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    • 1. 发明申请
    • REDOX CAPACITOR AND MANUFACTURING METHOD THEREOF
    • REDOX电容器及其制造方法
    • US20110073991A1
    • 2011-03-31
    • US12891461
    • 2010-09-27
    • Kazutaka KurikiKiyofumi OginoYumiko SaitoJunichiro Sakata
    • Kazutaka KurikiKiyofumi OginoYumiko SaitoJunichiro Sakata
    • H01L27/08H01L21/02
    • H01G11/02H01G9/038H01G9/22H01G11/28H01G11/56H01G11/68H01G11/70H01G11/84H01L21/02565H01L21/02631H01L28/40Y02E60/13
    • To provide a redox capacitor that can be used at room temperature and a manufacturing method thereof. Amorphous semiconductor including hydrogen is used as an electrolyte of a redox capacitor. As a typical example of the amorphous semiconductor including hydrogen, an amorphous semiconductor including a semiconductor element such as amorphous silicon, amorphous silicon germanium, or amorphous germanium can be used. As another example of the amorphous semiconductor including hydrogen, oxide semiconductor including hydrogen can be used. As typical examples of the oxide semiconductor including hydrogen, an amorphous semiconductor including a single-component oxide semiconductor such as zinc oxide, titanium oxide, nickel oxide, vanadium oxide, and indium oxide can be given. As another example of oxide semiconductor including hydrogen, a multi-component oxide semiconductor such as InMO3(ZnO)m (m>0 and M is one or more metal elements selected from Ga, Fe, Ni, Mn, and Co) can be used.
    • 提供可在室温下使用的氧化还原电容器及其制造方法。 包括氢的非晶半导体被用作氧化还原电容器的电解质。 作为包括氢的非晶半导体的典型实例,可以使用包括诸如非晶硅,非晶硅锗或无定形锗的半导体元件的非晶半导体。 作为包括氢的非晶半导体的另一例子,可以使用包括氢的氧化物半导体。 作为包括氢的氧化物半导体的典型实例,可以给出包括氧化锌,氧化钛,氧化镍,氧化钒和氧化铟等单组分氧化物半导体的非晶半导体。 作为包含氢的氧化物半导体的另一个实例,可以使用诸如InMO 3(ZnO)m(m> 0和M是选自Ga,Fe,Ni,Mn和Co中的一种或多种金属元素)的多组分氧化物半导体 。
    • 7. 发明授权
    • Semiconductor device and manufacturing method for the same
    • 半导体器件及其制造方法相同
    • US08946700B2
    • 2015-02-03
    • US13552805
    • 2012-07-19
    • Kengo AkimotoJunichiro SakataShunpei Yamazaki
    • Kengo AkimotoJunichiro SakataShunpei Yamazaki
    • H01L29/786H01L27/12
    • H01L29/78618H01L27/1225H01L29/7869
    • An object is to provide a method for manufacturing a highly reliable semiconductor device including thin film transistors which have stable electric characteristics and are formed using an oxide semiconductor. A method for manufacturing a semiconductor device includes the steps of: forming an oxide semiconductor film over a gate electrode with a gate insulating film interposed between the oxide semiconductor film and the gate electrode, over an insulating surface; forming a first conductive film including at least one of titanium, molybdenum, and tungsten, over the oxide semiconductor film; forming a second conductive film including a metal having lower electronegativity than hydrogen, over the first conductive film; forming a source electrode and a drain electrode by etching of the first conductive film and the second conductive film; and forming an insulating film in contact with the oxide semiconductor film, over the oxide semiconductor film, the source electrode, and the drain electrode.
    • 本发明的目的是提供一种用于制造具有稳定电特性并使用氧化物半导体形成的薄膜晶体管的高可靠性半导体器件的方法。 一种制造半导体器件的方法包括以下步骤:在绝缘表面上,在栅极上形成氧化物半导体膜,其中栅极绝缘膜置于氧化物半导体膜和栅电极之间; 在所述氧化物半导体膜上形成包括钛,钼和钨中的至少一种的第一导电膜; 在所述第一导电膜上形成包含具有比氢更低的电负性的金属的第二导电膜; 通过蚀刻第一导电膜和第二导电膜形成源电极和漏电极; 以及在所述氧化物半导体膜,所述源电极和所述漏极上形成与所述氧化物半导体膜接触的绝缘膜。