专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130233706A1 AL-BASED ALLOY SPUTTERING TARGET AND PRODUCTION METHOD OF SAME 审中-公开
标题翻译：基于AL的合金喷射目标及其生产方法
公开(公告)号：US20130233706A1
公开(公告)日：2013-09-12
申请号：US13878334
申请日：2011-10-05
申请人： Katsushi Matsumoto , Katsutoshi Takagi , Yuichi Taketomi , Junichi Nakai , Hidetada Makino , Toshiaki Takagi
发明人： Katsushi Matsumoto , Katsutoshi Takagi , Yuichi Taketomi , Junichi Nakai , Hidetada Makino , Toshiaki Takagi
IPC分类号： C23C14/34
CPC分类号： C23C14/3414 , B22F3/115 , B22F3/15 , B22F3/24 , C22C1/0416 , C22C21/00 , C22F1/04 , C23C16/45504 , C23C16/4585 , C23C16/4586
摘要： There is provided an Al-based alloy sputtering target, which can provide an enhanced deposition rate (or sputtering rate) when the sputtering target is used, and which can preferably prevent the occurrence of splashes. The Al-based alloy sputtering target of the present invention includes Ta and may preferably include an Al—Ta-based intermetallic compound containing Al and Ta, which compound has a mean particle diameter of from 0.005 μm to 1.0 μm and a mean interparticle distance of from 0.01 μm to 10.0 μm.
摘要翻译：提供了一种Al系合金溅射靶，其可以在使用溅射靶时提供增强的沉积速率（或溅射速率），并且可以优选地防止飞溅的发生。本发明的Al系合金溅射靶包括Ta，并且优选包括含有Al和Ta的Al-Ta系金属间化合物，该化合物的平均粒径为0.005〜1.0μm，平均粒子间距离为从0.01毫米到10.0毫米。

2. 发明申请

US20120325655A1 A1-BASED ALLOY SPUTTERING TARGET 审中-公开
标题翻译：基于A1的合金喷射目标
公开(公告)号：US20120325655A1
公开(公告)日：2012-12-27
申请号：US13581436
申请日：2011-02-25
申请人： Yuki Iwasaki , Katsushi Matsumoto , Toshiaki Takagi , Mamoru Nagao , Hidetada Makino
发明人： Yuki Iwasaki , Katsushi Matsumoto , Toshiaki Takagi , Mamoru Nagao , Hidetada Makino
IPC分类号： C23C14/34
CPC分类号： C23C14/3414 , C22C21/00
摘要： The present invention provides a technique capable of suppressing generation of splash even at high-speed deposition by an Al-based alloy sputtering target containing Ni and a rare earth element, wherein when crystallographic orientations , , , and in a normal direction of each sputtering surface at a surface part of the Al-based alloy sputtering target, a ¼×t (t: thickness of the Al-based alloy sputtering target) part thereof and a ½×t part thereof are observed by an electron backscatter diffraction pattern method, the Al-based alloy sputtering target satisfies the requirement (1) that, when a total of area fractions of the ±15°, ±15° and ±15° is defined as R (as for Rat each part, the R at the surface part is defined as Ra, the R at the ¼×t part is defined as Rb, and the R at the ½×t part is defined as Rc), R is 0.35 or more and 0.80 or less; and the requirement (2) that each of the Ra, the Rb and the Rc falls in the range of ±20% of an average R value [Rave=(Ra+Rb+Rc)/3].
摘要翻译：本发明提供一种能够通过含有Ni和稀土元素的Al系合金溅射靶在高速沉积时抑制飞溅的技术，其中当晶体取向<001>，<011>，<111>时，在Al基合金溅射靶的表面部分的每个溅射表面的法线方向上，¼×t（t：Al基合金溅射靶的厚度）部分和½ 通过电子背散射衍射图法观察其×t部分，Al系合金溅射靶满足以下要求（1）：当<001>±15°，<011>±15°的面积分数并且<112>±15°被定义为R（对于大鼠每个部分，表面部分的R定义为Ra，¼×t部分的R定义为Rb，R在½×t 部分定义为Rc），R为0.35以上至0.80以下; 以及R a，R b和R c中的每一个落在平均R值[Rave =（Ra + Rb + Rc）/ 3]的±20％的范围内的要求（2）。

3. 发明申请

US20130306468A1 AL-BASED ALLOY SPUTTERING TARGET AND CU-BASED ALLOY SPUTTERING TARGET 有权
标题翻译：基于AL的合金喷射目标和基于CU的合金喷射目标
公开(公告)号：US20130306468A1
公开(公告)日：2013-11-21
申请号：US13981414
申请日：2011-12-20
申请人： Katsushi Matsumoto , Junichi Nakai , Toshiaki Takagi
发明人： Katsushi Matsumoto , Junichi Nakai , Toshiaki Takagi
IPC分类号： C23C14/34
CPC分类号： C23C14/3407 , C22C1/02 , C22C9/00 , C22C21/00 , C23C14/3414
摘要： Film-formation rate can be increased in the pre-sputtering and in the subsequent sputtering onto a substrate or the like, and sputtering failures such as splashes can be inhibited, by making an Al-based alloy or Cu-based alloy spurting target fulfill the following requirements (1) and/or (2) when the total area ratio of crystal orientations ±15°, ±15°, ±15°, ±15°, and ±15° in the sputtering surface normal direction in the depth within 1 mm from the uppermost surface of the sputtering target is referred to as a P value: (1) the area ratio PA of ±15° to the P value: 40% or lower; and (2) the total area ratio PB of ±15° and ±15° to the P value: 20% or higher.
摘要翻译：可以在预溅射和随后的溅射中将成膜速度提高到基板等上，并且通过使Al基合金或Cu基合金喷涂靶满足晶体取向的总面积比<001>±15°，<011>±15°，<111>±15°，<112>±15°和<012时的以下要求（1）和/或（2）在溅射靶的最上表面1mm以内的深度的溅射面法线方向>±15°被称为P值：（1）<011>±15°的面积比PA与P值：40％以下; 和（2）总面积比PB <001>±15°和<111>±15°至P值：20％或更高。

4. 发明授权

US09551065B2 Al-based alloy sputtering target and Cu-based alloy sputtering target 有权
标题翻译： Al基合金溅射靶和Cu基合金溅射靶
公开(公告)号：US09551065B2
公开(公告)日：2017-01-24
申请号：US13981414
申请日：2011-12-20
申请人： Katsushi Matsumoto , Junichi Nakai , Toshiaki Takagi
发明人： Katsushi Matsumoto , Junichi Nakai , Toshiaki Takagi
IPC分类号： C23C14/00 , C23C14/34 , C22C9/00 , C22C21/00 , C22C1/02
CPC分类号： C23C14/3407 , C22C1/02 , C22C9/00 , C22C21/00 , C23C14/3414
摘要： Film-formation rate can be increased in the pre-sputtering and in the subsequent sputtering onto a substrate or the like, and sputtering failures such as splashes can be inhibited, by making an Al-based alloy or Cu-based alloy spurting target fulfill the following requirements (1) and/or (2) when the total area ratio of crystal orientations ±15°, ±15°, ±15°, ±15°, and ±15° in the sputtering surface normal direction in the depth within 1 mm from the uppermost surface of the sputtering target is referred to as a P value: (1) the area ratio PA of ±15° to the P value: 40% or lower; and (2) the total area ratio PB of ±15° and ±15° to the P value: 20% or higher.
摘要翻译：可以在预溅射和随后的溅射中将成膜速度提高到基板等上，并且通过使Al基合金或Cu基合金喷涂靶达到晶体取向的总面积比<001>±15°，<011>±15°，<111>±15°，<112>±15°和<012时的以下要求（1）和/或（2）在溅射靶的最上表面1mm以内的深度的溅射面法线方向>±15°被称为P值：（1）<011>±15°的面积比PA与P值：40％以下; 和（2）总面积比PB <001>±15°和<111>±15°至P值：20％或更高。

5. 发明申请

US20090165901A1 ALUMINUM ALLOY CLAD SHEET FOR A HEAT EXCHANGER AND ITS PRODUCTION METHOD 有权
标题翻译：用于热交换器的铝合金板及其生产方法
公开(公告)号：US20090165901A1
公开(公告)日：2009-07-02
申请号：US12335950
申请日：2008-12-16
申请人： Fumihiro KOSHIGOE , Toshiki Ueda , Shimpei Kimura , Masao Kinefuchi , Katsushi Matsumoto , Eiichi Tamura
发明人： Fumihiro KOSHIGOE , Toshiki Ueda , Shimpei Kimura , Masao Kinefuchi , Katsushi Matsumoto , Eiichi Tamura
IPC分类号： C22F1/05 , C22C21/04
CPC分类号： B32B15/016 , C22C21/02 , C22C21/14 , C22F1/04 , Y10T428/12764 , Y10T428/31504 , Y10T428/31678
摘要： Disclosed herein is an aluminum alloy clad sheet for a heat exchanger including a core layer, a sacrificial layer formed on one surface of the core layer, and a filler layer including an Al—Si based alloy formed on the other surface of the core layer. The core layer includes a predetermined amount of Si, Cu, Mn, Ti, and Mg, the remainder including Al and inevitable impurities, and the sacrificial layer includes a predetermined amount of Si, Mn, and Zn, the remainder including Al and inevitable impurities. The core layer has a crystal grain size after the brazing heat treatment at 595° C. for 3 minutes of at least 50 μm and less than 300 μm. The filler layer and the sacrificial layer are defined for their thickness, and the number of intermetallic compounds in the core layer is also defined to a predetermined range. By such constitution, the aluminum alloy clad sheet has improved fatigue life and post-braze strength, high corrosion resistance, and excellent erosion resistance and brazeability.
摘要翻译：本发明公开了一种用于热交换器的铝合金包覆板，其包括芯层，在芯层的一个表面上形成的牺牲层和在芯层的另一个表面上形成的包含Al-Si基合金的填充层。芯层包含预定量的Si，Cu，Mn，Ti和Mg，剩余部分包括Al和不可避免的杂质，牺牲层包含预定量的Si，Mn和Zn，剩余部分包括Al和不可避免的杂质。核心层在595℃钎焊热处理后具有至少50μm和小于300μm3分钟的晶粒尺寸。填充层和牺牲层是为了其厚度而定义的，并且芯层中的金属间化合物的数量也被限定在预定范围内。通过这种结构，铝合金复合板具有改善的疲劳寿命和后钎焊强度，高耐腐蚀性和优异的耐冲蚀性和钎焊性。

6. 发明申请

US20090017328A1 FLUX-CORED WIRE FOR DIFFERENT-MATERIAL BONDING AND METHOD OF BONDING DIFFERENT MATERIALS 有权
标题翻译：用于不同材料结合的通用线和粘合不同材料的方法
公开(公告)号：US20090017328A1
公开(公告)日：2009-01-15
申请号：US12279470
申请日：2007-02-06
申请人： Jun Katoh , Mikako Takeda , Seiji Sasabe , Katsushi Matsumoto , Hidekazu Ido , Tsuyoshi Matsumoto
发明人： Jun Katoh , Mikako Takeda , Seiji Sasabe , Katsushi Matsumoto , Hidekazu Ido , Tsuyoshi Matsumoto
IPC分类号： B32B15/01 , B23K35/34 , B23K9/00
CPC分类号： B23K35/0266 , B23K9/173 , B23K9/232 , B23K35/362 , B23K35/406 , B23K2101/18 , B23K2103/20 , Y10T428/12757
摘要： There are provided a flux cored wire for joining dissimilar materials with each other, capable of enhancing a bonding strength upon joining an aluminum-base material with a steel-base material, and excellent in bonding efficiency, a method for joining the dissimilar materials with each other, and a bonded joint obtained by the method. In particular, there is provided a method for joining dissimilar materials with each other, in the case of melt weld-bonding of high-strength dissimilar materials with each other, that is, the high-strength steel member with the high-strength 6000 series aluminum alloy member and in the case of the steel member being a galvanized steel member. In one mode, use is made of a flux cored wire wherein the interior of an aluminum alloy envelope is filled up with a flux, the flux has fluoride composition containing a given amount of AlF3 without containing chloride, and the aluminum alloy of the envelope contains Si in a range of 1 to 13 mass %. If such a flux cored wire is use, it is possible to obtain a high bonding strength in the case of melt weld-bonding of high-strength dissimilar materials with each other, that is, the high-strength steel member with the high-strength 6000 series aluminum alloy member.
摘要翻译：提供了用于将不同材料彼此接合的药芯焊丝，能够在将铝基材料与钢基材料接合时提高接合强度，并且接合效率优异，将不同材料与各种材料接合的方法另外，通过该方法得到的接合接头。特别是提供了一种将异种材料彼此接合的方法，在高强度异种材料彼此熔融熔接的情况下，即具有高强度6000系列的高强度钢构件铝合金构件，在钢构件为镀锌钢构件的情况下。在一种模式中，使用药芯焊丝，其中铝合金外壳的内部填充有焊剂，焊剂具有含有给定量的不含氯化物的AlF 3的氟化物组合物，并且信封的铝合金包含 Si在1〜13质量％的范围内。如果使用这样的药芯焊丝，则在高强度异种材料的熔融熔接的情况下，即具有高强度的高强度钢构件的情况下，可以获得高的接合强度 6000系列铝合金构件。

7. 发明申请

US20070212565A1 Joined Body of Dissimilar Materials Comprising Steel Material and Aluminum Material, and Joining Method Therefor 有权
标题翻译：包括钢材和铝材料的不同材料的接合体及其连接方法
公开(公告)号：US20070212565A1
公开(公告)日：2007-09-13
申请号：US11578406
申请日：2005-04-20
申请人： Wataru Urushihara , Mikako Takeda , Katsushi Matsumoto , Jun Katoh , Yasuaki Sugizaki , Hidekazu Ido
发明人： Wataru Urushihara , Mikako Takeda , Katsushi Matsumoto , Jun Katoh , Yasuaki Sugizaki , Hidekazu Ido
IPC分类号： B23K9/007
CPC分类号： B23K11/20 , B23K2103/20 , Y10T428/12194 , Y10T428/12229 , Y10T428/12757 , Y10T428/12951
摘要： To provide a steel-aluminum welded material and a spot welding method therefor having high weld strength. The steel-aluminum welded material 3 includes a steel material 1 and an aluminum material 2 having predetermined widths. The area of a nugget 5 of a spot-welded part is determined as a function of the thickness of the aluminum material 2, and the area of a part of the nugget 5 corresponding to a part having a thickness in a range between 0.5 and 10 μm of an interface reaction layer 6 is defined as a function of the thickness of the aluminum material 2.
摘要翻译：提供具有高焊接强度的钢 - 铝焊接材料和点焊方法。钢 - 铝焊接材料3包括钢材1和具有预定宽度的铝材料2。点焊部分的熔核5的面积根据铝材料2的厚度确定，并且熔核5的一部分的面积对应于厚度在0.5和10之间的部分的面积界面反应层6的母体被定义为铝材料2的厚度的函数。

8. 发明申请

US20050274776A1 Dissimilar material weld joint formed by joining iron type material and aluminum type material, and weld joining method 有权
标题翻译：通过接合铁型材料和铝型材料形成的不同材料焊接接头和焊接方法
公开(公告)号：US20050274776A1
公开(公告)日：2005-12-15
申请号：US11147241
申请日：2005-06-08
申请人： Mikako Takeda , Katsushi Matsumoto , Masao Kinefuchi , Tomokazu Nakagawa , Koji Fukumoto , Hiroyuki Takeda , Yasuo Murai
发明人： Mikako Takeda , Katsushi Matsumoto , Masao Kinefuchi , Tomokazu Nakagawa , Koji Fukumoto , Hiroyuki Takeda , Yasuo Murai
IPC分类号： B23K9/23 , B23K26/32 , B23K33/00 , B23K35/24 , B23K1/19 , B23K20/16
CPC分类号： B23K9/232 , B23K26/32 , B23K26/323 , B23K33/004 , B23K2103/18 , B23K2103/20 , B23K2103/50 , Y10T428/12347 , Y10T428/12757
摘要： Disclosed are: a dissimilar material weld joint being formed by joining an iron type material and an aluminum type material and having not only a high strength but also an excellent ductility; and a weld joining method allowing such a joint to be stably produced. A dissimilar material weld joint 1 formed by joining an iron type material 2 and an aluminum type material 3, wherein: voids 4a are formed beforehand on the side of said iron type material 2 at a predetermined interval along a weld line 6; both said iron type and aluminum type materials are weld joined so that said voids 4a are filled with molten aluminum 7; and the minimum value of the ratio (L-Al)/(L-Fe) of the length (L-Al) of an aluminum type welding material 10 with which said voids 4a are filled to the length (L-Fe) of said iron type material 2 adjacent to said voids 4a filled with said aluminum type welding material 10 along said weld line 6 on the section containing said weld line 6 is in the range from 0.5 to 7, both the lengths (L-Al) and (L-Fe) being the lengths per 100 mm in length of the weld line 6 formed after welding.
摘要翻译：公开了一种不同材料焊接接头，其通过连接铁型材料和铝型材料而形成，并且不仅具有高强度，而且具有优异的延展性; 以及允许稳定地制造这种接头的焊接接合方法。通过接合铁型材料2和铝型材料3而形成的不同材料焊接接头1，其中：沿着焊接线6以预定的间隔预先在所述铁型材料2侧形成空隙4a; 所述铁型和铝型两种材料均焊接在一起，使得所述空隙4a充满熔融铝7; 将填充有空隙4a的铝型焊接材料10的长度（L-Al）的长度（L-Al）的最小值（L-Al）/（L-Fe）在包含所述焊接线6的部分上沿着所述焊接线6填充有所述铝型焊接材料10的所述铁型材料2的所述铁型材料2在0.5至7的范围内，长度（L-A1）和（L-Fe）是焊接后形成的焊接线6的长度每100mm的长度。

9. 发明授权

US09845521B2 Copper alloy 有权
公开(公告)号：US09845521B2
公开(公告)日：2017-12-19
申请号：US13299828
申请日：2011-11-18
申请人： Hisao Shishido , Shinya Katsura , Yasuhiro Aruga , Katsushi Matsumoto
发明人： Hisao Shishido , Shinya Katsura , Yasuhiro Aruga , Katsushi Matsumoto
IPC分类号： C22C9/06 , C22C9/02 , C22F1/08 , H01B1/02 , C22C1/02 , H05K1/09
CPC分类号： C22C9/06 , C22C1/02 , C22F1/08 , H01B1/026 , H05K1/09
摘要： A copper alloy containing Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent with the remainder consisting of copper and unavoidable impurities, wherein: the average crystal grain size of the crystal grains in the copper alloy is 5 to 30 μm; the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 3%; and the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%.

10. 发明申请

US20120021240A1 JOINT PRODUCT BETWEEN STEEL PRODUCT AND ALUMINUM MATERIAL, SPOT WELDING METHOD FOR THE JOINT PRODUCT, AND ELECTRODE CHIP FOR USE IN THE JOINT PRODUCT 有权
标题翻译：钢产品和铝材料之间的接合产品，接头产品的点焊焊接方法和用于接合产品的电极芯片
公开(公告)号：US20120021240A1
公开(公告)日：2012-01-26
申请号：US13192069
申请日：2011-07-27
申请人： Wataru Urushihara , Mikako Takeda , Katsushi Matsumoto , Jun Katoh
发明人： Wataru Urushihara , Mikako Takeda , Katsushi Matsumoto , Jun Katoh
IPC分类号： B23K9/007 , B32B15/20 , B32B15/18
CPC分类号： B23K11/115 , B23K11/20 , B23K11/3009 , B23K2101/006 , B23K2101/18 , B23K2101/20 , B23K2103/20 , C09J5/10 , Y10T428/12347
摘要： Provided is a joint product of a steel product and an aluminum material, the joint product being formed by joining the steel product having a sheet thickness t1 of 0.3 to 3.0 mm with the aluminum material having a sheet thickness t2 of 0.5 to 4.0 mm by spot welding, wherein a nugget area in a joint part is from 20×t20.5 to 100×t20.5 mm2, an area of a portion where a thickness of an interface reaction layer is from 0.5 to 3 μm is 10×t20.5 mm2 or more, and a difference between the thickness of the interface reaction layer at a joint part center and the thickness of the interface reaction layer at a point distant from the joint part center by a distance of one-fourth of a joint diameter is 5 μm or less, and wherein the aluminum material is pure aluminum or an aluminum alloy material.
摘要翻译：提供钢材和铝材的联合产品，该接合产品通过将板厚t1为0.3至3.0mm的钢制品与片材厚度t2为0.5至4.0mm的铝材料接合而形成，焊接中，接合部的熔核区域为20×t20.5〜100×t20.5mm2，界面反应层的厚度为0.5〜3μm的部分的面积为10×t20.5 mm2以上，接合部中心的界面反应层的厚度与界面反应层的距离接合部中心的距离为接头直径的四分之一的距离的差为5 μm以下，铝材是纯铝或铝合金材料。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式