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    • 5. 发明授权
    • Redundancy circuit
    • 冗余电路
    • US5349555A
    • 1994-09-20
    • US52629
    • 1993-04-27
    • Michio Nakajima
    • Michio Nakajima
    • G11C29/00G11C29/04G11C11/40
    • G11C29/781G11C29/785
    • In order to obtain a redundancy circuit which can freely arrange its fuse in a required position with disciplined accessibility after employment, a combination circuit (50) receives outputs (QA0 to QA7) obtained by decoding a column address (AXM) by a column line decoder (2), signals (QB0 to QB7) indicating a faulty line, signals (L0 to L7) generated from the signals (QB0 to QB7) and an inverted signal (ENB*), to generate signals (YS0 to YS8) for controlling selecting switches for specifying column lines. If a K-th column line is faulty, a column line selecting switch for selecting the K-th column line is forcibly turned off and an (N+1)-th column line is allocated with respect to specification of an N-th column line (N.gtoreq.K). Thus, fuse positions of redundancy circuits can be standarlized between products so that the products can be easily mass-produced and supplied at a low cost even if the redundancy circuits are contained in small quantities of various ASICs.
    • 为了获得能够在使用后能够自由地将其熔丝自由地布置在所需位置上的冗余电路,组合电路(50)接收通过列线解码器对列地址(AXM)进行解码而获得的输出(QA0至QA7) (QB0〜QB7)生成的信号(QB0〜QB7)和反相信号(ENB *)产生的信号(QB0〜QB7),产生用于控制选择的信号(YS0〜YS8) 用于指定列线的开关。 如果第K列列故障,则用于选择第K列列的列线选择开关被强制关闭,并且关于第N列的指定分配第(N + 1)列行 线(N> / = K)。 因此,冗余电路的熔丝位置可以在产品之间标准化,使得即使冗余电路包含在少量各种ASIC中,产品也可以以低成本容易地批量生产和供应。
    • 7. 发明授权
    • Semiconductor wafer and method of manufacturing the same, and
semiconductor device and test board of the same
    • 半导体晶片及其制造方法,以及半导体器件及其测试板
    • US6127694A
    • 2000-10-03
    • US77926
    • 1993-06-18
    • Michio Nakajima
    • Michio Nakajima
    • G01R31/26G01R31/28H01L21/326H01L21/66H01L21/822H01L27/04H01L23/58H01L29/00
    • G01R31/2856G01R31/2884
    • Regarding a semiconductor device, a burn-in board can be standardized in each package. An IC (100) includes a VCC terminal (2), a GND terminal (3), input terminals (4a, 4b), and output terminals (5), and it also includes a burn-in board setting terminal (14). Input signals applied to the input terminals (4a, 4b) are transmitted to gates 16a and 16b of switching circuit (15) and processed in a function block (7). Regardless of the signals applied to the input terminals (4a, 4b), simply applying a test signal to the burn-in board setting terminal (14), a specified logic is applied to the function block (7). Only if a pin arrangement of the VCC terminal (2), the GND terminal (3), and the burn-in board setting terminal (14) is standardized and determined, burn-in can be performed indifferent of another pin arrangement of the input terminals (4a, 4b).
    • 关于半导体器件,可以在每个封装中标准化老化板。 IC(100)包括VCC端子(2),GND端子(3),输入端子(4a,4b)和输出端子(5),并且还包括老化板设置端子(14)。 施加到输入端子(4a,4b)的输入信号被传送到开关电路(15)的门16a和16b,并在功能块(7)中进行处理。 无论施加到输入端子(4a,4b)的信号如何,只需将测试信号施加到老化板设置端子(14),就将功能块(7)施加指定的逻辑。 只有当VCC端子(2),GND端子(3)和老化板设置端子(14)的引脚布置被标准化和确定时,可以对输入的另一引脚布置无任何老化 端子(4a,4b)。
    • 10. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US5353253A
    • 1994-10-04
    • US126636
    • 1993-09-27
    • Michio Nakajima
    • Michio Nakajima
    • G11C29/00G11C29/04G11C7/00G11C11/40
    • G11C29/76
    • A smaller, high-speed, semiconductor memory device having redundancy is disclosed which attains an improved mass productivity. Where a main memory (20) includes a defective memory cell, a defective address designating circuit (21) stores the address of the defective memory cell. Defective address detecting circuits (22a to 22r) detect whether an address signal received at an address signal input terminal (4) coincides with an address signal from the defective address designating circuit (21). If a signal indicative of the coincidence is given to a redundancy memory circuit (23) from the defective address detecting circuits (22a to 22r), data is written in or read from defective address remedy latch circuit groups (23a to 23r) of the redundancy memory circuit (23) which correspond to the defective address detecting circuits (22a to 22r). A data selector (24) selectively outputs data received from the defective address remedy latch circuit groups (23a to 23r) or data received from the main memory (20). Thus, the redundancy memory circuit (23), which requires less space, quickly replaces the defective memory cell of the main memory (20).
    • 公开了具有冗余的较小的高速半导体存储器件,其具有提高的批量生产率。 在主存储器(20)包括缺陷存储单元的情况下,缺陷地址指定电路(21)存储有缺陷存储单元的地址。 检测地址检测电路(22a〜22r)是否检测到在地址信号输入端子(4)接收到的地址信号是否与来自缺陷地址指定电路(21)的地址信号一致。 如果从缺陷地址检测电路(22a〜22r)向冗余存储电路(23)发出了表示一致的信号,则将数据写入冗余存储电路(23)至缺陷地址补救锁存电路组(23a〜23r) 存储电路(23),其对应于缺陷地址检测电路(22a〜22r)。 数据选择器(24)选择性地输出从缺陷地址补救锁存电路组(23a至23r)接收的数据或从主存储器(20)接收的数据。 因此,需要较少空间的冗余存储器电路(23)快速地替换主存储器(20)的有缺陷的存储单元。