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    • 4. 发明申请
    • LIGHT EMITTING DIODE PACKAGE, LIGHTING DEVICE AND LIGHT EMITTING DIODE PACKAGE SUBSTRATE
    • 发光二极管封装,照明装置和发光二极管封装基板
    • US20110248289A1
    • 2011-10-13
    • US13078933
    • 2011-04-02
    • Chung-Chuan HsiehYi-Chun ChenYi-Ting Chiu
    • Chung-Chuan HsiehYi-Chun ChenYi-Ting Chiu
    • H01L33/08H01L33/62
    • H01L25/0753H01L33/486H01L33/62H01L2224/48091H01L2924/00014H01L2924/00
    • A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad.
    • 发光二极管(LED)封装包括LED封装基板,第一LED芯片和第二LED芯片。 LED封装衬底包括衬底,第一焊盘,第二接合焊盘和第三接合焊盘。 第一,第二和第三接合焊盘设置在基板上。 第二接合焊盘被布置成阵列。 第一和第三接合焊盘分别位于阵列的第一列和最后一列。 第一LED芯片在第一焊盘上被芯片焊接并分别引线接合到布置在阵列的第一列中的第二焊盘。 第二LED芯片分别在第二焊盘上进行裸片焊接。 在除了最后一列之外的每行中,每个第二LED芯片被引线键合到布置在下一列中的第二焊盘。 位于最后一列的第二LED芯片被引线接合到第三焊盘。
    • 5. 发明申请
    • LED street lamp
    • LED路灯
    • US20100172131A1
    • 2010-07-08
    • US12318616
    • 2009-01-02
    • Yun-Chiang MoChia-Hua LiaoYi-Chun ChenYen-Yu HuangChia-Hsiang Chuang
    • Yun-Chiang MoChia-Hua LiaoYi-Chun ChenYen-Yu HuangChia-Hsiang Chuang
    • F21V29/00
    • F21V11/04F21V11/16F21V11/18F21V29/717F21V29/763F21W2131/103F21W2131/105F21Y2115/10Y02B20/72
    • A light-emitting diode (LED) street lamp is applicable for street lighting. The LED street lamp includes a casing, an LED module, and a heat dissipation module. The LED module and the heat dissipation module are arranged inside the casing. The LED module includes a frame, a circuit board carrying a plurality of LEDs, and a light regulation mechanism. The frame and the circuit board are set opposing each other with the light regulation mechanism arranged therebetween to interfere with emission light from the LEDs. The emission light, after being interfered with, is projected outside the casing to realize lighting. The heat dissipation module is in physical engagement with the LED module to remove heat generated by the LEDs. As such, the LED street lamp is provided with a broader range of illumination angle and more uniform brightness, so that the same LED street lamp is applicable to various sites and the heat generated by the LEDs can be efficiently dissipated.
    • 发光二极管(LED)路灯适用于街道照明。 LED路灯包括壳体,LED模块和散热模块。 LED模块和散热模块布置在外壳内。 LED模块包括框架,承载多个LED的电路板和光调节机构。 框架和电路板彼此相对设置,其间布置有光调节机构以干扰来自LED的发射光。 发射光被干扰后,突出到外壳外面实现照明。 散热模块与LED模块物理接合,以消除LED产生的热量。 因此,LED路灯具有更宽的照明角度和更均匀的亮度,使得相同的LED路灯可应用于各种场所,并且可以有效地消散由LED产生的热量。
    • 8. 发明授权
    • Nanoscale helical microstructures and channels from chiral poly(L-lactide) block containing block copolymers
    • 来自手性聚(L-丙交酯)嵌段的嵌段共聚物的纳米级螺旋微结构和通道
    • US07135523B2
    • 2006-11-14
    • US10799845
    • 2004-03-12
    • Rong-Ming HoYeo-Wan ChiangChu-Chieh LinBao-Tsan KoYi-Chun ChenTsai-Ming ChungHsi-Hsin ShihJassy S. J. Wang
    • Rong-Ming HoYeo-Wan ChiangChu-Chieh LinBao-Tsan KoYi-Chun ChenTsai-Ming ChungHsi-Hsin ShihJassy S. J. Wang
    • C08G63/08
    • C08L53/00C08F293/005G03F7/0002
    • A method for making a series of nanoscale microstructures, including helical microstructures and cylindrical microstrustures. This method includes the steps of: (1) forming a chiral block copolymer containing a plurality of chiral first polymer blocks and a second polymer blocks wherein the chiral first polymer blocks have a volume fraction ranging from 20 to 49%; (2) causing a phase separation in the chiral block copolymer. In a preferred embodiment, the chiral block copolymer is poly(styrene)-poly(L-lactide) (PS-PLLA) chiral block copolymer, and the copolymerization process is a living copolymerization process which includes the following steps: (a) mixing styrene with BPO and 4-OH-TEMPO to form 4-hydroxy-TEMPO-terminated polystyrene; and (2) mixing the 4-hydroxy-TEMPO-terminated polystyrene with [η3-EDBP)Li2]2[(η3-nBu)Li(0.5Et2O)]2 and L-lactide in an organic solvent preferably CH2Cl2 to form the poly(styrene)-poly(L-lactide) chiral block copolymer. Transmission electron microscopy (TEM) and small X-ray scattering (SAXS) studies show that when the volume fraction of poly(L-lactide) is about 35–37%, nanoscale helices with a pitch of 43.8 nanometers and a diameter of 34.4 nanometers were observed.
    • 一种制备一系列纳米级微观结构的方法,包括螺旋微结构和圆柱形微结构。 该方法包括以下步骤:(1)形成含有多个手性第一聚合物嵌段的手性嵌段共聚物和第二聚合物嵌段,其中手性第一聚合物嵌段具有20至49%的体积分数; (2)引起手性嵌段共聚物中的相分离。 在优选的实施方案中,手性嵌段共聚物是聚(苯乙烯) - 聚(L-丙交酯)(PS-PLLA)手性嵌段共聚物,共聚方法是一种活性共聚方法,其包括以下步骤:(a) 用BPO和4-OH-TEMPO形成4-羟基-TEMPO封端的聚苯乙烯; 和(2)将4-羟基-TEMPO封端的聚苯乙烯与[η3 -EDBP] Li 2 N 2 [2] 优选的有机溶剂中的L 3→N 2→Bu)Li(0.5E 2 O 2)2 N 2和L-丙交酯 CH 2 2 Cl 2以形成聚(苯乙烯) - 聚(L-丙交酯)手性嵌段共聚物。 透射电子显微镜(TEM)和小X射线散射(SAXS)研究表明,当聚(L-丙交酯)的体积分数为约35-37%时,具有43.8纳米的间距和34.4纳米的直径的纳米级螺旋 被观察到。