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1. 发明授权

US5575189A Roller having grooves for wire saw 失效
标题翻译：滚子有线锯槽
公开(公告)号：US5575189A
公开(公告)日：1996-11-19
申请号：US452835
申请日：1995-05-30
申请人： Etsuo Kiuchi , Kazuo Hayakawa , Kouhei Toyama
发明人： Etsuo Kiuchi , Kazuo Hayakawa , Kouhei Toyama
IPC分类号： B24B27/06 , B23D57/00 , B28D1/08 , B28D5/04 , B26D1/547
CPC分类号： B23D57/0053 , Y10T83/293 , Y10T83/9292
摘要： A roller with grooves for a wire saw around which a cutting wire is wrapped. The roller comprises a core member having an inside divided into two areas which have a boundary at the center in the longitudinal direction of the core member, wherein each of the areas has a passage for circulation of a coolant and the inlet and the outlet of each passage are provided in the vicinity of the outer end of one area side in which the passage belongs.
摘要翻译：具有用于线锯的槽的辊，其上缠绕有切割线。该辊子包括一个芯部件，其内部分成两个区域，这两个区域在芯部件的纵向方向上具有中心的边界，其中每个区域都具有用于循环冷却剂的通道，并且每个区域的入口和出口通道设置在通道所属的一个区域侧的外端附近。

2. 发明授权

US5839425A Method for cutting a workpiece with a wire saw 失效
标题翻译：用线锯切割工件的方法
公开(公告)号：US5839425A
公开(公告)日：1998-11-24
申请号：US941759
申请日：1997-09-30
申请人： Kouhei Toyama , Etsuo Kiuchi , Kazuo Hayakawa
发明人： Kouhei Toyama , Etsuo Kiuchi , Kazuo Hayakawa
IPC分类号： B24B27/06 , B28D5/00 , B28D5/04 , B28D1/08
CPC分类号： B28D5/045 , B28D5/0058
摘要： A wire saw for slicing a semiconductor single crystal ingot with which alignment of the crystallographic orientation of the ingot is simple and easy in a slicing process and a method for slicing the ingot by means of the wire saw. Main rollers are three-dimensionally arranged with a predetermined distance between each other, and a wire runs over the main rollers to form arrays of wire portions parallel to each other, with said wire saw an ingot being sliced into rods by pressing it to an array of wire portions between a pair of main rollers that are used to slice the ingot, while the wire is being driven and slurry is fed to the array of wire portions between the pair of main rollers, wherein the wire runs over the pair of main rollers used for slicing in a ratio of one turn over the pair of main rollers to more than one turn over the other main roller or rollers so that the array of wire portions running over the pair of main rollers used for slicing can be arranged at a desired pitch.
摘要翻译：一种用于切割半导体单晶锭的线锯，其中在切割过程中锭的晶体取向的取向是简单和容易的，以及通过线锯切割锭的方法。主辊三维地布置有彼此之间的预定距离，并且电线在主辊上延伸以形成彼此平行的电线部分阵列，所述线锯通过将锭子压入阵列而被切成棒状在用于切割锭子的一对主辊之间的线部分中的线被驱动并且浆料被馈送到在一对主辊之间的线部分阵列中，其中线在一对主辊上延伸用于在一对主辊上以一匝的比例切割成超过另一个主辊或辊的多于一个匝，使得在用于切片的一对主辊上延伸的丝线部分阵列可以被布置成期望的沥青。

3. 发明授权

US5907988A Wire saw apparatus 失效
标题翻译：线锯设备
公开(公告)号：US5907988A
公开(公告)日：1999-06-01
申请号：US903759
申请日：1997-07-31
申请人： Etsuo Kiuchi , Kazuo Hayakawa , Kouhei Toyama
发明人： Etsuo Kiuchi , Kazuo Hayakawa , Kouhei Toyama
IPC分类号： B23D57/00 , B24B27/06 , B28D5/04 , B26D1/44 , B28D1/06
CPC分类号： B24B27/0633 , B23D57/0053 , B28D5/045 , Y10T83/9292
摘要： A wire saw apparatus which is less susceptible to loosening of the wire and to breakage thereof, includes a wire supply spool, a cutting head having a plurality of main rollers around which a wire from the wire supply spool is wrapped, a wire take-up spool for taking-up the wire from the cutting head, and a plurality of guide rollers for guiding the wire which are arranged between the wire supply spool and the cutting head and between the cutting head and the wire take-up spool, wherein each of the guide rollers has a peripheral groove having a square-shaped section with a width of 2-20 times the diameter of the wire, and the number of turns of the wire which is wrapped around each guide roller in the groove having a square-shaped section is not less than 1 and not more than 5.
摘要翻译：一种不易受到电线松动和破损的线锯装置，包括一个供线卷轴，一个具有多个主辊的切割头，围绕着丝线供给卷轴缠绕着一根丝线，一个卷绕线用于从切割头取出线的卷轴，以及用于引导布线在供线卷轴和切割头之间以及切割头和卷绕线轴之间的线的多个导辊，其中每个引导辊具有周向槽，该槽具有宽度为线的直径的2-20倍的方形截面，并且缠绕在槽中的每个引导辊周围的线的匝数具有方形截面不小于1但不大于5。

4. 发明授权

US5715807A Wire saw 失效
标题翻译：线锯
公开(公告)号：US5715807A
公开(公告)日：1998-02-10
申请号：US628038
申请日：1996-04-04
申请人： Kouhei Toyama , Etsuo Kiuchi , Kazuo Hayakawa
发明人： Kouhei Toyama , Etsuo Kiuchi , Kazuo Hayakawa
IPC分类号： B24B27/06 , B28D5/00 , B28D5/04 , B28D1/08
CPC分类号： B28D5/045 , B28D5/0058
摘要： A wire saw for slicing a semiconductor single crystal ingot with which alignment of the crystallographic orientation of the ingot is simple and easy in a slicing process and a method for slicing the ingot by means of the wire saw. Main rollers are three-dimensionally arranged with a predetermined distance between each other, and a wire runs over the main rollers to form arrays of wire portions parallel to each other, with said wire saw an ingot being sliced into rods by pressing it to an array of wire portions between a pair of main rollers that are used to slice the ingot, while the wire is being driven and slurry is fed to the array of wire portions between the pair of main rollers, wherein the wire runs over the pair of main rollers used for slicing in a ratio of one turn over the pair of main rollers to more than one turn over the other main roller or rollers so that the array of wire portions running over the pair of main rollers used for slicing can be arranged at a desired pitch.
摘要翻译：一种用于切割半导体单晶锭的线锯，其中在切割过程中锭的晶体取向的取向是简单和容易的，以及通过线锯切割锭的方法。主辊三维地布置有彼此之间的预定距离，并且电线在主辊上延伸以形成彼此平行的电线部分阵列，所述线锯通过将锭子压入阵列而被切成棒状在用于切割锭子的一对主辊之间的线部分中的线被驱动并且浆料被馈送到在一对主辊之间的线部分阵列中，其中线在一对主辊上延伸用于在一对主辊上以一匝的比例切割成超过另一个主辊或辊的多于一个匝，使得在用于切片的一对主辊上延伸的丝线部分阵列可以被布置成期望的沥青。

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