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    • 1. 发明申请
    • WELDING CONTROL APPARATUS FOR PULSE ARC WELDING OF CONSUMED ELECTRODE TYPE, ARC LENGTH CONTROL METHOD FOR USE WITH THE SAME, AND WELDING SYSTEM INCLUDING THE WELDING CONTROL APPARATUS
    • 用于消费电极类型的脉冲电弧焊接的焊接控制装置,与其一起使用的弧长控制方法以及包括焊接控制装置的焊接系统
    • US20100200553A1
    • 2010-08-12
    • US12684314
    • 2010-01-08
    • Kei YAMAZAKIKeiichi SuzukiMasahiro HonmaEiji Sato
    • Kei YAMAZAKIKeiichi SuzukiMasahiro HonmaEiji Sato
    • B23K9/10
    • B23K9/092B23K9/073B23K9/0953B23K9/0956B23K9/173
    • A welding control apparatus according to the present invention includes an integrator for starting calculation of a voltage error integral value Sv2, expressed by a formula (1) given below, from a time when a first pulse period ends and a second pulse period starts in a pulse cycle, based on various data of information regarding a gradient Ks of an external characteristic of a welding power supply and a welding current setting value Is2 and a welding voltage setting value Vs2 both in a second pulse period, which are preset as parameters in the formula (1), as well as on an instantaneous value Io2 of a welding current and an instantaneous value Vo2 of a welding voltage both detected in the second pulse period, a comparator for comparatively determining whether a value of the voltage error integral value Sv2 provided as the calculation result has become 0, and a waveform generator for, per pulse cycle, terminating the relevant pulse cycle and starting a next pulse cycle at a time when the value of the voltage error integral value Sv2 has become 0, whereby a variation in an arc length caused by disturbances is precisely suppressed in pulse arc welding of consumed electrode type: Sv2=∫{Ks(Io2−Is2)+Vs2−Vo2}dt  (1)
    • 根据本发明的焊接控制装置包括积分器,用于从第一脉冲期间结束时开始第二脉冲期间开始计算电压误差积分值Sv2,由下面给出的公式(1)表示, 基于关于焊接电源的外部特性的梯度Ks和焊接电流设定值Is2以及焊接电压设定值Vs2的信息的各种数据,在第二脉冲期间,作为参数被预先设定 公式(1),以及在第二脉冲周期中检测到的焊接电流的瞬时值Io2和焊接电压的瞬时值Vo2,比较器,用于相对确定是否提供电压误差积分值Sv2的值 当计算结果为0时,以及每个脉冲周期的波形发生器终止相关的脉冲周期,并在下一个脉冲周期开始下一个脉冲周期 电压误差积分值Sv2的e值变为0,从而在消耗电极类型的脉冲电弧焊中精确地抑制由干扰引起的电弧长度的变化:Sv2 =∫{Ks(Io2-Is2)+ Vs2-Vo2} dt(1)
    • 4. 发明申请
    • WELDING CONTROL APPARATUS AND METHOD
    • 焊接控制装置和方法
    • US20090242533A1
    • 2009-10-01
    • US12364739
    • 2009-02-03
    • Kei YAMAZAKIKeiichi SuzukiEiji Sato
    • Kei YAMAZAKIKeiichi SuzukiEiji Sato
    • B23K9/10
    • B23K9/0953B23K9/0732B23K9/092B23K9/0956
    • The present invention provides a welding control apparatus including: a droplet separation detecting unit that detects separation of a droplet from a tip end of welding wire; and a waveform generator that alternately generates a first pulse for separating the droplet and a second pulse for shaping the droplet and outputs the generated pulse to a welding power source, the waveform generator generating a third pulse having a pulse shape different in a pulse peak current and/or a pulse width from the second pulse to output the generated third pulse to the welding pulse source after a base time of the first pulse if separation of the droplet is not detected within a peak period, a falling slope period, or a base period of the first pulse to thereby restore a droplet supply regularity.
    • 本发明提供一种焊接控制装置,包括:液滴分离检测单元,其检测熔滴与焊丝的前端的分离; 以及波形发生器,其交替地产生用于分离液滴的第一脉冲和用于成形液滴的第二脉冲,并将所生成的脉冲输出到焊接电源,所述波形发生器生成具有脉冲峰值电流不同的脉冲形状的第三脉冲 和/或来自第二脉冲的脉冲宽度,以在第一脉冲的基准时间之后将所产生的第三脉冲输出到焊接脉冲源,如果在峰值期间,下降斜率周期或基极内未检测到液滴的分离 从而恢复液滴供应的规律性。
    • 5. 发明授权
    • Welding control apparatus and method
    • 焊接控制装置及方法
    • US08153933B2
    • 2012-04-10
    • US12364739
    • 2009-02-03
    • Kei YamazakiKeiichi SuzukiEiji Sato
    • Kei YamazakiKeiichi SuzukiEiji Sato
    • B23K9/10B23K33/00B23K35/00
    • B23K9/0953B23K9/0732B23K9/092B23K9/0956
    • The present invention provides a welding control apparatus including: a droplet separation detecting unit that detects separation of a droplet from a tip end of welding wire; and a waveform generator that alternately generates a first pulse for separating the droplet and a second pulse for shaping the droplet and outputs the generated pulse to a welding power source, the waveform generator generating a third pulse having a pulse shape different in a pulse peak current and/or a pulse width from the second pulse to output the generated third pulse to the welding pulse source after a base time of the first pulse if separation of the droplet is not detected within a peak period, a falling slope period, or a base period of the first pulse to thereby restore a droplet supply regularity.
    • 本发明提供一种焊接控制装置,包括:液滴分离检测单元,其检测熔滴与焊丝的前端的分离; 以及波形发生器,其交替地产生用于分离液滴的第一脉冲和用于成形液滴的第二脉冲,并将所生成的脉冲输出到焊接电源,所述波形发生器生成具有脉冲峰值电流不同的脉冲形状的第三脉冲 和/或来自第二脉冲的脉冲宽度,以在第一脉冲的基准时间之后将所产生的第三脉冲输出到焊接脉冲源,如果在峰值期间,下降斜率周期或基极内未检测到液滴的分离 从而恢复液滴供应的规律性。
    • 6. 发明申请
    • TANDEM PULSE ARC WELDING CONTROL APPARATUS AND SYSTEM THEREFOR
    • TANDEM脉冲焊接控制装置及其系统
    • US20100230394A1
    • 2010-09-16
    • US12709703
    • 2010-02-22
    • Masahiro YOKOTAEiji SatoMasahiro Honma
    • Masahiro YOKOTAEiji SatoMasahiro Honma
    • B23K9/10
    • B23K9/0017B23K9/09B23K9/0953B23K9/121B23K9/1735
    • A tandem pulse arc welding control apparatus includes a voltage detector; a voltage setting unit; a pulse-peak-current-reference-value setting circuit; a pulse-base-current-reference-value setting circuit; an error amplifier that calculates a pulse-peak-current variation value and a pulse-base-current variation value; an adder that calculates a pulse-peak-current value; an adder that calculates a pulse-base-current value; a pulse-waveform selection circuit that outputs the pulse-peak-current value in a pulse peak period, and that outputs the pulse-base-current value in a pulse base period; and an output control circuit that controls a current value for a second welding wire. Because an appropriate welding voltage can be obtained with this configuration, a high welding quality can be realized.
    • 串联脉冲弧焊控制装置包括电压检测器; 电压设定单元; 脉冲峰值电流基准值设定电路; 脉冲基准电流基准值设定电路; 误差放大器,其计算脉冲峰值电流变化值和脉冲基极电流变化值; 计算脉冲峰值电流值的加法器; 计算脉冲基电流值的加法器; 脉冲波形选择电路,其在脉冲峰值期间输出脉冲峰值电流值,并且在脉冲基准周期内输出脉冲基极电流值; 以及控制第二焊丝的电流值的输出控制电路。 由于能够通过该结构获得适当的焊接电压,因此可以实现高的焊接质量。
    • 7. 发明授权
    • Tandem pulse arc welding control apparatus and system therefor
    • 串联脉冲弧焊控制装置及其系统
    • US08237088B2
    • 2012-08-07
    • US12709703
    • 2010-02-22
    • Masahiro YokotaEiji SatoMasahiro Honma
    • Masahiro YokotaEiji SatoMasahiro Honma
    • B23K9/10
    • B23K9/0017B23K9/09B23K9/0953B23K9/121B23K9/1735
    • A tandem pulse arc welding control apparatus includes a voltage detector; a voltage setting unit; a pulse-peak-current-reference-value setting circuit; a pulse-base-current-reference-value setting circuit; an error amplifier that calculates a pulse-peak-current variation value and a pulse-base-current variation value; an adder that calculates a pulse-peak-current value; an adder that calculates a pulse-base-current value; a pulse-waveform selection circuit that outputs the pulse-peak-current value in a pulse peak period, and that outputs the pulse-base-current value in a pulse base period; and an output control circuit that controls a current value for a second welding wire. Because an appropriate welding voltage can be obtained with this configuration, a high welding quality can be realized.
    • 串联脉冲弧焊控制装置包括电压检测器; 电压设定单元; 脉冲峰值电流基准值设定电路; 脉冲基准电流基准值设定电路; 误差放大器,其计算脉冲峰值电流变化值和脉冲基极电流变化值; 计算脉冲峰值电流值的加法器; 计算脉冲基电流值的加法器; 脉冲波形选择电路,其在脉冲峰值期间输出脉冲峰值电流值,并且在脉冲基准周期内输出脉冲基极电流值; 以及控制第二焊丝的电流值的输出控制电路。 由于能够通过该结构获得适当的焊接电压,因此可以实现高的焊接质量。
    • 9. 发明申请
    • SEMICONDUCTOR DEVICE HAVING THROUGH-SUBSTRATE VIA
    • 具有通过基底的半导体器件
    • US20130181349A1
    • 2013-07-18
    • US13599041
    • 2012-08-30
    • Chie KOYAMASatoyuki MiyakoEiji Sato
    • Chie KOYAMASatoyuki MiyakoEiji Sato
    • H01L23/498
    • H01L23/481H01L21/76224H01L23/5225H01L23/5286H01L27/14618H01L27/14636H01L2924/0002H01L2924/00
    • According to an embodiment, a semiconductor device includes a first circuit block, a first through-substrate via, and a back surface wiring. The first circuit block is provided on a surface side of a semiconductor substrate. The first through-substrate via is provided along a circumference of the first circuit block so as to separate the first circuit block from other circuit blocks. The first circuit block is provided so as to penetrate the surface of the semiconductor substrate. The first circuit block is isolated from the surroundings. The first circuit block has conductivity. The back surface wiring is provided on the back surface side of the semiconductor substrate. The back surface wiring is connected to the first through-substrate via. The back surface wiring connects the first through-substrate via to a power supply terminal or a shield potential terminal.
    • 根据实施例,半导体器件包括第一电路块,第一贯穿衬底通孔和背面布线。 第一电路块设置在半导体衬底的表面侧。 沿着第一电路块的圆周设置第一贯穿衬底通孔,以将第一电路块与其它电路块分离。 第一电路块被设置为穿透半导体衬底的表面。 第一个电路块与周围环境隔绝。 第一个电路块具有导电性。 背面布线设置在半导体基板的背面侧。 背面布线连接到第一贯穿基板通孔。 背面布线将第一贯穿基板通孔连接到电源端子或屏蔽电位端子。