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    • 9. 发明授权
    • Distributed process simulator
    • 分布式流程模拟器
    • US08849625B2
    • 2014-09-30
    • US13367837
    • 2012-02-07
    • Takuro IkedaEiji KitagawaHiroshi Yamada
    • Takuro IkedaEiji KitagawaHiroshi Yamada
    • G06F17/50G08G1/01
    • G06F17/5009G06F17/5068G06F17/5095G08G1/0125
    • A simulator used in a distributed process simulation includes: a storage unit configured to store map information, agent information, and area allocation information; a simulation execution unit; a condition determination unit configured to determine the condition of the reference agent to be referenced by the simulation execution unit based on a movement state of the agent; an allocation discrimination unit configured to discriminate another computer allocated an area in which the reference agent corresponding to the condition can be located; and an agent information acquisition unit configured to acquire the information about the agent satisfying the condition of the reference agent from the other discriminated computer.
    • 在分布式处理仿真中使用的模拟器包括:存储单元,被配置为存储地图信息,代理信息和区域分配信息; 模拟执行单元; 条件确定单元,被配置为基于所述代理的移动状态来确定由所述模拟执行单元引用的参考代理的状态; 分配鉴别单元,被配置为区分分配了与条件相对应的参考代理可以位于其中的区域的另一计算机; 以及代理信息获取单元,被配置为从另一个判别计算机获取关于所述参考代理的条件的代理的信息。
    • 10. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08653612B2
    • 2014-02-18
    • US12438879
    • 2007-08-22
    • Kazuo OkadaKatsuhiko KitagawaHiroshi Yamada
    • Kazuo OkadaKatsuhiko KitagawaHiroshi Yamada
    • H01L29/84
    • H01L27/14625H01L23/3135H01L27/14618H01L31/0203H01L31/02325H01L2924/0002H01L2924/3025H01L2924/00
    • An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A device element 3 is formed on a front surface of a semiconductor substrate 4, and a sealing body 1 is attached to the semiconductor substrate 4 with an adhesive layer 6 being interposed therebetween. A main surface (a back surface) of the sealing body 1 which faces the semiconductor substrate 4 is curved inward, and there is a given space (a cavity 2) between the sealing body 1 and the semiconductor substrate 4. Since the back surface of the sealing body 1 is curved, the sealing body 1 is used as a planoconcave lens (a reverse direction) as well as a sealing member for the device element 3.
    • 本发明的目的是提供一种较小的半导体器件,其制造过程被简化并且制造成本降低。 此外,本发明的目的是提供一种具有空腔的半导体器件。 器件元件3形成在半导体衬底4的前表面上,并且密封体1被粘附在半导体衬底4上,其间夹有粘合剂层6。 密封体1的面向半导体基板4的主表面(背面)向内弯曲,并且在密封体1和半导体基板4之间具有给定的空间(空腔2)。由于背面 密封体1弯曲,密封体1用作平凸透镜(反方向)以及用于装置元件3的密封构件。