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    • 7. 发明授权
    • Method for forming tantalum nitride film
    • 形成氮化钽膜的方法
    • US08158198B2
    • 2012-04-17
    • US11885399
    • 2006-03-03
    • Narishi GonoheSatoru ToyodaHarunori UshikawaTomoyasu KondoKyuzo Nakamura
    • Narishi GonoheSatoru ToyodaHarunori UshikawaTomoyasu KondoKyuzo Nakamura
    • C23C16/00
    • H01L21/76843C23C16/34C23C16/45525C23C16/45534C23C16/45536C23C16/4554C23C16/45553H01L21/28562
    • A tantalum nitride film-forming method comprises the steps of introducing a raw gas consisting of a coordination compound constituted by an elemental tantalum (Ta) having a coordinated ligand represented by the general formula: N═(R,R′) (in the formula, R and R′ may be the same or different and each represents an alkyl group having 1 to 6 carbon atoms), and a halogen gas into a vacuum chamber; and reacting these components with one another on a substrate to thus form a surface adsorption film comprising a mono-atomic or multi (several)-atomic layer and composed of a compound represented by the following general formula: TaNx(Hal)y(R, R′)z (in the formula, Hal represents a halogen atom), then introducing radicals generated from an H atom-containing compound to thus remove Ta—N bonds present in the resulting compound through breakage thereof and remove, at the same time, the remaining R(R′) groups bonded to the N atoms present in the compound through the cleavage thereof and to thus form a tantalum nitride film rich in tantalum atoms. The resulting tantalum nitride film has a low resistance, low contents of C and N atoms, and a high compositional ratio: Ta/N, can ensure sufficiently high adherence to the distributing wire-forming film and can thus be useful as a barrier film. Moreover, tantalum particles are implanted in the resulting film according to the sputtering technique to thus further enrich the film with tantalum.
    • 氮化钽膜形成方法包括以下步骤:引入由具有由以下通式表示的配位配体的元素钽(Ta)构成的配位化合物构成的原料气体:N =(R,R')(式 R和R'可以相同或不同,各自表示碳原子数1〜6的烷基),卤素气体进入真空室; 并将这些组分彼此反应在基底上,从而形成包含单原子或多(多个)原子层的表面吸附膜,并由以下通式表示的化合物组成:TaNx(Hal)y(R, R')z(式中,Hal表示卤素原子),然后引入由含H原子的化合物产生的自由基,从而通过其残留除去所得化合物中存在的Ta-N键,同时除去 剩余的R(R')基团通过其切割而与化合物中存在的N原子键合,从而形成富含钽原子的氮化钽膜。 所得到的氮化钽膜具有低电阻,C原子和N原子含量低,组成比高:Ta / N可以确保足够高的附着线分布线形成膜,因此可用作阻挡膜。 此外,根据溅射技术将钽颗粒注入到所得的膜中,从而进一步用钽富集膜。