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1. 发明授权

US5914274A Substrate on which bumps are formed and method of forming the same 失效
公开(公告)号：US5914274A
公开(公告)日：1999-06-22
申请号：US53270
申请日：1998-04-01
申请人： Kazufumi Yamaguchi , Tsutomu Mitani , Mitsuo Asabe
发明人： Kazufumi Yamaguchi , Tsutomu Mitani , Mitsuo Asabe
IPC分类号： H01L21/60 , H01L23/485 , H01L21/00 , B44C1/22
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/1147 , H01L2224/11902 , H01L2224/13019 , H01L2224/13099 , H01L2224/13147 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , Y10S428/929 , Y10T428/1275 , Y10T428/12764 , Y10T428/12792 , Y10T428/24997
摘要： A bi-layer bump comprises a base layer composed of sprayed aluminum thick film having a thickness of about 20 .mu.m formed to cover the periphery of the passivation film formed on each pad electrode, a surface layer composed of sprayed copper thick film having a thickness of about 30 .mu.m formed on the base layer. According to the above-mentioned structure, a substrate on which bumps are formed which has an excellent electric property and connecting reliability, wherein an interlayer insulating layer, an active layer and a multi-layer wiring can be provided under the pad electrode can be obtained.

2. 发明授权

US6042953A Substrate on which bumps are formed and method of forming the same 失效
标题翻译：形成凸块的基板及其形成方法
公开(公告)号：US6042953A
公开(公告)日：2000-03-28
申请号：US820779
申请日：1997-03-18
申请人： Kazufumi Yamaguchi , Tsutomu Mitani , Mitsuo Asabe
发明人： Kazufumi Yamaguchi , Tsutomu Mitani , Mitsuo Asabe
IPC分类号： H01L21/60 , H01L23/485 , B32B15/10 , B32B15/00 , H01H1/02
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/1147 , H01L2224/11902 , H01L2224/13019 , H01L2224/13099 , H01L2224/13147 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , Y10S428/929 , Y10T428/1275 , Y10T428/12764 , Y10T428/12792 , Y10T428/24997
摘要： A bi-layer bump comprises a base layer composed of sprayed aluminum thick film having a thickness of about 20 .mu.m formed to cover the periphery of the passivation film formed on each pad electrode, a surface layer composed of sprayed copper thick film having a thickness of about 30 .mu.m formed on the base layer. According to the above-mentioned structure, a substrate on which bumps are formed which has an excellent electric property and connecting reliability, wherein an interlayer insulating layer, an active layer and a multi-layer wiring can be provided under the pad electrode can be obtained.
摘要翻译：双层凸块包括由形成为覆盖形成在每个焊盘电极上的钝化膜的周围形成的厚度为约20μm的喷镀的铝厚膜构成的基底层，由喷镀铜厚膜构成的表面层，其具有厚度在基层上形成约30微米。根据上述结构，可以获得在焊盘电极下方可以设置层间绝缘层，有源层和多层布线的具有优异的电性能和连接可靠性的形成有凸块的基板。

3. 发明授权

US4845567A Image sensor 失效
标题翻译：图像传感器
公开(公告)号：US4845567A
公开(公告)日：1989-07-04
申请号：US18576
申请日：1987-02-25
申请人： Kazufumi Yamaguchi , Takahiko Murata , Yasunori Yamamoto
发明人： Kazufumi Yamaguchi , Takahiko Murata , Yasunori Yamamoto
IPC分类号： H01L27/146 , H04N1/193 , H04N1/40
CPC分类号： H04N1/40056 , H01L27/14681 , H04N1/1931
摘要： An self-scan type linear image sensor comprises an array of a plurality of phototransistors or photodiodes, a shift register, and current switches operating in response to parallel output signals from the shift register. The shift register is comprised of thyristors and interstage coupling transistors cascade-connecting the thyristors. The current switches are comprised of a first differential current switch executing differential switching operations between parallel output signals from odd-number stages of the shift register and a first separation signal, and a second differential current switch executing differential switching operations between parallel output signals from even-number stages of the shift register and a second separation signal. Current outputs from these current switches are delivered to collectors of the phototransistors, which are connected at emitters, common to an image signal output line.
摘要翻译：自扫描型线性图像传感器包括多个光电晶体管或光电二极管的阵列，移位寄存器和响应于来自移位寄存器的并行输出信号而工作的电流开关。移位寄存器由级联连接晶闸管的晶闸管和级间耦合晶体管组成。电流开关由在移位寄存器的奇数级的并行输出信号与第一分离信号之间进行差分切换操作的第一差分电流开关和在来自偶数个的并行输出信号之间进行差分切换操作的第二差分电流开关 - 移位寄存器的数字级和第二分离信号。来自这些电流开关的电流输出被传送到光电晶体管的收集器，光电晶体管连接在发射器处，与图像信号输出线相同。

4. 发明授权

US06683260B2 Multilayer wiring board embedded with transmission line conductor 失效
标题翻译：多层布线板嵌入传输线导体
公开(公告)号：US06683260B2
公开(公告)日：2004-01-27
申请号：US09897127
申请日：2001-07-03
申请人： Takeshi Shimamoto , Kazufumi Yamaguchi , Masahide Tsukamoto , Fumikazu Tateishii , Yutaka Taguchi
发明人： Takeshi Shimamoto , Kazufumi Yamaguchi , Masahide Tsukamoto , Fumikazu Tateishii , Yutaka Taguchi
IPC分类号： H05K100
CPC分类号： H05K1/0245 , H01P3/08 , H05K1/0219 , H05K1/0242 , H05K1/09 , H05K3/107 , H05K2201/0305 , H05K2201/09036 , H05K2201/09118 , H05K2201/09236 , H05K2201/098 , H05K2201/09981 , Y10T29/49126
摘要： Transmission line structure is composed of a pair of signal conductors which are embedded in one wiring region of a dielectric layer and a thickness in height of the signal conductor is larger than a width, and is constituted so that a coupling impedance between the adjacent signal conductors is lower than a coupling impedance between the signal conductor and another conductor formed in another wiring region, and thus to provide a multi-layer wiring board having a transmission line structure of high wiring density and excellent transmission characteristic.
摘要翻译：传输线结构由嵌入在电介质层的一个布线区域中的一对信号导体组成，信号导体的高度大于宽度，并且构成为使得相邻信号导体之间的耦合阻抗低于在另一布线区域中形成的信号导体和另一导体之间的耦合阻抗，从而提供具有高布线密度和优良传输特性的传输线结构的多层布线板。

5. 发明授权

US4567529A Image sensor 失效
标题翻译：图像传感器
公开(公告)号：US4567529A
公开(公告)日：1986-01-28
申请号：US617566
申请日：1984-06-05
申请人： Kazufumi Yamaguchi , Takahiko Murata
发明人： Kazufumi Yamaguchi , Takahiko Murata
IPC分类号： H04N5/369 , H04N1/10 , H04N3/14
CPC分类号： H04N3/1581
摘要： A linear image sensor of a self-scanning type comprising a phototransistor array and a scanning circuit, whose circuit comprises decoders of current switches connected dendritically, input signal converter circuits generating input signals for driving the current switches, and a current switch array which turns on or off charging currents to the phototransistors according to whether or not an output current of decoder exists, so that video signals from the phototransistors, when the output currents of decoder flow, are obtainable from the phototransistors in the charge storage mode, all the transistors for scanning circuit being operated in nonsaturation condition for high-speed operation and the input signals being encoded so that the input signals to the decoder vary by one bit at each scanning step for noise reduction. The cancellation circuit of dark signal and noise signal is also provided.
摘要翻译：包括光电晶体管阵列和扫描电路的自扫描型的线性图像传感器，其电路包括树状连接的电流开关的解码器，产生用于驱动电流开关的输入信号的输入信号转换器电路以及导通的电流开关阵列或根据解码器的输出电流是否存在对截止的光电晶体管的充电电流，使得来自光电晶体管的视频信号在解码器流的输出电流可从电荷存储模式中的光电晶体管获得时，所有晶体管用于扫描电路在非饱和条件下工作，用于高速操作，并且输入信号被编码，使得在每个扫描步骤对解码器的输入信号改变一位，以降低噪声。还提供暗信号和噪声信号的消除电路。

6. 发明授权

US06888072B2 Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same 失效
标题翻译：夹具，带夹具的电路板和电子元件安装体及其制造方法
公开(公告)号：US06888072B2
公开(公告)日：2005-05-03
申请号：US09810846
申请日：2001-03-16
申请人： Masahide Tsukamoto , Kazufumi Yamaguchi , Takeshi Shimamoto , Fumikazu Tateishi
发明人： Masahide Tsukamoto , Kazufumi Yamaguchi , Takeshi Shimamoto , Fumikazu Tateishi
IPC分类号： H01L21/68 , H01L23/32 , H05K3/32 , H05K1/16
CPC分类号： H01L21/6835 , H01L23/32 , H01L24/16 , H01L24/72 , H01L2224/16238 , H01L2224/73251 , H01L2224/81901 , H01L2924/01078 , H01L2924/19041 , H05K3/325 , Y10T29/49137 , H01L2224/16 , H01L2224/72
摘要： A fixture with movable pawls and positioning walls is attached to a circuit board. An electronic component is inserted into the fixture from its upper side. Since the movable pawls move outward due to their slopes, the electronic component is allowed to fit between the positioning walls. After the fitting of the electronic component, the movable pawls hold the sides of the upper face of the electronic component and the positioning walls are in contact with the peripheral walls of the electronic component. Bumps provided on electrode pads of the electronic component are connected to electrodes on the circuit board. Thus, the electronic component can be mounted using the flip chip technique. In addition, the electronic component can be removed easily by moving the movable pawls even after being mounted.
摘要翻译：具有可移动爪和定位壁的夹具连接到电路板。电子部件从其上侧插入固定装置。由于可动爪由于其斜面而向外移动，所以允许电子部件配合在定位壁之间。在电子部件的装配之后，可动爪保持电子部件的上表面的侧面并且定位壁与电子部件的周壁接触。提供在电子部件的电极焊盘上的凸起连接到电路板上的电极。因此，可以使用倒装芯片技术来安装电子部件。此外，即使在安装之后，通过移动可动爪也能够容易地去除电子部件。

7. 发明授权

US4638362A Solid-state image pickup device 失效
标题翻译：固态图像拾取装置
公开(公告)号：US4638362A
公开(公告)日：1987-01-20
申请号：US687426
申请日：1984-12-28
申请人： Mitsuaki Oshima , Kazufumi Yamaguchi
发明人： Mitsuaki Oshima , Kazufumi Yamaguchi
IPC分类号： H01L27/148 , H04N5/30 , H04N5/335 , H04N5/341 , H04N5/345 , H04N5/357 , H04N5/3728 , H04N5/374 , H04N3/14
CPC分类号： H04N3/1562
摘要： A solid-state image pickup device has photo-sensitive picture elements arranged in a matrix to convert light containing picture element information into electrical charges. A horizontal charge transfer element and a vertical charge transfer element respectively transfer electrical charges corresponding to individual picture elements in a horizontal and vertical direction. At least one of the vertical charge transfer elements and horizontal charge transfer elements is controlled in response to external control signals so that a part of the electrical charges corresponding to individual picture elements in a specified part of the photosensitive picture elements are outputted as picture element output signals.
摘要翻译：固态图像拾取装置具有以矩阵形式布置的光敏像素，以将含有图像元素信息的光转换为电荷。水平电荷转移元件和垂直电荷转移元件分别在水平和垂直方向上转移对应于各个图像元素的电荷。垂直电荷转移元件和水平电荷转移元件中的至少一个响应于外部控制信号被控制，使得与感光像素的指定部分中的各个像素相对应的电荷的一部分作为像素输出被输出信号。

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