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    • 3. 发明申请
    • Curable Resin Composition and Cold Setting Adhesive
    • 可固化树脂组合物和冷定型粘合剂
    • US20090264602A1
    • 2009-10-22
    • US12494540
    • 2009-06-30
    • Shigeki MoriYukihiro NomuraKazuhiro IyoShinichi Sato
    • Shigeki MoriYukihiro NomuraKazuhiro IyoShinichi Sato
    • C08L77/00C08L83/00C08L75/04C08L61/00C08L83/05
    • C08L101/10C08G18/10C08G18/4825C08G18/4837C08G18/755C09J175/08C08G18/289
    • Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiX1X2X3 or —SiR1X1 X2 (wherein, X1, X2 and X3 respectively represent a hydrolytic group and may be the same as or different from each other, and R1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiR1X1 X2, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.
    • 公开了一种湿固化型固化性树脂组合物,其含有:分子内具有含硅官能团的固化性树脂; 路易斯酸或作为固化催化剂的路易斯酸的络合物,所述路易斯酸选自金属卤化物和卤化硼,其在室温下快速固化。 含硅官能团由以下通式表示:-SiX1X2X3或-SiR1X1 X2(其中,X1,X2和X3分别表示水解基团,可以相同或不同,R1表示取代或未取代的 碳原子数为1〜20的有机基团)。 如果含硅官能团为-SiR1X1 X2,则固化性树脂还分子内含有氨基甲酸酯,硫代氨基甲酸酯,脲,硫脲,取代的脲,取代的硫脲,酰胺和硫键之一的极性成分,羟基,仲氨基 和叔氨基。 两部分型粘合剂是可固化树脂与固化催化剂分离的组成成分。
    • 5. 发明申请
    • Curable resin composition and cold-setting adhesive
    • 可固化树脂组合物和冷固粘合剂
    • US20060189736A1
    • 2006-08-24
    • US10564843
    • 2004-07-16
    • Shigeki MoriYukihiro NomuraKazuhiro IyoShinichi Sato
    • Shigeki MoriYukihiro NomuraKazuhiro IyoShinichi Sato
    • C08K3/38
    • C08L101/10C08G18/10C08G18/4825C08G18/4837C08G18/755C09J175/08C08G18/289
    • Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiX1X2X3 or —SiR1X1X2 (wherein, X1, X2 and X3 respectively represent a hydrolytic group and may be the same as or different from each other, and R1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiR1X1X2, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.
    • 公开了一种湿固化型固化性树脂组合物,其含有:分子内具有含硅官能团的固化性树脂; 路易斯酸或作为固化催化剂的路易斯酸的络合物,所述路易斯酸选自金属卤化物和卤化硼,其在室温下快速固化。 含硅官能团由以下通式表示:-SiX 1 X 2 X 3或-SiR 1 O / X 1 2 X 2(其中,X 1,X 2,X 3和X 3) >分别表示水解基团,可以相同也可以不同,R 1表示取代或未取代的碳原子数1〜20的有机基团)。 如果含硅官能团是-SiR 1 X 1 X 2 O 2,那么可固化树脂还分子内含有极性组分,其为 氨基甲酸酯,硫代氨基甲酸酯,脲,硫脲,取代的脲,取代的硫脲,酰胺和硫键,以及羟基,仲氨基和叔氨基。 两部分型粘合剂是可固化树脂与固化催化剂分离的组成成分。
    • 10. 发明授权
    • Semiconductor memory and system apparatus
    • 半导体存储器和系统装置
    • US07251171B2
    • 2007-07-31
    • US11167318
    • 2005-06-28
    • Koichi NishimuraShinichi YamadaYukihiro Nomura
    • Koichi NishimuraShinichi YamadaYukihiro Nomura
    • G11C7/00G11C7/10G11C8/00
    • G11C7/1045G11C11/4072G11C2029/0407
    • A register part of a mode register has a plurality of operation setting parts in which plural types of operating specifications are respectively set to operate the semiconductor memory. The mode register outputs a soft reset signal when at least a value of one-bit of the register part represents a reset state. A reset signal generator outputs a reset signal for resetting an internal circuit in response to the soft reset signal. In the present invention, a system that controls the semiconductor memory is required to necessarily assign a predetermined bit with a setting command of the mode register in order to generate the soft reset signal. Accordingly, it is possible to reliably reset the internal circuit by external control.
    • 模式寄存器的寄存器部分具有多个操作设置部分,其中分别设置多种类型的操作规范以操作半导体存储器。 当至少寄存器部分的1位的值表示复位状态时,模式寄存器输出软复位信号。 复位信号发生器响应于软复位信号输出用于复位内部电路的复位信号。 在本发明中,控制半导体存储器的系统需要用模式寄存器的设定命令来分配预定的位,以产生软复位信号。 因此,可以通过外部控制可靠地复位内部电路。