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1. 发明授权

US06485591B1 Method for manufacturing laminated-ceramic electronic components 失效
标题翻译：叠层陶瓷电子部件的制造方法
公开(公告)号：US06485591B1
公开(公告)日：2002-11-26
申请号：US08286098
申请日：1994-08-04
申请人： Keiichi Nakao , Hideyuki Okinaka , Yasutaka Horibe , Hikoji Okuyama , Masahiro Katoh , Takashi Iguchi , Akira Ohmi , Yoshiyuki Miura
发明人： Keiichi Nakao , Hideyuki Okinaka , Yasutaka Horibe , Hikoji Okuyama , Masahiro Katoh , Takashi Iguchi , Akira Ohmi , Yoshiyuki Miura
IPC分类号： B32B3126
CPC分类号： B28B19/0015 , C04B41/4511 , C04B41/5194 , C04B2111/00844 , H01C7/10 , H01G4/308 , H01L41/273 , H01L41/297 , H05K1/0306 , H05K3/4611 , H05K3/4629 , C04B41/4578
摘要： The invention relates to a method of laminating ceramic greenware sheets with electrodes embedded therein (25) which is formed on a support by pressure-adhering a ceramic greenware sheet with an electrode embedded therein onto a second ceramic greenware sheet or other electrodes (23), then peeling off the support alone and transferring the ceramic greenware sheet with the embedded electrodes onto the second ceramic greenware sheet or the other electrodes. This manufacturing method enables it to laminate ceramic greenware sheets each the thickness of which is as thin as 20 micrometers or less, while maintaining their mechanical strength and embedded electrodes in the ceramic greenware sheets, thereby enabling it to prevent a occurrence of surface irregularities due to the thickness of the electrodes even when laminating to a high degree.
摘要翻译：本发明涉及一种层压陶瓷生态餐具的方法，其中嵌入有电极（25），其通过将陶瓷生态餐具片材与其中嵌入的电极压粘在第二陶瓷绿色餐具片或其它电极上而形成在支撑体上（23）然后单独剥离载体，并将具有嵌入电极的陶瓷生坯片材转移到第二陶瓷生态餐具片或其它电极上。该制造方法能够将厚度为20μm以下的陶瓷生态餐具层叠，同时将其机械强度和嵌入电极保持在陶瓷绿色餐具片中，从而能够防止由于电极的厚度即使在高度层压时也是如此。

2. 发明授权

US07097287B2 Ink jet device, ink jet ink, and method of manufacturing electronic component using the device and the ink 失效
标题翻译：喷墨装置，喷墨油墨，以及使用该装置和油墨制造电子部件的方法
公开(公告)号：US07097287B2
公开(公告)日：2006-08-29
申请号：US10343242
申请日：2002-05-08
申请人： Keiichi Nakao , Hideyuki Okinaka
发明人： Keiichi Nakao , Hideyuki Okinaka
IPC分类号： B41J2/175 , B41J2/19
CPC分类号： B41J2/175 , B41J2/17509
摘要： Here disclosed is an ink jet apparatus having an ink-circulating/dispersing function. The apparatus provides ink with dispersion as required, and circulates the ink through a tube to an ink-collecting tank. During this circulation, a required amount of the ink is fed to a printer head to form a predetermined pattern on a surface of a substrate. By virtue of the circulating/dispersing function, the apparatus can cope well with easy-to-aggregate ink having poor stability in terms of printing, thereby protecting a printer head or an ink-spouting section from clogging during ink jet printing. Such stabilized ink jet printing contributes to manufacturing highly reliable electronic components with an increased yield of products.
摘要翻译：这里公开了具有油墨循环/分散功能的喷墨设备。该设备根据需要提供具有分散性的油墨，并且通过管将油墨循环到油墨收集罐。在该循环期间，将所需量的墨水供给到打印头，以在基板的表面上形成预定图案。由于循环/分散功能，该设备可以很好地处理在打印方面的稳定性差的易于聚集的油墨，从而在喷墨打印期间保护打印头或喷墨部分不被堵塞。这种稳定的喷墨印刷有助于制造高可靠性的电子元件，同时产品的产量增加。

3. 发明授权

US06487774B1 Method of forming an electronic component using ink 失效
标题翻译：使用油墨形成电子部件的方法
公开(公告)号：US06487774B1
公开(公告)日：2002-12-03
申请号：US09381655
申请日：1999-12-21
申请人： Keiichi Nakao , Satoshi Tomioka , Hideyuki Okinaka
发明人： Keiichi Nakao , Satoshi Tomioka , Hideyuki Okinaka
IPC分类号： B23P1700
CPC分类号： H01G4/0085 , H01B1/16 , H05K1/092 , H05K3/125 , H05K2203/013 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/49401
摘要： A method of manufacturing an electronic component utilizing an ink jet method using an ink including water or organic solvent, and one of metal powder, ceramic powder, magnetic powder, glass powder, and resistor powder with particle size of 0.001 &mgr;m or more to 10 &mgr;m or less, dispersed in this water or organic solvent, by 1 wt. % or more to 80 wt. % or less, at viscosity of 2 poise or less.
摘要翻译：使用包含水或有机溶剂的油墨的喷墨法制造电子部件的方法，以及粒径为0.001μm以上至10μm以下的金属粉末，陶瓷粉末，磁性粉末，玻璃粉末和电阻体粉末之一或更少，分散在该水或有机溶剂中，加入1重量％％以上〜80重量％％以下，粘度为2泊以下。

4. 发明授权

US06979416B2 Method of forming an electronic component using ink 失效
标题翻译：使用油墨形成电子部件的方法
公开(公告)号：US06979416B2
公开(公告)日：2005-12-27
申请号：US10289436
申请日：2002-11-07
申请人： Keiichi Nakao , Satoshi Tomioka , Hideyuki Okinaka
发明人： Keiichi Nakao , Satoshi Tomioka , Hideyuki Okinaka
IPC分类号： B21D53/76 , B41J2/135 , B41J2/175 , H01B1/16 , H01B1/22 , H01G4/008 , H05K3/02 , H05K3/36
CPC分类号： H01G4/0085 , H01B1/16 , H05K1/092 , H05K3/125 , H05K2203/013 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/49401
摘要： A method of manufacturing an electronic component utilizing an ink jet method using an ink including water or organic solvent, and one of metal powder, ceramic powder, magnetic powder, glass powder, and resistor powder with particle size of 0.001 μm or more to 10 μm or less, dispersed in this water or organic solvent, by 1 wt. % or more to 80 wt. % or less, at viscosity of 2 poise or less.
摘要翻译：使用包含水或有机溶剂的油墨的喷墨法制造电子部件的方法，以及粒径为0.001μm以上至10μm以下的金属粉末，陶瓷粉末，磁性粉末，玻璃粉末和电阻体粉末之一或更少，分散在该水或有机溶剂中，加入1重量％％以上〜80重量％％以下，粘度为2泊以下。

5. 发明授权

US08507076B2 Combination of base layer and ink for inkjet for manufacturing electronic component 失效
标题翻译：用于制造电子部件的用于喷墨的基底层和墨水的组合
公开(公告)号：US08507076B2
公开(公告)日：2013-08-13
申请号：US13207981
申请日：2011-08-11
申请人： Keiichi Nakao , Yukihiro Shimasaki , Atsushi Iwase , Koji Shimoyama
发明人： Keiichi Nakao , Yukihiro Shimasaki , Atsushi Iwase , Koji Shimoyama
IPC分类号： B41M5/00
CPC分类号： H01G4/12 , H01G4/0085 , H01G13/00 , H01L21/4867 , H05K1/0306 , H05K1/092 , H05K3/1208 , H05K3/125 , H05K3/386 , H05K2203/013 , H05K2203/0783 , H05K2203/1163 , Y10T29/49133 , Y10T428/24802 , Y10T428/24893 , Y10T428/2495 , Y10T428/24975 , Y10T428/25 , Y10T428/265
摘要： A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.
摘要翻译：在金属板，金属管，未烘烤陶瓷片，层压陶瓷生片等的表面上形成基层，基层与喷墨油墨发生胶凝反应。基层改善了低粘度油墨如喷墨油墨的油墨可接受性，并且防止油墨图案的渗出，排水，厚度不均匀和抗蚀剂图案。因此，本发明能够使用喷墨方法来提供必须满足严格的高精度要求的用于蚀刻的抗蚀剂图案等。

6. 发明授权

US08178188B2 Base layer for manufacturing an electronic component by an etching process 失效
标题翻译：用于通过蚀刻工艺制造电子部件的基底层
公开(公告)号：US08178188B2
公开(公告)日：2012-05-15
申请号：US12339826
申请日：2008-12-19
申请人： Keiichi Nakao , Yukihiro Shimasaki , Atsushi Iwase , Koji Shimoyama
发明人： Keiichi Nakao , Yukihiro Shimasaki , Atsushi Iwase , Koji Shimoyama
IPC分类号： B41M5/00 , B44C1/17 , G03G7/00
CPC分类号： H01G4/12 , H01G4/0085 , H01G13/00 , H01L21/4867 , H05K1/0306 , H05K1/092 , H05K3/1208 , H05K3/125 , H05K3/386 , H05K2203/013 , H05K2203/0783 , H05K2203/1163 , Y10T29/49133 , Y10T428/24802 , Y10T428/24893 , Y10T428/2495 , Y10T428/24975 , Y10T428/25 , Y10T428/265
摘要： A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.
摘要翻译：在金属板，金属管，未烘烤陶瓷片，层压陶瓷生片等的表面上形成基层，基层与喷墨油墨发生胶凝反应。基层改善了低粘度油墨如喷墨油墨的油墨可接受性，并且防止油墨图案的渗出，排水，厚度不均匀和抗蚀剂图案。因此，本发明能够使用喷墨方法来提供必须满足严格的高精度要求的用于蚀刻的抗蚀剂图案等。

7. 发明申请

US20050028605A1 Strain sensor and method of producing the same 有权
标题翻译：应变传感器及其制造方法
公开(公告)号：US20050028605A1
公开(公告)日：2005-02-10
申请号：US10937497
申请日：2004-09-10
申请人： Keiichi Nakao , Yukio Mizukami , Hiroaki Ishida , Toshiro Otobe
发明人： Keiichi Nakao , Yukio Mizukami , Hiroaki Ishida , Toshiro Otobe
IPC分类号： G01L1/22 , H01K1/18
CPC分类号： G01L1/2287 , Y10T29/49082 , Y10T29/49099 , Y10T29/49103 , Y10T29/49224
摘要： A strain sensor comprising a metal substrate, a first electrode provided on the metal substrate, a glass layer formed on the first electrode, and a second electrode and a strain detecting resistor provided on the glass layer. In the strain sensor, the insulation resistance between the metal substrate and the second electrode has been raised, and the reliability is high. It can be implemented at low cost.
摘要翻译：一种应变传感器，包括金属基板，设置在金属基板上的第一电极，形成在第一电极上的玻璃层，以及设置在玻璃层上的第二电极和应变检测电阻器。在应变传感器中，金属基板与第二电极之间的绝缘电阻升高，可靠性高。它可以以低成本实现。

8. 发明授权

US06246568B1 Electric double-layer capacitor and method for manufacturing the same 有权
标题翻译：双电层电容器及其制造方法
公开(公告)号：US06246568B1
公开(公告)日：2001-06-12
申请号：US09147558
申请日：1999-01-20
申请人： Keiichi Nakao , Kyoushige Shimizu , Takumi Yamaguchi
发明人： Keiichi Nakao , Kyoushige Shimizu , Takumi Yamaguchi
IPC分类号： H01G900
CPC分类号： H01G9/155 , H01G11/58 , Y02E60/13 , Y02T10/7022 , Y10T29/417
摘要： The invention relates to an electric double layer capacitor for large capacity used in regeneration or electric power storage for various electric appliances and electric vehicles, and its manufacturing method. As the resin to be used in the current collector, by adding low softening point resin, polytetrafluoroethylene resin, latex resin or the like, the flexibility, thick coating performance and winding performance are improved. By preparing the electrode solution for making such current collector by using a high pressure dispersion machine, the capacity and density of the current collector can be enhanced substantially. According to this manufacturing method, the electric double layer capacitor may be further increased in size, increased in capacity and lowered in cost.
摘要翻译：本发明涉及用于各种电器和电动车辆的再生或蓄电的大容量双电层电容器及其制造方法。作为集电体使用的树脂，通过添加低软化点树脂，聚四氟乙烯树脂，胶乳树脂等，提高了柔软性，厚涂层性能和卷绕性能。通过使用高压分散机制备这种集电体的电极溶液，可以大大提高集电体的容量和密度。根据该制造方法，双层电容器的尺寸进一步增大，容量增加，成本降低。

9. 发明授权

US08130499B2 Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board 有权
标题翻译：散热结构基板，使用散热结构基板的模块，以及制造散热结构基板的方法
公开(公告)号：US08130499B2
公开(公告)日：2012-03-06
申请号：US12530277
申请日：2008-11-28
申请人： Tohru Ohnishi , Hitoshi Kouno , Toshiyuki Taniguchi , Koji Nakashima , Toshiyuki Nakata , Tsunetsugu Imanishi , Keiichi Nakao
发明人： Tohru Ohnishi , Hitoshi Kouno , Toshiyuki Taniguchi , Koji Nakashima , Toshiyuki Nakata , Tsunetsugu Imanishi , Keiichi Nakao
IPC分类号： H05K7/20
CPC分类号： H01L23/3735 , H01L23/053 , H01L23/49861 , H01L23/645 , H01L25/162 , H01L2023/4025 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2924/19105 , H05K1/0201 , H05K7/1432 , H05K7/209 , Y10T29/4935 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.
摘要翻译：本发明涉及一种散热结构板和使用这种用于混合动力车辆或电动车辆等可靠性高的目的的散热结构的模块以及制造散热结构的方法。树脂结构设置在安装在该引线框架等上的构成散热板和异型电子部件等的引线框架上以覆盖引线框架和异型电子部件等，以及该树脂结构固定在金属板，装置的底盘等上，构成散热结构板整体，由此固定引线框和异型电子部件等的固定强度，可以增强在引线框架和传热层之间的界面处的强度等。

10. 发明申请

US20100091464A1 HEAT DISSIPATING STRUCTURE BASE BOARD, MODULE USING HEAT DISSIPATING STRUCTURE BASE BOARD, AND METHOD FOR MANUFACTURING HEAT DISSIPATING STRUCTURE BASE BOARD 有权
标题翻译：散热结构基板，散热结构基板使用的模块和制造散热结构基板的方法
公开(公告)号：US20100091464A1
公开(公告)日：2010-04-15
申请号：US12530277
申请日：2008-11-28
申请人： Tohru Ohnishi , Hitoshi Kouno , Toshiyuki Taniguchi , Koji Nakashima , Toshiyuki Nakata , Tsunetsugu Imanishi , Keiichi Nakao
发明人： Tohru Ohnishi , Hitoshi Kouno , Toshiyuki Taniguchi , Koji Nakashima , Toshiyuki Nakata , Tsunetsugu Imanishi , Keiichi Nakao
IPC分类号： H05K7/20 , B21D53/02
CPC分类号： H01L23/3735 , H01L23/053 , H01L23/49861 , H01L23/645 , H01L25/162 , H01L2023/4025 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2924/19105 , H05K1/0201 , H05K7/1432 , H05K7/209 , Y10T29/4935 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.
摘要翻译：本发明涉及一种散热结构板和使用这种用于混合动力车辆或电动车辆等可靠性高的目的的散热结构的模块以及制造散热结构的方法。树脂结构设置在安装在该引线框架等上的构成散热板和异型电子部件等的引线框架上以覆盖引线框架和异型电子部件等，以及该树脂结构固定在金属板，装置的底盘等上，构成散热结构板整体，由此固定引线框和异型电子部件等的固定强度，可以增强在引线框架和传热层之间的界面处的强度等。

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