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1. 发明授权

US06312316B1 Chemical mechanical polishing apparatus and method 失效
公开(公告)号：US06312316B1
公开(公告)日：2001-11-06
申请号：US09306822
申请日：1999-05-07
申请人： Kazuo Takahashi , Matsuomi Nishimura , Kyoichi Miyazaki , Shinzo Uchiyama
发明人： Kazuo Takahashi , Matsuomi Nishimura , Kyoichi Miyazaki , Shinzo Uchiyama
IPC分类号： B24B722
CPC分类号： B24B37/26 , B24B27/0076 , B24B37/20 , B24B41/047
摘要： A chemical mechanical polishing apparatus and method can polish a surface of an object very precisely at a high speed irrespective of the presence of a local defect on the surface to be polished. By using a multiplex ring-shaped polishing pad, an effective surface to be polished is increased, and very precise and uniform polishing can be performed at a high speed. By using a plurality of polishing pads, having different diameters smaller than the diameter of the surface to be polished, provided with an interval on the same revolution radius on a revolution table, or by using a plurality of polishing pads, having the same diameter smaller than the diameter of the surface to be polished, provided at positions having different revolution radii on a revolution table, very precise and uniform polishing can be performed.

2. 发明授权

US06179695B2 Chemical mechanical polishing apparatus and method 失效
标题翻译：化学机械抛光装置及方法
公开(公告)号：US06179695B2
公开(公告)日：2001-01-30
申请号：US08853418
申请日：1997-05-09
申请人： Kazuo Takahashi , Matsuomi Nishimura , Kyoichi Miyazaki , Shinzo Uchiyama
发明人： Kazuo Takahashi , Matsuomi Nishimura , Kyoichi Miyazaki , Shinzo Uchiyama
IPC分类号： B24B722
CPC分类号： B24B37/26 , B24B27/0076 , B24B37/20 , B24B41/047
摘要： A chemical mechanical polishing apparatus and method can polish a surface of an object very precisely at a high speed irrespective of the presence of a local defect on the surface to be polished. By using a multiplex ring-shaped polishing pad, an effective surface to be polished is increased, and very precise and uniform polishing can be performed at a high speed. By using a plurality of polishing pads, having different diameters smaller than the diameter of the surface to be polished, provided with an interval on the same revolution radius on a revolution table, or by using a plurality of polishing pads, having the same diameter smaller than the diameter of the surface to be polished, provided at positions having different revolution radii on a revolution table, very precise and uniform polishing can be performed.
摘要翻译：化学机械抛光装置和方法可以非常精确地以高速度抛光物体的表面，而不管在待抛光表面上是否存在局部缺陷。通过使用多重环形抛光垫，可以提高有效的抛光面，能够高精度地进行高精度的均匀研磨。通过使用多个抛光垫，其具有小于待抛光表面的直径的直径小于在旋转台上具有相同的旋转半径的间隔，或者通过使用具有相同直径的较小的抛光垫比在旋转台上具有不同旋转半径的位置处的抛光表面的直径可以进行非常精确和均匀的抛光。

3. 发明授权

US06629882B2 Precise polishing apparatus and method 失效
公开(公告)号：US06629882B2
公开(公告)日：2003-10-07
申请号：US09970302
申请日：2001-10-04
申请人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura , Shinzo Uchiyama , Takashi Kamono
发明人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura , Shinzo Uchiyama , Takashi Kamono
IPC分类号： B24B2900
CPC分类号： B24B37/105 , B24B47/10 , B24B49/12 , H01L21/00 , H01L21/68764
摘要： The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in conditions that a center of the polished body is deviated from a rotation axis of the polishing pad and that the polishing pad is contacted with the entire polished surface of the polished body. The polished body may be a semi-conductor wafer.

4. 发明授权

US06390903B1 Precise polishing apparatus and method 失效
公开(公告)号：US06390903B1
公开(公告)日：2002-05-21
申请号：US09044147
申请日：1998-03-19
申请人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura , Shinzo Uchiyama , Takashi Kamono
发明人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura , Shinzo Uchiyama , Takashi Kamono
IPC分类号： B24B2900
CPC分类号： B24B37/105 , B24B47/10 , B24B49/12 , H01L21/00 , H01L21/68764
摘要： The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in conditions that a center of the polished body is deviated from a rotation axis of the polishing pad and that the polishing pad is contacted with the entire polished surface of the polished body. The polished body may be a semi-conductor wafer.

5. 发明授权

US06352469B1 Polishing apparatus with slurry screening 失效
标题翻译：抛光设备用浆料筛选
公开(公告)号：US06352469B1
公开(公告)日：2002-03-05
申请号：US09433067
申请日：1999-11-03
申请人： Kyoichi Miyazaki , Matsuomi Nishimura , Kazuo Takahashi
发明人： Kyoichi Miyazaki , Matsuomi Nishimura , Kazuo Takahashi
IPC分类号： B24B700
CPC分类号： B24B37/04 , B24B57/02 , Y10S451/91
摘要： A polishing apparatus and a polishing method can effectively prevent large diameter particles from being fed with slurry to an object to be polished. A large-diameter particle screener blocks or disperses large diameter particles from entering the slurry. Then, slurry free from large diameter particles is taken up from a slurry container by an intake pipe and fed to the object to be polished.
摘要翻译：抛光装置和抛光方法可以有效地防止大直径颗粒向被抛光物体供给浆料。大直径颗粒筛选器阻挡或分散大直径颗粒进入浆料。然后，通过进气管从浆料容器中吸收没有大直径颗粒的浆料并供给到待抛光对象物。

6. 发明授权

US6162112A Chemical-mechanical polishing apparatus and method 失效
标题翻译：化学机械抛光装置及方法
公开(公告)号：US6162112A
公开(公告)日：2000-12-19
申请号：US883628
申请日：1997-06-26
申请人： Kyoichi Miyazaki , Matsuomi Nishimura , Kazuo Takahashi
发明人： Kyoichi Miyazaki , Matsuomi Nishimura , Kazuo Takahashi
IPC分类号： B24B37/04 , B24B1/00
CPC分类号： B24B37/105 , B24B37/042
摘要： A chemical-mechanical polishing apparatus for polishing a workpiece. The apparatus includes a rotatable table having a surface for holding a workpiece to be polished, a table drive mechanism for rotating the rotating table, a polishing tool rotatable around a rotation axis and being rectilinearly movable in an axial direction along the rotation axis, a polishing tool drive mechanism for rotating and rectilinearly moving the polishing tool, the polishing tool drive mechanism pressing the polishing tool against the workpiece to be polished at a predetermined pressure, a supply for supplying an abrasive material between the polishing tool and the workpiece to be polished, and a foreign substance removing device for removing a foreign substance on the surface of the table. The removing device is located rotationally downstream of the table relative to the polishing tool.
摘要翻译：一种用于抛光工件的化学机械抛光装置。该设备包括：具有用于保持要抛光的工件的表面的旋转工作台，用于使旋转台旋转的工作台驱动机构，可绕旋转轴线旋转并可沿着旋转轴沿轴向直线移动的抛光工具;抛光用于旋转和直线移动抛光工具的工具驱动机构，抛光工具驱动机构以预定压力将抛光工具压靠待抛光的工件，用于在抛光工具和待抛光工件之间供应磨料的供应，以及用于去除桌子表面上的异物的异物去除装置。移除装置相对于抛光工具旋转地位于桌子的下游。

7. 发明授权

US06183345B2 Polishing apparatus and method 失效
标题翻译：抛光设备和方法
公开(公告)号：US06183345B2
公开(公告)日：2001-02-06
申请号：US09045651
申请日：1998-03-20
申请人： Takashi Kamono , Matsuomi Nishimura , Kazuo Takahashi , Osamu Ikeda , Satoshi Ohta
发明人： Takashi Kamono , Matsuomi Nishimura , Kazuo Takahashi , Osamu Ikeda , Satoshi Ohta
IPC分类号： B24B2900
CPC分类号： B24B37/013 , B24B27/0023 , B24B27/0076 , B24B37/042
摘要： In order to efficiently polish a large-area member to be polished to a desired shape, a polishing apparatus includes a first polishing station including a first holding unit for holding a member to be polished in a state in which a surface to be polished thereof is upwardly placed, and a first polishing head for holding and rotating a polishing pad whose polishing surface is larger than the surface to be polished in a state of contacting the surface to be polished, a detection station for detecting a polished state of the surface to be polished in a state in which the surface to be polished is upwardly placed, and a second polishing station including a second holding unit for holding the member to be polished in a state in which the surface to be polished thereof is upwardly placed, and a second polishing head for holding and rotating a polishing pad whose polishing surface is smaller than the surface to be polished in a state of contacting the surface to be polished.
摘要翻译：为了将要抛光的大面积构件有效地研磨成所需的形状，抛光装置包括：第一抛光站，包括：第一保持单元，用于在要抛光的表面被抛光的状态下保持要抛光的构件向上放置的第一抛光头，以及用于保持和旋转抛光表面的抛光表面大于待抛光表面的抛光表面的第一抛光头，用于检测表面抛光状态的检测站在抛光表面被向上放置的状态下被抛光;以及第二抛光台，其包括第二保持单元，用于在待抛光表面向上放置的状态下保持待抛光元件，抛光头，用于在与要抛光的表面接触的状态下保持和旋转其研磨表面小于待抛光表面的抛光垫。

8. 发明授权

US06776691B2 Polishing/cleaning method as well as method of making a wiring section using a polishing apparatus 失效
标题翻译：抛光/清洁方法以及使用抛光装置制造布线部分的方法
公开(公告)号：US06776691B2
公开(公告)日：2004-08-17
申请号：US09971692
申请日：2001-10-09
申请人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
发明人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
IPC分类号： B24B100
CPC分类号： H01L21/67028 , B08B3/00 , B08B3/04 , B08B2203/005 , B24B37/04 , B24B57/02 , Y10T29/49165
摘要： A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit and the cleaning unit have means for isolating the internal atmosphere from the external atmosphere and the cleaning unit has a means for cleaning the polished object by bringing hot pure water or steam of pure water into contact with the polished object. With a cleaning method hot pure water is brought into contact with the polished object without drying it after having been polished by such a polishing apparatus.
摘要翻译：能够有效且高效地除去钾等碱金属的研磨装置，通过研磨剂和用于清洗抛光物的清洗单元，一体地研磨用于研磨物体的研磨单元。抛光单元和清洁单元具有用于将内部空气与外部空气隔离的装置，并且清洁单元具有通过使热纯水或纯水蒸汽与抛光对象接触来清洁抛光对象的装置。通过清洗方法，在通过这种抛光装置抛光之后，使热纯水与抛光物体接触而不干燥。

9. 发明授权

US06332835B1 Polishing apparatus with transfer arm for moving polished object without drying it 有权
标题翻译：抛光装置带有转移臂，用于移动抛光对象而不干燥
公开(公告)号：US06332835B1
公开(公告)日：2001-12-25
申请号：US09193858
申请日：1998-11-18
申请人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
发明人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
IPC分类号： B24B700
CPC分类号： H01L21/67028 , B08B3/00 , B08B3/04 , B08B2203/005 , B24B37/04 , B24B57/02 , Y10T29/49165
摘要： A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit and the cleaning unit have means for isolating the internal atmosphere from the external atmosphere and the cleaning unit has a means for cleaning the polished object by bringing hot pure water or steam of pure water into contact with the polished object. With a cleaning method hot pure water is brought into contact with the polished object without drying it after having been polished by such a polishing apparatus.
摘要翻译：能够有效且高效地除去钾等碱金属的研磨装置，通过研磨剂和用于清洗抛光物的清洗单元，一体地研磨用于研磨物体的研磨单元。抛光单元和清洁单元具有用于将内部空气与外部空气隔离的装置，并且清洁单元具有通过使热纯水或纯水蒸汽与抛光对象接触来清洁抛光对象的装置。通过清洗方法，在通过这种抛光装置抛光之后，使热纯水与抛光物体接触而不干燥。

10. 发明授权

US06149500A Precision polishing method using hermetically sealed chambers 失效
标题翻译：精密抛光方法采用气密密封腔
公开(公告)号：US06149500A
公开(公告)日：2000-11-21
申请号：US304629
申请日：1999-05-04
申请人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura
发明人： Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura
IPC分类号： B24B37/34 , B24B55/00 , B24B1/00
CPC分类号： B24B37/345 , B24B55/00
摘要： A precision polishing apparatus has a first hermetically sealed chamber provided with polishing means, a third hermetically sealed chamber capable of communicating with the first hermetically sealed chamber through a second hermetically sealed chamber, first and second opening-closing means for alternately placing the first and the third hermetically sealed chamber in communication with the second hermetically sealed chamber, and atmosphere pressure control means for controlling the atmosphere pressure of the first and the second hermetically sealed chamber so that the atmosphere pressure of the first hermetically sealed chamber may become lower than the atmosphere pressure of the second hermetically sealed chamber when at least the first opening-closing means is opened.
摘要翻译：精密抛光装置具有设置有抛光装置的第一密封室，能够通过第二密封室与第一密封室连通的第三密封室，第一和第二打开 - 关闭装置，用于交替地放置第一和第二密封室与第二密封室连通的第三密封室，以及用于控制第一和第二密封室的气氛压力的大气压力控制装置，使得第一密封室的气氛压力可能变得低于大气压力的至少第一开闭装置被打开。

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