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1. 发明授权

US06678164B2 Pressure sensor and method for manufacturing the same 有权
标题翻译：压力传感器及其制造方法
公开(公告)号：US06678164B2
公开(公告)日：2004-01-13
申请号：US10374092
申请日：2003-02-27
申请人： Kenji Chikuan , Michitake Kuroda , Haruhiko Miyagawa
发明人： Kenji Chikuan , Michitake Kuroda , Haruhiko Miyagawa
IPC分类号： H05K500
CPC分类号： G01L19/0084 , G01L19/0645 , G01L19/142
摘要： In a pressure sensor, a sensor element is mounted on a side of a first surface of a first case, and a second case having a cylindrical hollow portion is bonded to the first case to cover a part of a second surface of the first case, opposite to the first surface. Terminals are embedded in the first case to protrude from the second surface, and branch portions are branched from the terminals from an embedded portion in the first case to have exposed portions exposed to the second surface. A chip capacitor is mounted on the exposed portions on the second surface to be electrically connected to the exposed portions. In the pressure sensor, a diameter (D1) of the second surface of the first case is larger than an inner diameter (D2) of the hollow portion at a position where protrusion top ends of the terminals are positioned.
摘要翻译：在压力传感器中，传感器元件安装在第一壳体的第一表面的一侧，并且具有圆柱形中空部分的第二壳体接合到第一壳体以覆盖第一壳体的第二表面的一部分，与第一个表面相对。端子嵌入在第一壳体中以从第二表面突出，并且分支部分从端子从第一壳体中的嵌入部分分支以具有暴露于第二表面的暴露部分。芯片电容器安装在第二表面上的暴露部分上，以电连接到暴露部分。在压力传感器中，第一壳体的第二表面的直径（D1）大于端子的突出顶端位置处的中空部的内径（D2）。

2. 发明授权

US06694818B2 Pressure sensor having semiconductor sensor chip 失效
标题翻译：具有半导体传感器芯片
公开(公告)号：US06694818B2
公开(公告)日：2004-02-24
申请号：US09904898
申请日：2001-07-16
申请人： Kenji Chikuan , Michitake Kuroda
发明人： Kenji Chikuan , Michitake Kuroda
IPC分类号： G01L708
CPC分类号： G01L19/0084 , G01L19/0645 , H01L2224/73265 , H01L2924/15151
摘要： A semiconductor sensor chip is interposed between a sensor case and a housing. A first pressure is introduced from the sensor case and applied to a rear surface of the sensor chip, while a second pressure is introduced from the housing and applied to a front surface of the sensor chip. The sensor chip detects a pressure difference between the first and the second pressures and converts it into an electrical signal. The sensor chip is hermetically mounted in a depressed portion formed in the sensor case by charging a sealing material from holes formed around the depressed portion. The charging holes are positioned between terminals electrically connecting the sensor chip to an outside circuit to avoid enlarging the pressure sensor size by forming the charging holes.
摘要翻译：半导体传感器芯片介于传感器外壳和壳体之间。从传感器壳体引入第一压力并将其施加到传感器芯片的后表面，同时从壳体引入第二压力并施加到传感器芯片的前表面。传感器芯片检测第一和第二压力之间的压差，并将其转换成电信号。传感器芯片通过从围绕凹陷部分形成的孔中充填密封材料而气密地安装在形成在传感器壳体中的凹陷部分中。充电孔位于将传感器芯片电连接到外部电路的端子之间，以避免通过形成充电孔来扩大压力传感器尺寸。

3. 发明授权

US06494099B1 Pressure detection apparatus having first and second cases defining pressure detection chamber there between and method of manufacturing the same 失效
标题翻译：压力检测装置具有在其间限定压力检测室的第一和第二壳体及其制造方法
公开(公告)号：US06494099B1
公开(公告)日：2002-12-17
申请号：US09603956
申请日：2000-06-26
申请人： Kenji Chikuan , Kazuhiko Koga
发明人： Kenji Chikuan , Kazuhiko Koga
IPC分类号： G01L700
CPC分类号： G01L19/0084 , G01L19/0645 , G01L19/143
摘要： A pressure detection apparatus is manufactured by fitting an end portion of a first case into an opening portion of a second case, filling a space, which is defined between the end portion of the first case and an opening edge portion of the second case, with adhesive, and hardening the adhesive. Accordingly, variations in volume of a pressure detection chamber sealed between the first case and the second case can be reduced, resulting in decreased variations in output.
摘要翻译：通过将第一壳体的端部装配到第二壳体的开口部中来制造压力检测装置，其将限定在第一壳体的端部与第二壳体的开口边缘部之间的空间填充，粘合剂，并使粘合剂硬化。因此，可以减小密封在第一壳体和第二壳体之间的压力检测室的体积变化，导致输出的变化减小。

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