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1. 发明授权

US5421956A Method of fabricating an integrated pressure sensor 失效
标题翻译：制造集成压力传感器的方法
公开(公告)号：US5421956A
公开(公告)日：1995-06-06
申请号：US072758
申请日：1993-06-07
申请人： Kazuhiko Koga , Michitaka Hayashi , Kazuhisa Ikeda
发明人： Kazuhiko Koga , Michitaka Hayashi , Kazuhisa Ikeda
IPC分类号： G01L9/00 , G01L27/00 , H01L21/306
CPC分类号： G01L9/0042 , G01L19/0038 , G01L19/0084 , G01L19/141 , G01L27/005 , G01L9/0054 , Y10S148/028
摘要： A method of fabricating an integrated pressure sensor, which is capable of decreasing adverse effects caused by the distortion occurring at the time when a silicon wafer and a seat are joined together. On a silicon wafer 1 are formed a thin diaphragm 2 for each of the chips, a piezo-resitance layer for each of the chips, and a signal processing circuit with an adjusting resistor for each of the chips. The silicon wafer 1 is joined onto a glass seat 6 that has pressure-adjusting passges 7 formed therein to adjust the pressure exerted on the diaphragms 2 of the silicon wafer 1. Half-dicing is effected that reaches a predetermined depth of the glass seat 6 penetrating through the silicon wafer 1 for each of the chips, and resistance of the adjusting resistor is adjusted for each of the chips while adjusting the pressure applied to the diaphragms 2 via pressure-adjusting passages 7 in the seat in a step of adjusting the pressure sensitivity by trimming the wafer and by applying a negative pressure. Finally, the silicon wafer 1 and the glass seat 6 are cut by full-dicing for each of the chips.
摘要翻译：一种制造集成压力传感器的方法，其能够减少由硅晶片和座椅接合在一起时发生的失真引起的不利影响。在硅晶片1上形成用于每个芯片的薄膜2，用于每个芯片的压电层，以及具有用于每个芯片的调整电阻器的信号处理电路。将硅晶片1接合到具有形成在其中的压力调节通过部7的玻璃座6上，以调节施加在硅晶片1的隔膜2上的压力。达到玻璃座6的预定深度的半切割对于每个芯片穿透硅晶片1，并且通过调节压力的步骤中的压力调节通道7调节施加到隔膜2的压力，调整每个芯片的调整电阻器的电阻通过修整晶片并施加负压来实现灵敏度。最后，通过用于每个芯片的全切割来切割硅晶片1和玻璃座6。

2. 发明授权

US5528214A Pressure-adjusting device for adjusting output of integrated pressure sensor 失效
标题翻译：用于调节集成压力传感器输出的调压装置
公开(公告)号：US5528214A
公开(公告)日：1996-06-18
申请号：US364993
申请日：1994-12-28
申请人： Kazuhiko Koga , Michitaka Hayashi , Kazuhisa Ikeda
发明人： Kazuhiko Koga , Michitaka Hayashi , Kazuhisa Ikeda
IPC分类号： G01L9/00 , G01L27/00 , G01L1/22
CPC分类号： G01L9/0042 , G01L19/0038 , G01L19/0084 , G01L19/141 , G01L27/005 , G01L9/0054 , Y10S148/028
摘要： A pressure-adjusting device for adjusting an output of an integrated pressure sensor in which a silicon wafer is joined onto a seat that has pressure-adjusting passages formed therein, and which has formed in the silicon wafer a signal processing circuit with an adjusting resistor for each chip, a thin diaphragm for each chip and a piezo-resistance layer for each chip. The pressure-adjusting device includes a pressure-setting stage on which the seat is placed, the pressure setting stage having pressure-adjusting passages formed therein to adjust a pressure exerted on the respective thin diaphragm via the pressure-adjusting passages formed in the seat. A holding member is arranged on the pressure-setting stage as to surround at least an outer periphery of the seat. A first elastic air-tight member is arranged on the pressure-setting stage as to surround the outer periphery of the seat and be held compressed by the pressure-setting stage and by the holding member. A second elastic air-tight member is arranged to surround the outer periphery on an upper surface of said silicon wafer or to surround the outer periphery of either the seat or the silicon wafer, and be held compressed by the seat or by the silicon wafer and the holding member.
摘要翻译：一种压力调节装置，用于调节其中硅晶片与其中形成有压力调节通道的座上接合的集成压力传感器的输出，并且在硅晶片中形成具有调节电阻器的信号处理电路每个芯片，每个芯片的薄膜片和每个芯片的压电层。压力调节装置包括设置座椅的压力调节阶段，压力调节阶段具有形成在其中的压力调节通道，以经由形成在座椅中的压力调节通道来调节施加在各个薄隔膜上的压力。保持构件布置在压力设定台上，以至少围绕座椅的外周。第一弹性气密构件布置在压力设定台上，以围绕座椅的外周并通过压力稳定阶段和保持构件保持压缩。第二弹性气密构件被布置成围绕所述硅晶片的上表面的外周围或者围绕座或硅晶片的外周，并被座椅或硅晶片压缩，持有成员。

3. 发明授权

US06822873B2 Structure of electronic device providing decreased fatigue of wire 失效
标题翻译：提供电线疲劳疲劳的电子设备结构
公开(公告)号：US06822873B2
公开(公告)日：2004-11-23
申请号：US10374105
申请日：2003-02-27
申请人： Kazuhiko Koga
发明人： Kazuhiko Koga
IPC分类号： H05K100
CPC分类号： G01L19/0069 , G01L19/0084 , G01L19/141 , H01L24/45 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48137 , H01L2224/4823 , H01L2924/01019 , H01L2924/01039 , H01L2924/0105 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： An electronic device such as a semiconductor pressure sensor is provided which has a buffer disposed within a resinous casing. Terminals extend through the casing and connect electrically with an electronic element mounted on the casing through wires. The buffer is made of a material having a coefficient of thermal expansion smaller than that of the body of the casing, thereby decreasing undesirable movement of the terminals leading to fatigue of the wires which arises from a change in temperature of the casing. This minimizes a drop in mechanical strength of the wires caused by thermal cycling to which the casing is subjected.
摘要翻译：提供了诸如半导体压力传感器的电子装置，其具有设置在树脂壳体内的缓冲器。端子延伸穿过外壳并通过电线与安装在外壳上的电子元件电连接。缓冲器由热膨胀系数小于壳体的热膨胀系数的材料制成，从而减少端子的不期望的运动，导致由壳体的温度变化引起的电线疲劳。这最大限度地降低了由套管所经受的热循环引起的电线的机械强度的下降。

4. 发明授权

US06494099B1 Pressure detection apparatus having first and second cases defining pressure detection chamber there between and method of manufacturing the same 失效
标题翻译：压力检测装置具有在其间限定压力检测室的第一和第二壳体及其制造方法
公开(公告)号：US06494099B1
公开(公告)日：2002-12-17
申请号：US09603956
申请日：2000-06-26
申请人： Kenji Chikuan , Kazuhiko Koga
发明人： Kenji Chikuan , Kazuhiko Koga
IPC分类号： G01L700
CPC分类号： G01L19/0084 , G01L19/0645 , G01L19/143
摘要： A pressure detection apparatus is manufactured by fitting an end portion of a first case into an opening portion of a second case, filling a space, which is defined between the end portion of the first case and an opening edge portion of the second case, with adhesive, and hardening the adhesive. Accordingly, variations in volume of a pressure detection chamber sealed between the first case and the second case can be reduced, resulting in decreased variations in output.
摘要翻译：通过将第一壳体的端部装配到第二壳体的开口部中来制造压力检测装置，其将限定在第一壳体的端部与第二壳体的开口边缘部之间的空间填充，粘合剂，并使粘合剂硬化。因此，可以减小密封在第一壳体和第二壳体之间的压力检测室的体积变化，导致输出的变化减小。

5. 发明申请

US20050250371A1 Sealing structure for connector 审中-公开
标题翻译：连接器密封结构
公开(公告)号：US20050250371A1
公开(公告)日：2005-11-10
申请号：US11119701
申请日：2005-05-03
申请人： Kazuhiko Koga
发明人： Kazuhiko Koga
IPC分类号： H01L23/10 , H01R4/02 , H01R4/24 , H01R13/52
CPC分类号： H01R13/5213 , H01L2224/48091 , H01R4/023 , H01R13/5202 , H01R13/5205 , H01R13/521 , H01R13/5216 , H01L2924/00014
摘要： A connector having insulation for electrical connection includes a housing having a concave portion, a terminal insert-molded in the housing, a lead wire electrically coupled with the terminal, a potting material for sealing the concave portion and an insulation material. The connector uses the insulation material in contact with the potting material to cover an end of the terminal extending upward in the concave portion.
摘要翻译：具有用于电连接的绝缘体的连接器包括具有凹部的外壳，嵌入在壳体中的端子，与端子电耦合的引线，用于密封凹部的封装材料和绝缘材料。连接器使用与灌封材料接触的绝缘材料来覆盖在凹部中向上延伸的端子的端部。

6. 发明授权

US5146671A Method of manufacturing floating type magnetic head 失效
标题翻译：浮动型磁头制造方法
公开(公告)号：US5146671A
公开(公告)日：1992-09-15
申请号：US753157
申请日：1991-08-30
申请人： Takahiro Ogawa , Atsushi Inoue , Kazuhiko Koga , Kiyotaka Ito , Yutaka Ueta
发明人： Takahiro Ogawa , Atsushi Inoue , Kazuhiko Koga , Kiyotaka Ito , Yutaka Ueta
IPC分类号： G11B5/31 , G11B5/105 , G11B5/127 , G11B5/133 , G11B5/187 , G11B5/23
CPC分类号： G11B5/1871 , G11B5/105 , G11B5/1272 , Y10T29/49039 , Y10T29/49043 , Y10T29/49057
摘要： A floating type composite magnetic head includes a head core fixed to a slider formed of nonmagnetic material. In the head core, a pair of magnetic core halves are abutted against each other with nonmagnetic material such as SiO.sub.2 or the like interposed therebetween. The first and second magnetic core half members have first and second gap forming surfaces to be abutted against each other to define a magnetic gap (g), respectively. A first groove is formed on the second gap forming surface. A glass layer is formed in the first groove. A first thin film including a ferromagnetic metal thin film is selectively formed on the first gap forming surface. A second thin film including a ferromagnetic metal thin film is selectively formed on the second gap forming surface so that at least a portion except the surface of the glass layer in the second gap forming surface is exposed. A second groove is formed on the exposed second gap forming surface adjacent to the first groove. The first and second magnetic core half members are abutted and bonded with glass so that the first and second gap forming surfaces face each other so that the first and second thin films are abutted with SiO.sub.2 or the like interposed therebetween to define a magnetic gap (g). Causes of occurrence and an increase of false gaps are suppressed and a decrease in manufacturing yield due to separation of thin films or the like can be prevented.

7. 发明申请

US20090072360A1 Molded semiconductor device including IC-chip covered with conductor member 审中-公开
标题翻译：包含IC芯片的模制半导体器件覆盖有导体部件
公开(公告)号：US20090072360A1
公开(公告)日：2009-03-19
申请号：US12230728
申请日：2008-09-04
申请人： Kazuhiko Koga
发明人： Kazuhiko Koga
IPC分类号： H01L23/495
CPC分类号： H01L23/49551 , H01L23/552 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device according to the present invention includes a conductor member, an IC-chip and leads, all molded together with a resin mold. The conductor member is composed of a base portion on which the IC-chip is mounted, a cover portion for covering a functioning surface of the IC-chip, and a bent portion connecting the cover portion to the base portion. The base portion includes a lead portion that is grounded. The cover portion and the base portion are positioned substantially in parallel to each other, and the IC-chip is disposed in an inner space between the cover portion and the base portion. The lead portion to be grounded and the leads electrically connected to the IC-chip extend out of the resin mold. Since the IC-hip is disposed in the inner space of the conductor member that is grounded, the IC-chip is protected from the electromagnetic noises and from electrostatic charges otherwise accumulated in the resin mold.
摘要翻译：根据本发明的半导体器件包括全部与树脂模具一起模制的导体部件，IC芯片和引线。导体部件由安装有IC芯片的基部，覆盖IC芯片的功能面的盖部和将盖部连接到基部的弯曲部构成。基部包括接地的引线部分。盖部分和基部基本上彼此平行地定位，并且IC芯片设置在盖部分和基部之间的内部空间中。要接地的引线部分和与IC芯片电连接的引线延伸出树脂模具。由于IC-臀部设置在接地的导体部件的内部空间中，所以IC芯片不受电磁噪声的影响，也可防止其它积聚在树脂模具中的静电电荷。

8. 发明授权

US5016341A A process for producing magnetic heads of the floating type 失效
标题翻译：一种用于制造浮动型磁头的方法
公开(公告)号：US5016341A
公开(公告)日：1991-05-21
申请号：US347372
申请日：1989-05-04
申请人： Takahiro Ogawa , Atsushi Inoue , Kiyotaka Ito , Yutaka Ueta , Kazuhiko Koga
发明人： Takahiro Ogawa , Atsushi Inoue , Kiyotaka Ito , Yutaka Ueta , Kazuhiko Koga
IPC分类号： G11B5/60 , G11B5/105 , G11B5/127 , G11B5/23
CPC分类号： G11B5/232 , G11B5/105 , G11B5/1272 , Y10T29/4903 , Y10T29/49048 , Y10T29/49057
摘要： A floating-type magnetic head comprising a slider and a core chip secured thereto. The core chip comprises a pair of core segments joined together with a gap spacer and a thin ferromagnetic metal film which are formed at the joint only over a portion of the entire area of the joint which portion terminates at the face of the core chip to be opposed to magnetic recording media. The two core segments area bonded to each other with glass present over the remaining portion of the joint area. In producing the magnetic head, the core chip is prepared by fabricating a core block comprising a pair of base plates joined together and strips of thin ferromagnetic metal film and gap spacer provided at the joint, and machining the core block.

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