片的锁定室，来自锁定室的晶片被转移到的第一真空传送室，连接到传送中间室到第一真空传送室，以及连接到传送中间室的第二真空传送室。至少一个真空处理室连接到第一真空传送室，并且两个或更多个真空处理室连接到第二真空传送室的后侧。多个闸阀设置在第一真空传送室与联接到第一真空传送室的锁定室，传送中间室和真空处理室中的每一个之间。还设置有用于控制闸阀的操作的控制单元。

3. 发明申请

US20110218662A1 VACUUM PROCESSING APPARATUS AND PROGRAM 有权
标题翻译：真空加工设备和程序
公开(公告)号：US20110218662A1
公开(公告)日：2011-09-08
申请号：US13021888
申请日：2011-02-07
申请人： Teruo Nakata , Hideaki Kondo , Susumu Tauchi , Keita Nogi
发明人： Teruo Nakata , Hideaki Kondo , Susumu Tauchi , Keita Nogi
IPC分类号： G06F19/00
CPC分类号： G06F19/00
摘要： Provided is a method for controlling efficient transferring operations in a vacuum processing apparatus with a linear tool. In the apparatus, plural transferring robots are arranged in transferring mechanism units in which plural process chambers are connected with each other, and to-be-processed wafers are received and passed between plural transferring robots. As the transferring robots is far from the load lock, the number of transferring operations to the process chambers is set larger, the number of times of continuous transferring operations to the process chambers is set as small as possible, and an odd number of times of continuous transferring operations to buffer rooms is set, by a destination determination unit and operation control rules. Further, transferring operations are performed based on the destination determination unit and the operation control rules.
摘要翻译：提供了一种用于在具有线性工具的真空处理设备中控制有效传送操作的方法。在该装置中，在多个处理室相互连接的传送机构单元中配置有多个传送机器人，在多个传送机器人之间接收并通过待处理的晶片。由于传送机器人远离装载锁定，所以将处理室的传送操作的次数设定得较大，对处理室的连续传送操作的次数被设定得尽可能小，并且奇数次通过目的地确定单元和操作控制规则设置对缓冲室的连续传送操作。此外，基于目的地确定单元和操作控制规则执行传送操作。

4. 发明授权

US08538573B2 Vacuum processing apparatus and program 有权
标题翻译：真空加工设备及程序
公开(公告)号：US08538573B2
公开(公告)日：2013-09-17
申请号：US13021888
申请日：2011-02-07
申请人： Teruo Nakata , Hideaki Kondo , Susumu Tauchi , Keita Nogi
发明人： Teruo Nakata , Hideaki Kondo , Susumu Tauchi , Keita Nogi
IPC分类号： G06F19/00
CPC分类号： G06F19/00
摘要： Provided is a method for controlling efficient transferring operations in a vacuum processing apparatus with a linear tool. In the apparatus, plural transferring robots are arranged in transferring mechanism units in which plural process chambers are connected with each other, and to-be-processed wafers are received and passed between plural transferring robots. As the transferring robots is far from the load lock, the number of transferring operations to the process chambers is set larger, the number of times of continuous transferring operations to the process chambers is set as small as possible, and an odd number of times of continuous transferring operations to buffer rooms is set, by a destination determination unit and operation control rules. Further, transferring operations are performed based on the destination determination unit and the operation control rules.
摘要翻译：提供了一种用于在具有线性工具的真空处理设备中控制有效传送操作的方法。在该装置中，在多个处理室相互连接的传送机构单元中配置有多个传送机器人，在多个传送机器人之间接收并通过待处理的晶片。由于传送机器人远离装载锁定，所以将处理室的传送操作的次数设定得较大，对处理室的连续传送操作的次数被设定得尽可能小，并且奇数次通过目的地确定单元和操作控制规则设置对缓冲室的连续传送操作。此外，基于目的地确定单元和操作控制规则执行传送操作。

5. 发明授权

US09343340B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US09343340B2
公开(公告)日：2016-05-17
申请号：US13021827
申请日：2011-02-07
申请人： Keita Nogi , Hideaki Kondo , Susumu Tauchi , Teruo Nakata
发明人： Keita Nogi , Hideaki Kondo , Susumu Tauchi , Teruo Nakata
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67201 , H01L21/67745
摘要： A vacuum processing apparatus is disclosed for processing workpieces. The apparatus includes a load lock adapted to store the workpiece inside and to be switched between atmosphere and vacuum. Vacuum transport chambers are connected to the load lock and to the corresponding process chambers in a state where the load lock and each of the process chambers are isolated. The workpiece can be transferred between each of the process chambers and the load lock via the corresponding vacuum transport chamber. The apparatus also includes load lock valves for switching between interrupt and opening between the load lock and the corresponding vacuum transport chambers, and process chamber valves for switching between interrupt and opening between the process chambers and the corresponding vacuum transport chambers. Timing for opening and closing the valves is controlled in synchronization with the transfer of the workpieces.
摘要翻译：公开了一种用于处理工件的真空处理装置。该装置包括适于将工件存储在大气和真空之间并在大气和真空之间切换的负载锁定。在负载锁定和每个处理室被隔离的状态下，真空输送室连接到负载锁和相应的处理室。工件可以通过相应的真空输送室在每个处理室和装载锁之间传送。该装置还包括用于在负载锁和相应的真空输送室之间的中断和开启之间切换的负载锁定阀，以及用于在处理室和相应的真空输送室之间的中断和打开之间切换的处理室阀。用于打开和关闭阀门的时间与工件的传送同步地控制。

6. 发明申请

US20110110752A1 VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD OF SEMICONDUCTOR PROCESSING SUBSTRATE 审中-公开
标题翻译：真空加工系统和半导体加工基板的真空加工方法
公开(公告)号：US20110110752A1
公开(公告)日：2011-05-12
申请号：US12883602
申请日：2010-09-16
申请人： Susumu TAUCHI , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
发明人： Susumu TAUCHI , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67196 , H01L21/67766 , H01L21/67778
摘要： The invention provides a vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same, comprising an atmospheric transfer chamber having a plurality of cassette stands, a lock chamber arranged on a rear side of the atmospheric transfer chamber, and a first vacuum transfer chamber connected to a rear side of the lock chamber, wherein the first vacuum transfer chamber does not have any vacuum processing chamber connected thereto and has transfer intermediate chambers connected thereto, and the transfer intermediate chambers have subsequent vacuum transfer chambers connected thereto, and wherein the wafers are transferred via the lock chamber to the first vacuum transfer chamber to be processed in each of the subsequent vacuum processing chambers, which are further transferred via any of the transfer intermediate chambers connected to the first vacuum transfer chamber to the subsequent vacuum transfer chambers, and the respective wafers transferred to the subsequent vacuum transfer chambers other than the first vacuum transfer chamber are transferred to the respective vacuum processing chambers connected to each of the vacuum processing chambers and processed therein.
摘要翻译：本发明提供了一种半导体处理基板的真空处理系统和使用该真空处理方法的真空处理方法，包括具有多个盒架的大气传送室，布置在大气传送室后侧的锁定室，以及第一真空传送室连接到锁定室的后侧，其中第一真空传送室不具有连接到其上的任何真空处理室，并且具有连接到其上的传送中间室，并且传送中间室具有连接到其上的随后的真空传送室，其中所述晶片经由所述锁定室传送到所述第一真空传送室，以在随后的每个真空处理室中被处理，所述真空处理室进一步通过连接到所述第一真空传送室的任何转移中间室转移到随后的真空转印室和相应的晶片tr 推送到除了第一真空转移室之后的后续真空转移室被转移到连接到每个真空处理室的各个真空处理室中并在其中处理。

7. 发明授权

US08849446B2 Vacuum processing apparatus and program 有权
标题翻译：真空加工设备及程序
公开(公告)号：US08849446B2
公开(公告)日：2014-09-30
申请号：US13021898
申请日：2011-02-07
申请人： Teruo Nakata , Hideaki Kondo , Susumu Tauchi , Keita Nogi
发明人： Teruo Nakata , Hideaki Kondo , Susumu Tauchi , Keita Nogi
IPC分类号： G06F7/00 , H01L21/677
CPC分类号： H01L21/677 , Y02P90/02 , Y10T29/41
摘要： The present invention provides an efficient transferring control method in a vacuum processing apparatus of a linear tool in which plural vacuum robots are arranged in transferring mechanical units to which process chambers are connected and processing-target members are passed and received among the plural vacuum robots. In addition, the present invention provides a vacuum processing apparatus in which there are provided plural controlling methods, and a unit which determines whether rates of the transferring robots are to be controlled or rates of the process chambers are to be controlled on the basis of processing time of each processing-target member and switches the controlling method in accordance with a site whose rate is controlled.
摘要翻译：本发明提供了一种线性工具的真空处理装置中的有效的传送控制方法，其中多个真空机器人被布置成传送处理室连接的机械单元，并且处理对象构件在多个真空机器人之间通过和接收。此外，本发明提供一种真空处理装置，其中提供多种控制方法，以及一个单元，其确定是否要控制转移机器人的速率或者基于处理来控制处理室的速率每个处理目标成员的时间，并根据控制率的位置切换控制方法。

8. 发明申请

US20110217148A1 VACUUM PROCESSING APPARATUS AND PROGRAM 有权
标题翻译：真空加工设备和程序
公开(公告)号：US20110217148A1
公开(公告)日：2011-09-08
申请号：US13021898
申请日：2011-02-07
申请人： Teruo NAKATA , Hideaki Kondo , Susumu Tauchi , Keita Nogi
发明人： Teruo NAKATA , Hideaki Kondo , Susumu Tauchi , Keita Nogi
IPC分类号： H01L21/677
CPC分类号： H01L21/677 , Y02P90/02 , Y10T29/41
摘要： The present invention provides an efficient transferring control method in a vacuum processing apparatus of a linear tool in which plural vacuum robots are arranged in transferring mechanical units to which process chambers are connected and processing-target members are passed and received among the plural vacuum robots. In addition, the present invention provides a vacuum processing apparatus in which there are provided plural controlling methods, and a unit which determines whether rates of the transferring robots are to be controlled or rates of the process chambers are to be controlled on the basis of processing time of each processing-target member and switches the controlling method in accordance with a site whose rate is controlled.
摘要翻译：本发明提供了一种线性工具的真空处理装置中的有效的传送控制方法，其中多个真空机器人被布置成传送处理室连接的机械单元，并且处理对象构件在多个真空机器人之间通过和接收。此外，本发明提供一种真空处理装置，其中提供多种控制方法，以及一个单元，其确定是否要控制转移机器人的速率或者基于处理来控制处理室的速率每个处理目标成员的时间，并且根据控制速率的站点来切换控制方法。

9. 发明申请

US20110110751A1 VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD OF SEMICONDUCTOR PROCESSING SUBSTRATE 有权
标题翻译：真空加工系统和半导体加工基板的真空加工方法
公开(公告)号：US20110110751A1
公开(公告)日：2011-05-12
申请号：US12871333
申请日：2010-08-30
申请人： Susumu TAUCHI , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
发明人： Susumu TAUCHI , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67745 , H01L21/67769 , Y10S414/139
摘要： A vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same comprises an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer transferred from the atmospheric transfer chamber, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, a second vacuum transfer chamber connected to the transfer intermediate chamber, at least one vacuum processing chamber connected to the first vacuum transfer chamber, and two or more vacuum processing chambers connected to a rear side of the second vacuum transfer chamber, wherein the number of vacuum processing chambers connected to the first vacuum transfer chamber is smaller than the number of vacuum processing chambers connected to the second vacuum transfer chamber, or the number of use of vacuum processing chambers connected to the first vacuum transfer chamber is restricted to one.
摘要翻译：半导体处理基板的真空处理系统和使用其的真空处理方法包括具有多个用于传送晶片的盒架的大气传送室，用于存储从大气传送室转移的晶片的锁定室，第一真空传送室，来自锁定室的晶片被转印到该传送室，连接到第一真空传送室的传送中间室，连接到传送中间室的第二真空传送室，连接到第一真空传送室的至少一个真空处理室以及连接到第二真空传送室的后侧的两个或更多个真空处理室，其中连接到第一真空传送室的真空处理室的数量小于连接到第二真空传送室的真空处理室的数量，或使用真空加工台数连接到第一真空传送室的器件被限制为一个。

10. 发明申请

US20110144792A1 SEMICONDUCTOR PROCESSING SYSTEM AND PROGRAM 有权
标题翻译：半导体处理系统和程序
公开(公告)号：US20110144792A1
公开(公告)日：2011-06-16
申请号：US12966429
申请日：2010-12-13
申请人： Teruo Nakata , Hideaki Kondo , Keita Nogi
发明人： Teruo Nakata , Hideaki Kondo , Keita Nogi
IPC分类号： H01L21/677 , G06F19/00
CPC分类号： H01L21/67276 , H01L21/67184 , H01L21/67748
摘要： In a processing system of a linear tool in which plural carrying robots are arranged in carrying mechanical units to which processing modules are coupled and a processing target is delivered and received between the plural carrying robots, in the case where there are plural carrying routes on which the processing target is carried, the present invention provides a technique for determining the carrying route on which the highest throughput can be obtained.In the processing system of a linear tool, in the case where there are plural carrying routes on which the processing target is carried, the throughputs of the respective carrying routes are compared to each other, and the carrying route is determined by a unit for selecting the carrying route with the highest throughput.
摘要翻译：在一种线性工具的处理系统中，其中多个运送机器人被布置成承载处理模块耦合的机械单元并且在多个运送机器人之间传送和接收处理目标，在其上有多个运送路线的情况下，本发明提供了一种用于确定能够获得最高吞吐量的携带路由的技术。在线性工具的处理系统中，在携带有处理对象的多个承载路径的情况下，将各个携带路线的吞吐量相互比较，并且携带路线由用于选择的单位确定运输路线最高。

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