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1. 发明申请

US20080053971A1 Via hole machining method 审中-公开
标题翻译：通孔加工方法
公开(公告)号：US20080053971A1
公开(公告)日：2008-03-06
申请号：US11895821
申请日：2007-08-28
申请人： Yutaka Kobayashi , Keiji Nomaru , Hiroshi Morikazu
发明人： Yutaka Kobayashi , Keiji Nomaru , Hiroshi Morikazu
IPC分类号： B23K26/00
CPC分类号： H01L21/76898 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/0853 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A via hole machining method for forming via holes, reaching bonding pads, in a wafer having a plurality of devices which are formed on a face side of a substrate and are provided with the bonding pads, by irradiation with a pulsed laser beam from a back side of the substrate, wherein the energy density per pulse of the pulsed laser beam is set at such a value that ablation of the substrate will occur but ablation of the bonding pad will not occur, and the time interval of pulses of the pulsed laser beam is set at a value of not less than 150 microseconds.
摘要翻译：一种通孔加工方法，用于在具有多个器件的晶片中形成通孔，到达焊盘，该晶片形成在衬底的正面，并且设置有接合焊盘，通过从背面照射脉冲激光束其中脉冲激光束的每个脉冲的能量密度被设定为这样的值，即衬底的烧蚀将不会发生，而焊接垫的烧蚀将不会发生，脉冲激光束的脉冲的时间间隔被设定为不小于150微秒的值。

2. 发明授权

US08779325B2 Laser beam processing machine 有权
标题翻译：激光束加工机
公开(公告)号：US08779325B2
公开(公告)日：2014-07-15
申请号：US12073271
申请日：2008-03-03
申请人： Keiji Nomaru , Yutaka Kobayashi , Hiroshi Morikazu
发明人： Keiji Nomaru , Yutaka Kobayashi , Hiroshi Morikazu
IPC分类号： B23K26/02 , B23K26/00
CPC分类号： B23K26/355 , B23K26/032 , B23K26/034 , B23K26/04 , B23K26/06 , B23K26/0853 , B23K26/0869 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser beam processing machine includes a laser beam application device and a controller. The controller controls deflecting of the optical axis of a pulse laser beam from the laser beam application device in the processing-feed direction according to a plurality of processing position coordinates, and according to the frequency of the beam, to ensure that there is a predetermined time interval between pulses applied to the same processing position coordinates. One pulse is applied at a time to each of the plurality of processing position coordinates.
摘要翻译：激光束处理机包括激光束施加装置和控制器。控制器根据多个处理位置坐标以及根据光束的频率来控制来自激光束施加装置的激光束施加装置的脉冲激光束的光轴的偏转，以确保存在预定的施加到相同处理位置坐标的脉冲之间的时间间隔。一次施加一个脉冲到多个处理位置坐标中的每一个。

3. 发明授权

US07471384B2 Via hole depth detector 有权
标题翻译：通孔深度检测器
公开(公告)号：US07471384B2
公开(公告)日：2008-12-30
申请号：US11896336
申请日：2007-08-31
申请人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
发明人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
IPC分类号： G01N21/00
CPC分类号： G01B11/22 , B23K26/03 , B23K26/034 , B23K26/0643 , B23K26/382 , B23K26/40 , B23K2103/50
摘要： A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the second surface position detection means.
摘要翻译：一种通孔深度检测器，用于检测形成在保持在卡盘台上的工件中的通孔的深度，包括：第一表面位置检测装置，包括第一检测激光束振荡装置，用于振荡具有预定基于第一检测激光束的反射光检测被照射部分的高度位置; 第二表面位置检测装置，其包括用于振荡具有与第一检测激光束的波长不同的波长的第二检测激光束的第二检测激光束振荡装置，并且基于该第二检测激光束振荡装置检测工件的被照射部分的高度位置第二检测激光束的反射光; 以及控制装置，用于基于由第一表面位置检测装置获得的检测值和由第二表面位置检测装置获得的检测值来获得形成在工件中的通孔的深度。

4. 发明申请

US20080217301A1 Laser beam processing machine 有权
标题翻译：激光束加工机
公开(公告)号：US20080217301A1
公开(公告)日：2008-09-11
申请号：US12073271
申请日：2008-03-03
申请人： Keiji Nomaru , Yutaka Kobayashi , Hiroshi Morikazu
发明人： Keiji Nomaru , Yutaka Kobayashi , Hiroshi Morikazu
IPC分类号： B23K26/02
CPC分类号： B23K26/355 , B23K26/032 , B23K26/034 , B23K26/04 , B23K26/06 , B23K26/0853 , B23K26/0869 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser beam processing machine comprising a laser beam application means for applying a pulse laser beam to a workpiece held on a chuck table and a controller, wherein the laser beam application means comprises a laser beam oscillation means for oscillating a pulse laser beam, an optical axis changing means for deflecting the optical axis of a pulse laser beam oscillated from the laser beam oscillation means in the processing-feed direction, and a condenser for converging a pulse laser beam whose optical axis has been deflected by the optical axis changing means; and the controller comprises a memory for storing a plurality of processing position coordinates set in the workpiece, controls the optical axis changing means according to the frequency of a pulse laser beam oscillated from the laser beam oscillation means and determines a plurality of predetermined processing position coordinates to be processed to ensure that the time interval between pulses of the pulse laser beam to be applied to the same processing position coordinates becomes a predetermined time or more when one pulse of the pulse laser beam is applied each time to a plurality of predetermined processing position coordinates to be processed sequentially and the pulse laser beam is applied to a plurality of predetermined processing position coordinates to be processed a predetermined number of times sequentially repeatedly.
摘要翻译：一种激光束处理机，包括：激光束施加装置，用于将脉冲激光束施加到夹持在卡盘台上的工件;以及控制器，其中激光束施加装置包括用于振荡脉冲激光束的激光束振荡装置，用于使从激光束振荡装置在处理供给方向上振荡的脉冲激光束的光轴偏转的光轴改变装置和用于会聚由光轴改变装置偏转的光轴的脉冲激光束的聚光器; 并且所述控制器包括用于存储设置在所述工件中的多个处理位置坐标的存储器，根据从所述激光束振荡装置振荡的脉冲激光束的频率来控制所述光轴改变装置，并且确定多个预定处理位置坐标进行处理以确保当脉冲激光束的每个脉冲每次施加到多个预定处理位置时，要施加到相同处理位置坐标的脉冲激光束的脉冲之间的时间间隔变为预定时间或更长时间要顺序处理的坐标，并且将脉冲激光束施加到多个预定处理位置坐标，以重复顺序处理预定次数。

5. 发明申请

US20080055588A1 Via hole depth detector 有权
公开(公告)号：US20080055588A1
公开(公告)日：2008-03-06
申请号：US11896336
申请日：2007-08-31
申请人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
发明人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
IPC分类号： G01N21/00
CPC分类号： G01B11/22 , B23K26/03 , B23K26/034 , B23K26/0643 , B23K26/382 , B23K26/40 , B23K2103/50
摘要： A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the second surface position detection means.

6. 发明授权

US08487208B2 Laser beam irradiation apparatus and laser working machine 有权
标题翻译：激光束照射设备和激光加工机
公开(公告)号：US08487208B2
公开(公告)日：2013-07-16
申请号：US11890826
申请日：2007-08-08
申请人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
发明人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
IPC分类号： B23K26/00
CPC分类号： G02F1/33 , B23K26/0624 , B23K26/0853 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , G02F1/113 , G02F2001/291 , G02F2201/16
摘要： A laser beam irradiation apparatus includes a laser beam oscillation unit including a pulse laser beam oscillator for oscillating a pulse laser beam and a cycle frequency setting unit for setting the cycle frequency, an acousto-optic deflection unit for deflecting the optical axis of the pulse laser beam oscillated from the laser beam oscillation section, and a control unit for controlling the acousto-optic deflection unit. The control unit outputs a driving pulse signal having a predetermined time width including a pulse width of the pulse laser beam oscillated from the pulse laser beam oscillator to the acousto-optic deflection unit based on the cycle frequency setting signal from the cycle frequency setting section.
摘要翻译：激光束照射装置包括激光束振荡单元，其包括用于振荡脉冲激光束的脉冲激光束振荡器和用于设定周期频率的周期频率设定单元，用于偏转脉冲激光器的光轴的声光偏转单元从激光束振荡部分振荡的光束，以及用于控制声光偏转单元的控制单元。控制单元根据来自循环频率设定部的周期频率设定信号，将具有从脉冲激光束振荡器振荡的脉冲激光束的脉冲宽度的预定时间宽度的驱动脉冲信号输出到声光偏转部。

7. 发明申请

US20080205458A1 LASER BEAM IRRADIATION APPARATUS AND LASER BEAM MACHINING APPARATUS 审中-公开
标题翻译：激光束辐射装置和激光束加工装置
公开(公告)号：US20080205458A1
公开(公告)日：2008-08-28
申请号：US12028395
申请日：2008-02-08
申请人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru
发明人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru
IPC分类号： H01S3/10
CPC分类号： H01L21/67092 , B23K26/0622 , B23K26/082 , B23K26/0853
摘要： A laser beam irradiation apparatus including: a laser beam oscillation unit having a pulsed laser beam oscillator for oscillating a pulsed laser beam, and a repetition frequency setter; an acousto-optical deflector by which the pulsed laser beam oscillated by the laser beam oscillation unit is deflected and the output is adjusted; and a controller for controlling the acousto-optical deflector. The controller outputs to the acousto-optical deflector a driving pulse signal having a predetermined time width including the pulse width of the pulsed laser beam oscillated by the pulsed laser beam oscillator, based on a repetition frequency setting signal from the repetition frequency setter, and outputs a correction pulse signal to the acousto-optical deflector between the driving pulses.
摘要翻译：一种激光束照射装置，包括：激光束振荡单元，具有用于振荡脉冲激光束的脉冲激光束振荡器和重复频率设定器; 通过激光束振荡单元振荡的脉冲激光束偏转并输出输出的声光偏转器; 以及用于控制声光偏转器的控制器。控制器基于来自重复频率设定器的重复频率设置信号向声光偏转器输出包括由脉冲激光束振荡器振荡的脉冲激光束的脉冲宽度的预定时间宽度的驱动脉冲信号，并且输出对驱动脉冲之间的声光偏转器的校正脉冲信号。

8. 发明申请

US20080037596A1 Laser beam irradiation apparatus and laser working machine 有权
标题翻译：激光束照射设备和激光加工机
公开(公告)号：US20080037596A1
公开(公告)日：2008-02-14
申请号：US11890826
申请日：2007-08-08
申请人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
发明人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
IPC分类号： H01S3/10 , A61N5/01
CPC分类号： G02F1/33 , B23K26/0624 , B23K26/0853 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , G02F1/113 , G02F2001/291 , G02F2201/16
摘要： A laser beam irradiation apparatus includes a laser beam oscillation unit including a pulse laser beam oscillator for oscillating a pulse laser beam and a cycle frequency setting unit for setting the cycle frequency, an acousto-optic deflection unit for deflecting the optical axis of the pulse laser beam oscillated from the laser beam oscillation section, and a control unit for controlling the acousto-optic deflection unit. The control unit outputs a driving pulse signal having a predetermined time width including a pulse width of the pulse laser beam oscillated from the pulse laser beam oscillator to the acousto-optic deflection unit based on the cycle frequency setting signal from the cycle frequency setting section.
摘要翻译：激光束照射装置包括激光束振荡单元，其包括用于振荡脉冲激光束的脉冲激光束振荡器和用于设定周期频率的周期频率设定单元，用于偏转脉冲激光器的光轴的声光偏转单元从激光束振荡部分振荡的光束，以及用于控制声光偏转单元的控制单元。控制单元根据来自循环频率设定部的周期频率设定信号，将具有从脉冲激光束振荡器振荡的脉冲激光束的脉冲宽度的预定时间宽度的驱动脉冲信号输出到声光偏转部。

9. 发明申请

US20080011722A1 Laser processing device 有权
标题翻译：激光加工装置
公开(公告)号：US20080011722A1
公开(公告)日：2008-01-17
申请号：US11822972
申请日：2007-07-11
申请人： Yutaka Kobayashi , Kouichi Nehashi , Hiroshi Morikazu
发明人： Yutaka Kobayashi , Kouichi Nehashi , Hiroshi Morikazu
IPC分类号： B23K26/08 , B23K26/02 , B23K26/067
CPC分类号： B23K26/0853 , B23K26/0622 , B23K26/705 , B23K2101/40
摘要： Disclosed a laser processing device capable of recognizing a failure of pulsed laser beam irradiation during a process of pulsed laser beam irradiation and taking appropriate measures. A first judgment section and a second judgment section monitor respectively whether a pulsed laser beam is actually irradiated by an oscillation of a laser oscillator at the timing when a pulse signal is output from a pulse signal output section and whether the pulse signal output section outputs the pulse signal as setting to the laser oscillator at the timing when the pulse signal is output based on the preset pulse number. When there is a failure of the pulsed laser beam irradiation during the processing, the occurrence of failure is recognized and it can be recognized whether the failure is caused by a laser beam irradiating unit or a controller including the pulse signal output section.
摘要翻译：公开了一种能够识别在脉冲激光束照射过程中脉冲激光束照射失败并采取适当措施的激光加工装置。第一判断部分和第二判断部分分别监视在从脉冲信号输出部分输出脉冲信号的时刻脉冲激光束是否被激光振荡器的振荡实际照射，以及脉冲信号输出部分是否输出脉冲信号作为在基于预设脉冲数输出脉冲信号的定时的激光振荡器的设置。当在处理期间发生脉冲激光束照射失败时，识别故障的发生，并且可以识别是否由激光束照射单元或包括脉冲信号输出部的控制器引起故障。

10. 发明授权

US07732729B2 Laser processing device 有权
标题翻译：激光加工装置
公开(公告)号：US07732729B2
公开(公告)日：2010-06-08
申请号：US11822972
申请日：2007-07-11
申请人： Yutaka Kobayashi , Kouichi Nehashi , Hiroshi Morikazu
发明人： Yutaka Kobayashi , Kouichi Nehashi , Hiroshi Morikazu
IPC分类号： B23K26/36
CPC分类号： B23K26/0853 , B23K26/0622 , B23K26/705 , B23K2101/40
摘要： A laser processing device capable of recognizing a failure of pulsed laser beam irradiation during a process of pulsed laser beam irradiation and taking appropriate measures. A first judgment section and a second judgment section monitor respectively whether a pulsed laser beam is actually irradiated by an oscillation of a laser oscillator at the timing when a pulse signal is output from a pulse signal output section and whether the pulse signal output section outputs the pulse signal as setting to the laser oscillator at the timing when the pulse signal is output based on the preset pulse number. When there is a failure of the pulsed laser beam irradiation during the processing, the occurrence of failure is recognized and it can be recognized whether the failure is caused by a laser beam irradiating unit or a controller including the pulse signal output section.
摘要翻译：一种激光处理装置，其能够识别在脉冲激光束照射过程中脉冲激光束照射的故障并采取适当的措施。第一判断部分和第二判断部分分别监视在从脉冲信号输出部分输出脉冲信号的时刻脉冲激光束是否被激光振荡器的振荡实际照射，以及脉冲信号输出部分是否输出脉冲信号作为在基于预设脉冲数输出脉冲信号的定时的激光振荡器的设置。当在处理期间发生脉冲激光束照射失败时，识别故障的发生，并且可以识别是否由激光束照射单元或包括脉冲信号输出部的控制器引起故障。

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