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1. 发明授权

US06112737A Wire saw and method of cutting work 失效
标题翻译：线锯和切割方法
公开(公告)号：US06112737A
公开(公告)日：2000-09-05
申请号：US99951
申请日：1998-06-19
申请人： Kazutomo Kinutani , Shigeo Kobayashi , Etsuo Kiuchi
发明人： Kazutomo Kinutani , Shigeo Kobayashi , Etsuo Kiuchi
IPC分类号： B24B27/06 , B23D57/00 , B28D5/00 , B28D5/04 , B28D1/06
CPC分类号： B28D5/0082 , B23D57/0053 , Y10T83/929
摘要： A wire saw which can improve a working accuracy is provided. When a wire goes to a rightward direction by a rotation of a moving motor, the wire is inclined in such a manner as to be moved toward a right and outer periphery from an inner portion of a work, and a cutting start point of the work becomes a point within the work. Further, when a wire goes to a leftward direction by a rotation of the moving motor, the wire is inclined in such a manner as to be moved toward a left and outer periphery from an inner portion of a work, and a cutting start point of the work becomes a point within the work. Then, the work is cut from the cutting start point by a sufficient slurry containing float abrasive grains supplied to a portion on the wire.
摘要翻译：提供了可以提高加工精度的线锯。当电线通过移动电动机的旋转向右方向移动时，电线以从工件内部向右外侧移动的方式倾斜，工件的切割起点成为工作中的一个要点。此外，当线通过移动电动机的旋转而向左方向移动时，电线以从工件的内部朝向左外周移动的方式倾斜，并且切割起点工作成为工作中的一个重点。然后，通过足够的浆料从切割起点切割加工，该浆料含有提供给导线上的部分的漂浮磨粒。

2. 发明授权

US5937844A Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing 失效
标题翻译：在切片期间通过改变浆料条件和送丝速率来切割圆柱形工件的方法
公开(公告)号：US5937844A
公开(公告)日：1999-08-17
申请号：US823208
申请日：1997-03-24
申请人： Etsuo Kiuchi , Kazuo Hayakawa , Kohei Toyama
发明人： Etsuo Kiuchi , Kazuo Hayakawa , Kohei Toyama
IPC分类号： B28D5/00 , B28D5/04 , B28D1/08
CPC分类号： B28D5/0064 , B28D5/007 , B28D5/045
摘要： In a wire saw for slicing a cylindrical workpiece such as a silicon ingot so as to obtain wafers or the like, the feed rate of slurry fed to the workpiece, the viscosity of the slurry, or the feed rate of a wire is varied according to the cutting length in the workpiece or the angle between the wire and the circumference of the workpiece. It becomes possible to obtain wafers or the like, each having a uniform thickness.
摘要翻译：在用于切割诸如硅锭的圆柱形工件以获得晶片等的线锯中，供给到工件的浆料的进料速率，浆料的粘度或者丝的进给速率根据工件中的切割长度或线材与工件的圆周之间的角度。可以获得各自具有均匀厚度的晶片等。

3. 发明授权

US5575189A Roller having grooves for wire saw 失效
标题翻译：滚子有线锯槽
公开(公告)号：US5575189A
公开(公告)日：1996-11-19
申请号：US452835
申请日：1995-05-30
申请人： Etsuo Kiuchi , Kazuo Hayakawa , Kouhei Toyama
发明人： Etsuo Kiuchi , Kazuo Hayakawa , Kouhei Toyama
IPC分类号： B24B27/06 , B23D57/00 , B28D1/08 , B28D5/04 , B26D1/547
CPC分类号： B23D57/0053 , Y10T83/293 , Y10T83/9292
摘要： A roller with grooves for a wire saw around which a cutting wire is wrapped. The roller comprises a core member having an inside divided into two areas which have a boundary at the center in the longitudinal direction of the core member, wherein each of the areas has a passage for circulation of a coolant and the inlet and the outlet of each passage are provided in the vicinity of the outer end of one area side in which the passage belongs.
摘要翻译：具有用于线锯的槽的辊，其上缠绕有切割线。该辊子包括一个芯部件，其内部分成两个区域，这两个区域在芯部件的纵向方向上具有中心的边界，其中每个区域都具有用于循环冷却剂的通道，并且每个区域的入口和出口通道设置在通道所属的一个区域侧的外端附近。

4. 发明申请

US20050048882A1 Polishing apparatus and method 失效
标题翻译：抛光设备和方法
公开(公告)号：US20050048882A1
公开(公告)日：2005-03-03
申请号：US10964624
申请日：2004-10-15
申请人： Etsuo Kiuchi , Toshiyuki Hayashi
发明人： Etsuo Kiuchi , Toshiyuki Hayashi
IPC分类号： B24B37/015 , B24B37/04 , B24B37/12 , B24B37/14 , B24B37/30 , B24B41/04 , B24B41/06 , B24B49/14 , B24B55/02 , B24B57/02 , B24B5/00
CPC分类号： B24B55/02 , B24B37/015 , B24B37/042 , B24B37/12 , B24B37/14 , B24B37/30 , B24B41/042 , B24B41/06 , B24B49/14 , B24B57/02
摘要： There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adhering the work on the work holding plate with high precision. The polishing apparatus comprises: a polishing table(29); and a work holding plate(38), wherein a work held on the work holding plate(38) is polished supplying a polishing agent solution(41) in the apparatus, and in polishing action, an amount of deformation of the polishing table(29) in a direction normal to an upper surface thereof with respect to the upper surface thereof and/or an amount of deformation of the work holding plate(38) in a direction normal to a work holding surface thereof is restricted to 100 m or less by forming the polishing table(29) in one-piece, contriving flow paths of cooling water and others.
摘要翻译：提供了能够以高效率和高精度进行工件（例如晶片）的抛光装置和研磨方法，能够有效地保持作业的新型工作保持板和能够粘附工件的工件的粘合方法在工作夹具上高精度。抛光装置包括：抛光台（29）; 以及工件保持板（38），其中在所述设备中抛光保持在所述工件保持板（38）上的工件，供给抛光剂溶液（41），并且在抛光动作中，抛光台（29）的变形量）和/或工件保持板（38）在垂直于其工件保持表面的方向上的变形量限制在100μm以下，通过将抛光台（29）形成为冷却水等的一体成型流动路径。

5. 发明授权

US06095129A Tension adjusting mechanism for wire saw 失效
标题翻译：线锯张力调整机构
公开(公告)号：US06095129A
公开(公告)日：2000-08-01
申请号：US103538
申请日：1998-06-24
申请人： Yukihiro Kanemichi, deceased , Etsuo Kiuchi
发明人： Yukihiro Kanemichi, deceased , Etsuo Kiuchi
IPC分类号： B24B27/06 , B23D57/00 , B28D1/06
CPC分类号： B23D57/0069
摘要： There is provided a tension adjusting mechanism which can prevent a dancer arm from being widely rotated and a peripheral roller such as a guide roller from early abrading even in the case a wire is tensioned or loosened in accordance with a speed increase or decrease of the wire. A plurality of dancer rollers are rotatably supported to a front end of a rotatable dancer arm. A plurality of guide rollers are disposed in such a manner as to oppose to the dancer rollers, thereby successively guiding one wire on the dancer roller through the guide rollers. A predetermined tension is applied to the wire by rotating and urging the dancer arm to one direction by an urging member.
摘要翻译：提供了一种张力调节机构，其可以防止浮动臂被广泛地旋转，并且即使在根据线的速度增加或减小的情况下线材被张紧或松动的情况下，也可以防止早期研磨的周向辊。多个浮动轮被可旋转地支撑在可旋转的舞蹈臂的前端。多个引导辊以与浮动轮对置的方式设置，从而通过引导辊连续地引导浮动轮上的一根线。通过由推动构件旋转并将浮动臂向一个方向推动，将预定的张力施加到线材。

6. 发明授权

US5839425A Method for cutting a workpiece with a wire saw 失效
标题翻译：用线锯切割工件的方法
公开(公告)号：US5839425A
公开(公告)日：1998-11-24
申请号：US941759
申请日：1997-09-30
申请人： Kouhei Toyama , Etsuo Kiuchi , Kazuo Hayakawa
发明人： Kouhei Toyama , Etsuo Kiuchi , Kazuo Hayakawa
IPC分类号： B24B27/06 , B28D5/00 , B28D5/04 , B28D1/08
CPC分类号： B28D5/045 , B28D5/0058
摘要： A wire saw for slicing a semiconductor single crystal ingot with which alignment of the crystallographic orientation of the ingot is simple and easy in a slicing process and a method for slicing the ingot by means of the wire saw. Main rollers are three-dimensionally arranged with a predetermined distance between each other, and a wire runs over the main rollers to form arrays of wire portions parallel to each other, with said wire saw an ingot being sliced into rods by pressing it to an array of wire portions between a pair of main rollers that are used to slice the ingot, while the wire is being driven and slurry is fed to the array of wire portions between the pair of main rollers, wherein the wire runs over the pair of main rollers used for slicing in a ratio of one turn over the pair of main rollers to more than one turn over the other main roller or rollers so that the array of wire portions running over the pair of main rollers used for slicing can be arranged at a desired pitch.
摘要翻译：一种用于切割半导体单晶锭的线锯，其中在切割过程中锭的晶体取向的取向是简单和容易的，以及通过线锯切割锭的方法。主辊三维地布置有彼此之间的预定距离，并且电线在主辊上延伸以形成彼此平行的电线部分阵列，所述线锯通过将锭子压入阵列而被切成棒状在用于切割锭子的一对主辊之间的线部分中的线被驱动并且浆料被馈送到在一对主辊之间的线部分阵列中，其中线在一对主辊上延伸用于在一对主辊上以一匝的比例切割成超过另一个主辊或辊的多于一个匝，使得在用于切片的一对主辊上延伸的丝线部分阵列可以被布置成期望的沥青。

7. 发明授权

US07513819B2 Polishing apparatus and method 失效
标题翻译：抛光设备和方法
公开(公告)号：US07513819B2
公开(公告)日：2009-04-07
申请号：US10964624
申请日：2004-10-15
申请人： Etsuo Kiuchi , Toshiyuki Hayashi
发明人： Etsuo Kiuchi , Toshiyuki Hayashi
IPC分类号： B24B49/00
CPC分类号： B24B55/02 , B24B37/015 , B24B37/042 , B24B37/12 , B24B37/14 , B24B37/30 , B24B41/042 , B24B41/06 , B24B49/14 , B24B57/02
摘要： There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adhering the work on the work holding plate with high precision. The polishing apparatus comprises: a polishing table(29); and a work holding plate(38), wherein a work held on the work holding plate(38) is polished supplying a polishing agent solution(41) in the apparatus, and in polishing action, an amount of deformation of the polishing table(29) in a direction normal to an upper surface thereof with respect to the upper surface thereof and/or an amount of deformation of the work holding plate(38) in a direction normal to a work holding surface thereof is restricted to 100 m or less by forming the polishing table(29) in one-piece, contriving flow paths of cooling water and others.
摘要翻译：提供了能够以高效率和高精度进行工件（例如晶片）的抛光装置和研磨方法，能够有效地保持作业的新型工作保持板和能够粘附工件的工件的粘合方法在工作夹具上高精度。抛光装置包括：抛光台（29）; 以及工件保持板（38），其中在所述设备中抛光保持在所述工件保持板（38）上的工件，供给抛光剂溶液（41），并且在抛光动作中，抛光台（29）的变形量）和/或工件保持板（38）在垂直于其工件保持表面的方向上的变形量限制在100μm以下，通过将抛光台（29）形成为冷却水等的一体成型流动路径。

8. 发明授权

US06221814B1 Aqueous compositions, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid 有权
标题翻译：水性组合物，使用其的水性切削液，其制备方法和使用切削液的切割方法
公开(公告)号：US06221814B1
公开(公告)日：2001-04-24
申请号：US09423316
申请日：1999-11-12
申请人： Shingo Kaburagi , Akio Ashida , Etsuo Kiuchi
发明人： Shingo Kaburagi , Akio Ashida , Etsuo Kiuchi
IPC分类号： C10M17302
CPC分类号： B28D5/007 , C09K3/1463 , C10M173/02 , C10N2240/401 , C10N2250/02
摘要： An aqueous cutting fluid which can reduce the impact on working environment and the global environment, and can achieve both preventing precipitates from becoming a hard cake and keeping high dispersibility for abrasive grains is provided. Such an aqueous cutting fluid is obtained by a method comprising dispersing abrasive grains (G) in an aqueous composition comprising a dispersion medium (M) containing a hydrophilic alcohol compound such as ethylene glycol, a lipophilic alcohol compound such as propylene glycol and water, and silica colloid particles dispersed stably in the medium. The dispersion medium (M) is odorless and not flammable. The abrasive grains (G) may settle out after a time, but they do not closely contact with one another, and therefore the resulting precipitates do not become a hard cake, which allows the re-dispersion and reuse of precipitated grains. The instant aqueous cutting fluid is inherently low viscous, and the reduction of viscosity owing to the contamination of water and the increase of viscosity owing to contamination of shavings are both moderate. As a result, the cutting fluid has a long life. And articles which have been cut using the cutting fluid can be washed with water. Further, as the dispersion medium (M) is a biodegradable low molecular weight organic compound, a waste liquid from a process using the cutting fluid can be disposed with an activated sludge.
摘要翻译：提供一种可以减少对工作环境和全球环境的影响的水性切削液，并且可以实现防止沉淀物变硬和保持高分散性的磨粒。这种水性切削液是通过将磨粒（G）分散在包含含有亲水性醇化合物如乙二醇的分散介质（M），亲脂性醇化合物如丙二醇和水的水性组合物中的方法获得的，以及二氧化硅胶体颗粒稳定地分散在介质中。分散介质（M）无臭，不易燃。磨料颗粒（G）可以在一段时间后沉降，但它们不会彼此紧密接触，因此所得到的沉淀物不会变成硬质饼，这允许沉淀颗粒的再分散和再利用。本发明的水性切削液本质上是低粘度的，并且由于水的污染导致的粘度降低以及由于刨花污染引起的粘度增加都是适度的。因此，切削液寿命长。使用切削液切断的制品可以用水洗涤。此外，由于分散介质（M）是可生物降解的低分子量有机化合物，所以使用活性污泥的废液可以使用切削液进行处理。

9. 发明授权

US5927131A Method of manufacturing wire for use in a wire saw and wire for use in a wire saw 失效
标题翻译：制造用于线锯的线锯和线材的线材的制造方法
公开(公告)号：US5927131A
公开(公告)日：1999-07-27
申请号：US822099
申请日：1997-03-20
申请人： Etsuo Kiuchi , Kazuo Hayakawa , Kohei Toyama
发明人： Etsuo Kiuchi , Kazuo Hayakawa , Kohei Toyama
IPC分类号： B24B27/06 , B21C1/00 , B21C37/04 , B23D61/18 , B23D65/00 , B28D5/04
CPC分类号： B21C37/042 , B21C1/003 , B23D61/185 , B23D65/00 , Y10T29/49812
摘要： A method of manufacturing wire for use in a wire saw used for slicing a semiconductor ingot into wafers is disclosed. A starting wire, which is an iron or iron alloy wire plated with copper or copper alloy, is drawn into a fine wire in a finish drawing step. Subsequently, copper or copper alloy plating is removed from the fine wire surface through chemical polishing with an acid treatment solution or a like solution, physical polishing with polishing cloth or the like, or electropolishing, or through combined polishing thereof. The method makes it possible to manufacture wire having excellent quality characteristics without raising a problem such as metal contamination of product wafers sliced from the ingot.
摘要翻译：公开了一种用于将半导体锭切割成晶片的线锯中使用的线材的制造方法。作为镀铜或铜合金的铁或铁合金线的起始线在精加工步骤中被拉伸成细线。随后，用酸处理溶液等进行化学抛光，用抛光布等进行物理抛光或电解抛光，或者通过其组合抛光，从细线表面除去铜或铜合金电镀。该方法使得可以制造具有优异质量特性的线，而不会引起诸如从锭块切割的产品晶片的金属污染等问题。

10. 发明授权

US5875769A Method of slicing semiconductor single crystal ingot 失效
标题翻译：半导体单晶锭切片方法
公开(公告)号：US5875769A
公开(公告)日：1999-03-02
申请号：US822983
申请日：1997-03-21
申请人： Kohei Toyama , Etsuo Kiuchi , Kazuo Hayakawa
发明人： Kohei Toyama , Etsuo Kiuchi , Kazuo Hayakawa
IPC分类号： B24B27/06 , B28D5/04 , B28D1/08
CPC分类号： B28D5/045
摘要： A method of slicing a semiconductor single crystal ingot by a wire saw slicing apparatus and a semiconductor wafer produced by the method, in which the running direction of the wire is not corresponding with the cleavage directions of the semiconductor single crystal ingot so that occurrence of cracks or breakage in the semiconductor wafer produced by the method can be suppressed significantly without any additional processes or an increase in cost.
摘要翻译：一种通过线切割装置和半导体晶片将半导体单晶锭切割的方法，其特征在于：所述导线的运行方向与半导体单晶锭的解理方向不对应，从而发生裂纹或者通过该方法制造的半导体晶片的破损可以被显着地抑制，而没有任何附加的处理或成本的增加。

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