会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Gel pharmaceutical formulation for local anesthesia
    • 凝胶药物制剂局部麻醉
    • US5589192A
    • 1996-12-31
    • US353322
    • 1994-12-05
    • Hideaki OkabeEiji SuzukiMasao KogureTakanori Saito
    • Hideaki OkabeEiji SuzukiMasao KogureTakanori Saito
    • A61K9/70A61K31/165A61K31/167A61K31/245A61K45/00A61K47/32A61P23/02A61P25/02A61L15/00
    • A61K9/7061A61K31/245Y10S514/816Y10S514/818Y10S514/944Y10S514/946
    • An article of manufacture in the form of a gel pharmaceutical formulation for local anesthesia is prepared by a process comprising: coating a supporting substrate, which preferably is porous, e.g., a non-woven fabric, and has an impervious backing sheet, with a matrix of a copolymer of alkyl (meth)acrylates and (meth)acrylic acid and a local anesthetic whereby the matrix penetrates the substrate, crosslinking the copolymer in the matrix to form a polymer/drug matrix, and coating the surface of the matrix with an aqueous fluid, thereby converting the matrix into a gel and preferably covering the gel matrix with an impervious protective sheet. The product has excellent percutaneous absorption, provides local anesthesia easily just by attaching the formulation to the skin, enables elimination of various kinds of pain, such as the pain at the time of hypodermic injection, can be removed easily from the skin, and causes no soiling of fingers, hands or cloths.
    • 用于局部麻醉的凝胶药物制剂形式的制品是通过以下方法制备的,该方法包括:将优选为多孔的支撑基底(例如无纺织物)涂覆并具有不透水的背衬片, 的(甲基)丙烯酸烷基酯和(甲基)丙烯酸烷基酯和局部麻醉剂的共聚物,由此基质渗透底物,使基质中的共聚物交联以形成聚合物/药物基质,并用水性 从而将基质转化成凝胶,并且优选用不透水的保护片覆盖凝胶基质。 该产品具有优异的经皮吸收,通过将配方附着到皮肤上即可轻松提供局部麻醉,能够消除各种疼痛,如皮下注射时的疼痛,可以容易地从皮肤上清除,不会导致 弄脏手指,手或布。
    • 3. 发明授权
    • Heat treatment apparatus and heat treatment method
    • 热处理设备及热处理方法
    • US09324591B2
    • 2016-04-26
    • US13438234
    • 2012-04-03
    • Koji YoshiiTatsuya YamaguchiWenling WangTakanori Saito
    • Koji YoshiiTatsuya YamaguchiWenling WangTakanori Saito
    • F27D21/00H01L21/67
    • H01L21/67109H01L21/67248
    • A heat treatment apparatus including: a processing container for processing wafers held in a boat; heaters for heating the processing container; and a control section for controlling the heaters. Heater temperature sensors are provided between the heaters and the processing container, in-container temperature sensors are provided in the processing container, and movable temperature sensors are provided in the boat. The temperature sensors are connected to a temperature estimation section. The temperature estimation section selects two of the three types of temperature sensors, e.g. the movable temperature sensors and the in-container temperature sensors, and determines the temperature of a wafer according to the following formula: T=T1×(1−α)+T2×α, α>1, where T1 and T2 represent detection temperatures of the selected temperature sensors, and α represents a mixing ratio.
    • 一种热处理设备,包括:处理容器,用于处理保存在船上的晶片; 用于加热处理容器的加热器; 以及用于控制加热器的控制部。 加热器温度传感器设置在加热器和处理容器之间,容器内温度传感器设置在处理容器中,并且可移动的温度传感器设置在船上。 温度传感器连接到温度估计部。 温度估计部分选择三种类型的温度传感器中的两种,例如, 可移动温度传感器和容器内温度传感器,并根据以下公式确定晶片的温度:T = T1×(1-α)+ T2×α,α> 1,其中T1和T2表示检测温度 的选定温度传感器,α表示混合比。
    • 7. 发明申请
    • HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD
    • 热处理设备和热处理方法
    • US20120258415A1
    • 2012-10-11
    • US13438234
    • 2012-04-03
    • Koji YOSHIITatsuya YamaguchiWenling WangTakanori Saito
    • Koji YOSHIITatsuya YamaguchiWenling WangTakanori Saito
    • F27D21/00F27D3/00
    • H01L21/67109H01L21/67248
    • A heat treatment apparatus including: a processing container for processing wafers held in a boat; heaters for heating the processing container; and a control section for controlling the heaters. Heater temperature sensors are provided between the heaters and the processing container, in-container temperature sensors are provided in the processing container, and movable temperature sensors are provided in the boat. The temperature sensors are connected to a temperature estimation section. The temperature estimation section selects two of the three types of temperature sensors, e.g. the movable temperature sensors and the in-container temperature sensors, and determines the temperature of a wafer according to the following formula: T=T1×(1−α)+T2×α, α>1, where T1 and T2 represent detection temperatures of the selected temperature sensors, and α represents a mixing ratio.
    • 一种热处理设备,包括:处理容器,用于处理保存在船上的晶片; 用于加热处理容器的加热器; 以及用于控制加热器的控制部。 加热器温度传感器设置在加热器和处理容器之间,容器内温度传感器设置在处理容器中,并且可移动的温度传感器设置在船上。 温度传感器连接到温度估计部。 温度估计部分选择三种类型的温度传感器中的两种,例如, 可移动温度传感器和容器内温度传感器,并根据以下公式确定晶片的温度:T = T1×(1-α)+ T2×α,α> 1,其中T1和T2表示检测温度 的选定温度传感器,α表示混合比。
    • 9. 发明申请
    • Heat Treatment Apparatus, Heater, and Method for Manufacturing the Heater
    • 热处理装置,加热器及加热器制造方法
    • US20100224614A1
    • 2010-09-09
    • US12223162
    • 2007-02-07
    • Makoto KobayashiKenichi YamagaTakanori Saito
    • Makoto KobayashiKenichi YamagaTakanori Saito
    • F27D11/00H05B3/02
    • H01L21/67109H01L21/425Y10T29/49083
    • The present invention provides a heat treatment apparatus having a high degree of freedom of an outlet design and capable of adjusting the rate of a reduction in the temperature of each part of a heater without using an adjustment valve. The heat treatment apparatus having a simple flow path structure can be constructed with simplified sealing and a reduced cost.The heat treatment apparatus 1 includes a process chamber 2, a tubular heater 3, a heat exhaust system 25 and a cooling section 26. The process chamber 2 accommodates objects W to be placed in multiple stages and to be treated. A predetermined heat treatment is performed in the process chamber. The heater 3 surrounds an outer circumference of the process chamber 2 and heats the objects W to be treated. The heat exhaust system 25 is adapted to exhaust an atmosphere present in a space 24 existing between the heater 3 and the process chamber 2. The cooling section 26 is adapted to blow a cooling fluid into the space 24 to cool the atmosphere. The heater 3 includes a tubular heat insulator 17, a heat generating resistor 18 and an outer shell 20. The heat generating resistor 18 is provided on an inner circumference of the heat insulator 17. The outer shell 20 is provided on an outer circumference of the heat insulator 17. The cooling section 26 includes at least one annular flow path 28 and an outlet 29. The annular flow path 28 is arranged between the heat insulator 17 and the outer shell 20. The outlet 29 is provided in the heat insulator 17. The outlet 29 is arranged to ensure that the cooling fluid is blown out of the outlet 29 toward a vertical central axis of the heat insulator 17 or in a direction oblique to the direction toward vertical central axis of the heat insulator 17.
    • 本发明提供一种热处理装置,其具有出口设计的高自由度,并且能够调节加热器的每个部件的温度降低的速率而不使用调节阀。 具有简单的流路结构的热处理装置可以以简单的密封和降低的成本构成。 热处理设备1包括处理室2,管状加热器3,散热系统25和冷却部分26.处理室2容纳待放置的多个物体W并进行处理。 在处理室中进行预定的热处理。 加热器3围绕处理室2的外周并加热被处理物体W. 散热系统25适于排出存在于加热器3和处理室2之间的空间24中的气氛。冷却部分26适于将冷却流体吹入空间24以冷却大气。 加热器3包括管状隔热件17,发热电阻18和外壳20.发热电阻18设置在隔热材料17的内周上。外壳20设置在绝热体17的外周。 绝热体17.冷却部分26包括至少一个环形流动路径28和出口29.环形流路28设置在绝热体17和外壳20之间。出口29设置在绝热体17中。 出口29布置成确保冷却流体从出口29朝向隔热件17的垂直中心轴线或者沿着与隔热件17的垂直中心轴方向倾斜的方向吹出。