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    • 10. 发明授权
    • Chip antenna and method of manufacturing the same
    • 芯片天线及其制造方法
    • US06724347B2
    • 2004-04-20
    • US10178328
    • 2002-06-20
    • Isao TomomatsuTakahiro UenoMitsuo YoshinoShinji SatohHiroki Hamada
    • Isao TomomatsuTakahiro UenoMitsuo YoshinoShinji SatohHiroki Hamada
    • H01Q138
    • H01Q1/2283B29C45/0025B29C45/14639B29L2031/3456H01Q1/22H01Q1/38H01Q1/40H01Q9/40H01Q9/42H01Q11/04
    • Of margins of a resin molding with an antenna element buried therein which lie around the antenna element, a margin on that side of the resin molding where a gate mark remains is made larger than margins on other sides where there is no gate mark. Particularly, when the antenna element has a line antenna portion and a capacitance-adding portion provided at a distal end of the line antenna portion, the resin molding is injection-molded in such a way that a gate mark can be formed on that side where the capacitance-adding portion is located. Those portions of the resin molding where the terminal portions are led out are dented from levels of portions around those portions. This provides a chip antenna which has a simple structure with a high mechanical strength and does not prevent separation or cracking from occurring in the resin molding in which the antenna element is buried and a method of manufacturing the chip antenna.
    • 在埋设在天线元件周围的天线元件的树脂模制品的边缘处,留下栅极标记的树脂模制品侧的边缘大于没有栅极标记的另一侧的边缘。 特别地,当天线元件具有线天线部分和设置在线天线部分的远端处的电容增加部分时,树脂模制件以这样的方式被注射成型,即可以在那一侧形成栅极标记 电容添加部分被定位。 端子部分被引出的树脂模塑件的那些部分由这些部分周围的部分的凹陷凹陷。 这提供了具有机械强度高的简单结构的芯片天线,并且不防止在埋设天线元件的树脂模制件中发生分离或破裂以及制造芯片天线的方法。