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1. 发明授权

US07602262B2 Elastic wave device and manufacturing method of the same 失效
标题翻译：弹性波装置及其制造方法相同
公开(公告)号：US07602262B2
公开(公告)日：2009-10-13
申请号：US11730961
申请日：2007-04-05
申请人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
发明人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
IPC分类号： H03H9/00 , H03H9/10
CPC分类号： H03H9/72 , H03H3/08 , H03H9/0576 , H03H2250/00
摘要： An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.
摘要翻译：公开了一种通过在其间填充树脂来粘合至少两个表面声波装置而形成的弹性波装置。每个表面声波（SAW）器件包括衬底; 配置在所述基板上的功能部; 形成操作功能部分所需的空间部分的凹部和覆盖基板表面的封装以及至少两个SAW器件的封装的侧面，对应于通过填充树脂粘合的部分在至少两个SAW器件之间，包括至少一个切口，并且第一树脂覆盖所述至少两个SAW器件的基板的每个侧面，背面和前表面的一部分，并且第一树脂树脂填充在包装的侧面上的至少一个切口中。

2. 发明授权

US07541721B2 Acoustic wave device 失效
标题翻译：声波装置
公开(公告)号：US07541721B2
公开(公告)日：2009-06-02
申请号：US11941522
申请日：2007-11-16
申请人： Kazunori Inoue , Takashi Matsuda , Jyouji Kimura
发明人： Kazunori Inoue , Takashi Matsuda , Jyouji Kimura
IPC分类号： H01L21/00 , H01L41/047 , H03H9/25
CPC分类号： H03H9/059 , H01L2224/10126 , H01L2224/13565 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： An acoustic wave device includes an acoustic wave element formed on a piezoelectric substrate, and a terminal that makes an electric connection with an outside of the acoustic wave device. The terminal has a protrusion electrode having a side surface coated with a coating film having a non-coating portion.
摘要翻译：声波装置包括形成在压电基板上的声波元件和与声波装置的外部电连接的端子。端子具有突出电极，其具有涂覆有具有非涂覆部分的涂膜的侧表面。

3. 发明授权

US07841064B2 Method of manufacturing an acoustic wave device 失效
标题翻译：制造声波装置的方法
公开(公告)号：US07841064B2
公开(公告)日：2010-11-30
申请号：US11987173
申请日：2007-11-28
申请人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
发明人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
IPC分类号： H04R31/00
CPC分类号： H03H3/08 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908
摘要： A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.
摘要翻译：一种制造声波器件的方法包括在其上具有声波元件的衬底上形成第一密封部分，使得声波元件的声波振荡的功能区域用作第一非覆盖部分，用于个体化作为第二非覆盖部分的切割区域，在所述第一密封部分上形成第二密封部分以覆盖所述第一非覆盖部分和所述第二未覆盖部分，并且切断所述基板，并且所述第二密封部分密封部分，使得第二未覆盖部分被分割。

4. 发明授权

US07721411B2 Method of manufacturing an acoustic wave device 失效
标题翻译：制造声波装置的方法
公开(公告)号：US07721411B2
公开(公告)日：2010-05-25
申请号：US11987175
申请日：2007-11-28
申请人： Shunichi Aikawa , Jyouji Kimura , Keiji Tsuda , Kazunori Inoue , Takashi Matsuda
发明人： Shunichi Aikawa , Jyouji Kimura , Keiji Tsuda , Kazunori Inoue , Takashi Matsuda
IPC分类号： H04R31/00
CPC分类号： H03H3/08 , H03H9/1092 , Y10T29/42 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798
摘要： A method of manufacturing an acoustic wave device includes: forming a conductive pattern on a wafer made of a piezoelectric substrate having an acoustic wave element, the conductive pattern including a first conductive pattern being continuously formed on a cutting region for individuating the wafer, a second conductive pattern being formed on an electrode region where a plated electrode is to be formed and being connected to the acoustic wave element and a third conductive pattern connecting the first conductive pattern and the second pattern; forming an insulating layer on the wafer so as to have an opening on the second conductive pattern; forming the plated electrode on the second conductive pattern by providing an electrical current to the second conductive pattern via the first conductive pattern and the third conductive pattern; and cutting off and individuating the wafer along the cutting region.
摘要翻译：一种制造声波器件的方法包括：在由具有声波元件的压电基片制成的晶片上形成导电图案，所述导电图案包括连续形成在用于个别晶片的切割区域上的第一导电图案，第二导电图案形成在要形成镀覆电极的电极区域上，并连接到声波元件;连接第一导电图案和第二图案的第三导电图案; 在所述晶片上形成绝缘层，以在所述第二导电图案上具有开口; 通过经由第一导电图案和第三导电图案向第二导电图案提供电流，在第二导电图案上形成电镀电极; 并沿着切割区域切割和分离晶片。

5. 发明申请

US20080174207A1 ACOUSTIC WAVE DEVICE 有权
标题翻译：声波设备
公开(公告)号：US20080174207A1
公开(公告)日：2008-07-24
申请号：US12018460
申请日：2008-01-23
申请人： Keiji Tsuda , Jyouji Kimura , Shunichi Aikawa , Kazunori Inoue , Takashi Matsuda
发明人： Keiji Tsuda , Jyouji Kimura , Shunichi Aikawa , Kazunori Inoue , Takashi Matsuda
IPC分类号： H01L41/08
CPC分类号： H03H3/08 , H01L2224/11
摘要： An acoustic wave device includes an acoustic wave element formed on a substrate, a first seal portion provided on the substrate so as to form a cavity above the acoustic wave element, and a second seal portion provided on the first seal portion, the first seal portion having a step so that the first seal portion has a width on a first side and another width on a second side arranged so that the first side is closer than the second side to the substrate, and the width on the first side is greater than the another width on the second side.
摘要翻译：声波装置包括形成在基板上的声波元件，设置在基板上以在声波元件上方形成空腔的第一密封部分和设置在第一密封部分上的第二密封部分，第一密封部分具有使所述第一密封部在第一侧具有宽度，在所述第二侧具有第二侧的另一宽度，使得所述第一侧比所述基板的所述第二侧更靠近，所述第一侧的宽度大于所述第一侧的宽度第二侧的另一个宽度。

6. 发明申请

US20080116762A1 ACOUSTIC WAVE DEVICE 失效
标题翻译：声波设备
公开(公告)号：US20080116762A1
公开(公告)日：2008-05-22
申请号：US11941522
申请日：2007-11-16
申请人： Kazunori INOUE , Takashi Matsuda , Jyouji Kimura
发明人： Kazunori INOUE , Takashi Matsuda , Jyouji Kimura
IPC分类号： H01L41/047 , H03H9/64
CPC分类号： H03H9/059 , H01L2224/10126 , H01L2224/13565 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： An acoustic wave device includes an acoustic wave element formed on a piezoelectric substrate, and a terminal that makes an electric connection with an outside of the acoustic wave device. The terminal has a protrusion electrode having a side surface coated with a coating film having a non-coating portion.
摘要翻译：声波装置包括形成在压电基板上的声波元件和与声波装置的外部电连接的端子。端子具有突出电极，其具有涂覆有具有非涂覆部分的涂膜的侧表面。

7. 发明申请

US20080018414A1 Elastic wave device and manufacturing method of the same 失效
标题翻译：弹性波装置及其制造方法相同
公开(公告)号：US20080018414A1
公开(公告)日：2008-01-24
申请号：US11730961
申请日：2007-04-05
申请人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
发明人： Kazunori Inoue , Takashi Matsuda , Shogo Inoue , Xiaoyu Mi , Jyouji Kimura
IPC分类号： H03H9/72
CPC分类号： H03H9/72 , H03H3/08 , H03H9/0576 , H03H2250/00
摘要： An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.
摘要翻译：公开了一种通过在其间填充树脂来粘合至少两个表面声波装置而形成的弹性波装置。每个表面声波（SAW）器件包括衬底; 配置在所述基板上的功能部; 形成操作功能部分所需的空间部分的凹部和覆盖基板表面的封装以及至少两个SAW器件的封装的侧面，对应于通过填充树脂粘合的部分在至少两个SAW器件之间，包括至少一个切口，并且第一树脂覆盖所述至少两个SAW器件的基板的每个侧面，背面和前表面的一部分，并且第一树脂树脂填充在包装的侧面上的至少一个切口中。

8. 发明授权

US07629729B2 Surface acoustic wave device and fabrication method thereof 有权
标题翻译：表面声波装置及其制造方法
公开(公告)号：US07629729B2
公开(公告)日：2009-12-08
申请号：US11541787
申请日：2006-10-03
申请人： Kazunori Inoue , Takashi Matsuda , Jyouji Kimura
发明人： Kazunori Inoue , Takashi Matsuda , Jyouji Kimura
IPC分类号： H01L41/08
CPC分类号： H03H3/08 , H01L2224/11 , H03H9/059
摘要： A surface acoustic wave device includes a piezoelectric substrate, a surface acoustic wave element composed of electrodes provided on the piezoelectric substrate and the piezoelectric substrate, a first seal resin portion provided on the piezoelectric substrate and having a cavity on the surface acoustic wave element, and an inorganic insulation film provided in contact with a surface of the piezoelectric substrate to surround the surface acoustic wave element.
摘要翻译：表面声波装置包括压电基片，由压电基片上设置的电极和压电基片构成的表面声波元件，设置在压电基片上并在表面声波元件上具有空腔的第一密封树脂部分，以及设置为与所述压电基板的表面接触以包围所述表面声波元件的无机绝缘膜。

9. 发明授权

US07586240B2 Acoustic wave device 有权
标题翻译：声波装置
公开(公告)号：US07586240B2
公开(公告)日：2009-09-08
申请号：US12018460
申请日：2008-01-23
申请人： Keiji Tsuda , Jyouji Kimura , Shunichi Aikawa , Kazunori Inoue , Takashi Matsuda
发明人： Keiji Tsuda , Jyouji Kimura , Shunichi Aikawa , Kazunori Inoue , Takashi Matsuda
IPC分类号： H01L41/08
CPC分类号： H03H3/08 , H01L2224/11
摘要： An acoustic wave device includes an acoustic wave element formed on a substrate, a first seal portion provided on the substrate so as to form a cavity above the acoustic wave element, and a second seal portion provided on the first seal portion, the first seal portion having a step so that the first seal portion has a width on a first side and another width on a second side arranged so that the first side is closer than the second side to the substrate, and the width on the first side is greater than the another width on the second side.
摘要翻译：声波装置包括形成在基板上的声波元件，设置在基板上以在声波元件上方形成空腔的第一密封部分和设置在第一密封部分上的第二密封部分，第一密封部分具有使所述第一密封部在第一侧具有宽度，在所述第二侧具有第二侧的另一宽度，使得所述第一侧比所述基板的所述第二侧更靠近，所述第一侧的宽度大于所述第一侧的宽度第二侧的另一个宽度。

10. 发明申请

US20080125662A1 Acoustic wave device and method of manufacturing the same 失效
标题翻译：声波装置及其制造方法
公开(公告)号：US20080125662A1
公开(公告)日：2008-05-29
申请号：US11987173
申请日：2007-11-28
申请人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
发明人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
IPC分类号： A61B8/12 , H04R31/00
CPC分类号： H03H3/08 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908
摘要： A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.
摘要翻译：一种制造声波器件的方法包括在其上具有声波元件的衬底上形成第一密封部分，使得声波元件的声波振荡的功能区域用作第一非覆盖部分，用于个体化作为第二非覆盖部分的切割区域，在所述第一密封部分上形成第二密封部分以覆盖所述第一非覆盖部分和所述第二未覆盖部分，并且切断所述基板，并且所述第二密封部分密封部分，使得第二未覆盖部分被分割。

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