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1. 发明授权

US06776691B2 Polishing/cleaning method as well as method of making a wiring section using a polishing apparatus 失效
标题翻译：抛光/清洁方法以及使用抛光装置制造布线部分的方法
公开(公告)号：US06776691B2
公开(公告)日：2004-08-17
申请号：US09971692
申请日：2001-10-09
申请人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
发明人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
IPC分类号： B24B100
CPC分类号： H01L21/67028 , B08B3/00 , B08B3/04 , B08B2203/005 , B24B37/04 , B24B57/02 , Y10T29/49165
摘要： A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit and the cleaning unit have means for isolating the internal atmosphere from the external atmosphere and the cleaning unit has a means for cleaning the polished object by bringing hot pure water or steam of pure water into contact with the polished object. With a cleaning method hot pure water is brought into contact with the polished object without drying it after having been polished by such a polishing apparatus.
摘要翻译：能够有效且高效地除去钾等碱金属的研磨装置，通过研磨剂和用于清洗抛光物的清洗单元，一体地研磨用于研磨物体的研磨单元。抛光单元和清洁单元具有用于将内部空气与外部空气隔离的装置，并且清洁单元具有通过使热纯水或纯水蒸汽与抛光对象接触来清洁抛光对象的装置。通过清洗方法，在通过这种抛光装置抛光之后，使热纯水与抛光物体接触而不干燥。

2. 发明授权

US06332835B1 Polishing apparatus with transfer arm for moving polished object without drying it 有权
标题翻译：抛光装置带有转移臂，用于移动抛光对象而不干燥
公开(公告)号：US06332835B1
公开(公告)日：2001-12-25
申请号：US09193858
申请日：1998-11-18
申请人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
发明人： Matsuomi Nishimura , Mikichi Ban , Kazuo Takahashi , Osamu Ikeda
IPC分类号： B24B700
CPC分类号： H01L21/67028 , B08B3/00 , B08B3/04 , B08B2203/005 , B24B37/04 , B24B57/02 , Y10T29/49165
摘要： A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit and the cleaning unit have means for isolating the internal atmosphere from the external atmosphere and the cleaning unit has a means for cleaning the polished object by bringing hot pure water or steam of pure water into contact with the polished object. With a cleaning method hot pure water is brought into contact with the polished object without drying it after having been polished by such a polishing apparatus.
摘要翻译：能够有效且高效地除去钾等碱金属的研磨装置，通过研磨剂和用于清洗抛光物的清洗单元，一体地研磨用于研磨物体的研磨单元。抛光单元和清洁单元具有用于将内部空气与外部空气隔离的装置，并且清洁单元具有通过使热纯水或纯水蒸汽与抛光对象接触来清洁抛光对象的装置。通过清洗方法，在通过这种抛光装置抛光之后，使热纯水与抛光物体接触而不干燥。

3. 发明授权

US06183345B2 Polishing apparatus and method 失效
标题翻译：抛光设备和方法
公开(公告)号：US06183345B2
公开(公告)日：2001-02-06
申请号：US09045651
申请日：1998-03-20
申请人： Takashi Kamono , Matsuomi Nishimura , Kazuo Takahashi , Osamu Ikeda , Satoshi Ohta
发明人： Takashi Kamono , Matsuomi Nishimura , Kazuo Takahashi , Osamu Ikeda , Satoshi Ohta
IPC分类号： B24B2900
CPC分类号： B24B37/013 , B24B27/0023 , B24B27/0076 , B24B37/042
摘要： In order to efficiently polish a large-area member to be polished to a desired shape, a polishing apparatus includes a first polishing station including a first holding unit for holding a member to be polished in a state in which a surface to be polished thereof is upwardly placed, and a first polishing head for holding and rotating a polishing pad whose polishing surface is larger than the surface to be polished in a state of contacting the surface to be polished, a detection station for detecting a polished state of the surface to be polished in a state in which the surface to be polished is upwardly placed, and a second polishing station including a second holding unit for holding the member to be polished in a state in which the surface to be polished thereof is upwardly placed, and a second polishing head for holding and rotating a polishing pad whose polishing surface is smaller than the surface to be polished in a state of contacting the surface to be polished.
摘要翻译：为了将要抛光的大面积构件有效地研磨成所需的形状，抛光装置包括：第一抛光站，包括：第一保持单元，用于在要抛光的表面被抛光的状态下保持要抛光的构件向上放置的第一抛光头，以及用于保持和旋转抛光表面的抛光表面大于待抛光表面的抛光表面的第一抛光头，用于检测表面抛光状态的检测站在抛光表面被向上放置的状态下被抛光;以及第二抛光台，其包括第二保持单元，用于在待抛光表面向上放置的状态下保持待抛光元件，抛光头，用于在与要抛光的表面接触的状态下保持和旋转其研磨表面小于待抛光表面的抛光垫。

4. 发明授权

US06299506B1 Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using 失效
公开(公告)号：US06299506B1
公开(公告)日：2001-10-09
申请号：US09044146
申请日：1998-03-19
申请人： Matsuomi Nishimura , Osamu Ikeda , Satoshi Ohta , Shinzo Uchiyama
发明人： Matsuomi Nishimura , Osamu Ikeda , Satoshi Ohta , Shinzo Uchiyama
IPC分类号： B24B4902
摘要： A polishing apparatus includes a holder for holding a polished body with a polished surface thereof facing upwardly, and a polishing head for holding a polishing pad having a polishing surface having an area smaller than an area of the polished surface while contacting the polishing pad with the polished surface and for rotating the polishing pad around its rotation axis. The polishing head is provided with a driver for revolving the polishing pad around a revolution axis, and the revolution axis and the rotation axis are positioned so that a distance between the revolution axis and the rotation axis becomes smaller than a radius of the polishing pad.

5. 发明授权

US08525330B2 Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer 有权
标题翻译：用于连接半导体元件和框架的连接构件，由Al基层和设置在Al基层的表面上的第一和第二Zn基层形成
公开(公告)号：US08525330B2
公开(公告)日：2013-09-03
申请号：US13382633
申请日：2010-08-30
申请人： Masahide Okamoto , Osamu Ikeda , Yuki Murasato
发明人： Masahide Okamoto , Osamu Ikeda , Yuki Murasato
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： C22C18/04 , B22F2998/00 , B23K1/0016 , B23K2101/42 , B32B15/017 , C22C21/00 , C22C21/06 , H01L23/04 , H01L23/3107 , H01L23/49582 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29147 , H01L2224/29211 , H01L2224/2929 , H01L2224/29299 , H01L2224/29347 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2924/00013 , H01L2924/00014 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/10253 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/351 , Y10T29/49826 , Y10T428/12736 , B22F7/062 , H01L2924/0105 , H01L2924/00012 , H01L2924/01013 , H01L2924/0103 , H01L2924/01032 , H01L2924/01014 , H01L2924/01083 , H01L2924/01031 , H01L2924/01082 , H01L2924/01049 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599
摘要： Provided is a connecting part for a semiconductor device including a semiconductor element, a frame, and a connecting part which connects the semiconductor element and the frame to each other, in which an interface between the connecting part and the semiconductor element and an interface between the connecting part and the frame respectively have the area of Al oxide film which is more than 0% and less than 5% of entire area of the respective interfaces. The connecting part has an Al-based layer and first and second Zn-based layers on main surfaces of the Al-based layer, a thickness ratio of the Al-based layer relative to the Zn-based layers being less than 0.59.
摘要翻译：提供了一种半导体器件的连接部件，其包括半导体元件，框架和将半导体元件和框架彼此连接的连接部分，其中连接部分和半导体元件之间的界面和连接部和框架分别具有比各界面的整个面积大于0％且小于5％的Al氧化物膜的面积。连接部分在Al基层的主表面上具有Al基层和第一和第二Zn基层，Al基层相对于Zn基层的厚度比小于0.59。

6. 发明申请

US20110037694A1 IMAGE PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：图像处理装置和方法
公开(公告)号：US20110037694A1
公开(公告)日：2011-02-17
申请号：US12898570
申请日：2010-10-05
申请人： Masahiro Juen , Kenji Toyoda , Osamu Ikeda , Hisato Ide
发明人： Masahiro Juen , Kenji Toyoda , Osamu Ikeda , Hisato Ide
IPC分类号： G06F3/033
CPC分类号： G06F3/033 , G06F3/04845 , G06T1/00 , H04N1/00352 , H04N1/00397 , H04N1/00411 , H04N2101/00
摘要： An image processing apparatus provided with a display unit for displaying an operation picture, showing control indicia (e.g., icons) corresponding to multiple image processing functions, is operated to display the operation picture on an external display device. The operator selects one of the indicia shown on the external display device by operating an input device, such as touch screen of the apparatus or a remote control, to indicate the position of the desired one of the indicia. The operator can thereby quickly and reliably select an image processing function to be executed, without any need to view an operation picture on the display unit when making the selection.
摘要翻译：操作具有用于显示操作画面的显示单元的图像处理设备，显示与多个图像处理功能对应的控制标记（例如，图标），以在外部显示设备上显示操作画面。操作者通过操作诸如设备的触摸屏或遥控器的输入设备来指示所需的一个标记的位置来选择外部显示设备上所示的一个标记。因此，操作者能够快速，可靠地选择要执行的图像处理功能，而不需要在进行选择时在显示单元上观看操作画面。

7. 发明授权

US07719106B2 Semiconductor device, electronic card and pad rearrangement substrate 失效
标题翻译：半导体器件，电子卡和衬垫重排衬底
公开(公告)号：US07719106B2
公开(公告)日：2010-05-18
申请号：US11780375
申请日：2007-07-19
申请人： Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
发明人： Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
IPC分类号： H01L23/12
CPC分类号： H01L23/49855 , G06K19/077 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05599 , H01L2224/16227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring pattern, and an antenna pattern. The antenna pattern provided at each of adjacent two corner portions of the substrate and is grounded.
摘要翻译：半导体器件包括衬底，设置在衬底上的外部端子，与外部端子电连接的内部布线图案，安装在衬底上并电连接到内部布线图案的半导体芯片和天线图案。天线图案设置在基板的相邻两个角部的每一个处并接地。

8. 发明授权

US07338273B2 Cutter machine 有权
标题翻译：切割机
公开(公告)号：US07338273B2
公开(公告)日：2008-03-04
申请号：US10437063
申请日：2003-05-14
申请人： Masashi Konno , Nobuki Nagami , Yasuo Yoshii , Osamu Ikeda , Yoshiaki Nakata , Kazuo Iritani
发明人： Masashi Konno , Nobuki Nagami , Yasuo Yoshii , Osamu Ikeda , Yoshiaki Nakata , Kazuo Iritani
IPC分类号： B29B9/00 , B29C47/08 , F16D3/26 , B26D7/26
CPC分类号： B29B9/065 , B26D1/28 , B26D7/2628 , B29B9/06 , Y10S83/913 , Y10T83/9319 , Y10T83/9379 , Y10T83/9464
摘要： A cutter machine has a knife holder 13 mounted onto a cutter shaft 6 at the center portion, wherein a material to be cut is cut with knives 15 mounted onto the outer circumference of the knife holder 13 by rotating the knife holder 13 around the cutter shaft 6. The knife holder 13 is separated into a fixing member 17 mounted onto the cutter shaft 6 and a mounting member 18 onto which the knives 15 are mounted. The mounting member 18 is pivotally supported around two axes with respect to the fixing member 17. In the cutter machine, the knives and a die plate come into contact with each other by a small press force of the knives, thereby enabling a satisfactory cutting to be obtained.
摘要翻译：切割机具有在中心部分安装到切割器轴6上的刀架13，其中通过将刀架13围绕切割轴旋转而切割安装在刀架13的外周上的刀15切割的材料 6。刀架13被分离成安装在刀轴6上的固定件17和安装件18，刀架15安装在该安装件18上。安装构件18相对于固定构件17围绕两个轴线枢转地支撑。在切割机中，通过刀的小的压力使刀和模板彼此接触，从而能够获得令人满意的切割。

9. 发明申请

US20080025701A1 Image signal recording/reproduction apparatus, method employed therein, and image signal recording apparatus 审中-公开
标题翻译：图像信号记录/再现装置，其中采用的方法和图像信号记录装置
公开(公告)号：US20080025701A1
公开(公告)日：2008-01-31
申请号：US11898455
申请日：2007-09-12
申请人： Osamu Ikeda
发明人： Osamu Ikeda
IPC分类号： H04N5/76 , H04N5/225
CPC分类号： H04N5/232 , H04N5/23245 , H04N5/772 , H04N5/85 , H04N9/7921 , H04N9/8063 , H04N9/8227
摘要： A dynamic image recording button and a still image recording button are provided at the main unit of a movie camera. A magneto-optical recording medium is loaded in a slot. If the dynamic image recording button or the still image recording button is operated during a reproduction operation, the reproduction operation is interrupted in a state in which the mechanical drive (rotation) of the magneto-optical recording medium is sustained. At this point, a dynamic image signal or a still image signal obtained through a photographing operation performed at the camera unit is temporarily recorded in a buffer memory, and is written in the magneto-optical recording medium when a write in the magneto-optical recording medium becomes enabled. Instructions to record dynamic images and to record still images can be issued to the movie camera through a touch-panel provided on the screen of a liquid crystal display unit. Even when operation cannot be performed through the touch-panel, the instructions can be issued through the dynamic image recording button or the still image recording button.
摘要翻译：动画图像记录按钮和静止图像记录按钮设置在电影摄像机的主单元处。磁光记录介质装载在槽中。如果动态图像记录按钮或静止图像记录按钮在再现操作期间被操作，则在保持磁光记录介质的机械驱动（旋转）的状态下中断再现操作。此时，通过在相机单元执行的拍摄操作获得的动态图像信号或静止图像信号被临时记录在缓冲存储器中，并且当写入磁光记录时被写入磁光记录介质媒体启用通过设置在液晶显示单元的屏幕上的触摸面板，可以向摄像机发出用于记录动态图像和记录静止图像的指令。即使不能通过触摸面板执行操作，也可以通过动态图像记录按钮或静止图像记录按钮来发出指令。

10. 发明授权

US07253509B2 Semiconductor device, electronic card and pad rearrangement substrate 失效
公开(公告)号：US07253509B2
公开(公告)日：2007-08-07
申请号：US11005438
申请日：2004-12-06
申请人： Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
发明人： Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
IPC分类号： H01L23/02
CPC分类号： H01L23/49855 , G06K19/077 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05599 , H01L2224/16227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring pattern, and an antenna pattern. The antenna pattern provided at each of adjacent two corner portions of the substrate and is grounded.

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