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1. 发明授权

US07824607B2 Aluminum alloy sheet 有权
标题翻译：铝合金板
公开(公告)号：US07824607B2
公开(公告)日：2010-11-02
申请号：US11957825
申请日：2007-12-17
申请人： Katsura Kajihara , Takeshi Kudo , Yasuhiro Aruga , Katsushi Matsumoto
发明人： Katsura Kajihara , Takeshi Kudo , Yasuhiro Aruga , Katsushi Matsumoto
IPC分类号： C22C21/00 , C22C21/02 , C22C21/06 , C22C21/12
CPC分类号： C22C21/02 , C22C21/06 , C22C21/08 , C22F1/04 , C22F1/043 , C22F1/047 , C22F1/05
摘要： Disclosed is an aluminum alloy sheet resistant to deterioration through natural aging. The aluminum alloy sheet is an Al—Mg—Si aluminum alloy sheet containing 0.35 to 1.0 percent by mass of magnesium; 0.5 to 1.5 percent by mass of silicon; 0.01 to 1.0 percent by mass of manganese; and 0.001 to 1.0 percent by mass of copper, with the remainder being aluminum and inevitable impurities, in which the amount of dissolved silicon is 0.55 to 0.80 percent by mass, the amount of dissolved magnesium is 0.35 to 0.60 percent by mass, and the ratio of the former to the latter is 1.1 to 2. The aluminum alloy sheet may further contain 0.005 to 0.2 percent by mass of titanium with or without 0.0001 to 0.05 percent by mass of boron.
摘要翻译：公开了一种耐天然老化劣化的铝合金板。铝合金板是含有0.35〜1.0质量％的镁的Al-Mg-Si铝合金板; 0.5〜1.5质量％的硅; 0.01〜1.0质量％的锰; 和0.001〜1.0质量％的铜，其余为铝和不可避免的杂质，其中溶解的硅的量为0.55〜0.80质量％，溶解的镁的含量为0.35〜0.60质量％前者为1.1〜2.铝合金板还可以含有0.005〜0.2质量％的钛，其含有或不含有0.0001〜0.05质量％的硼。

2. 发明申请

US20080175747A1 ALUMINUM ALLOY SHEET 有权
标题翻译：铝合金板
公开(公告)号：US20080175747A1
公开(公告)日：2008-07-24
申请号：US11957825
申请日：2007-12-17
申请人： Katsura Kajihara , Takeshi Kudo , Yasuhiro Aruga , Katsushi Matsumoto
发明人： Katsura Kajihara , Takeshi Kudo , Yasuhiro Aruga , Katsushi Matsumoto
IPC分类号： C22C21/00
CPC分类号： C22C21/02 , C22C21/06 , C22C21/08 , C22F1/04 , C22F1/043 , C22F1/047 , C22F1/05
摘要： Disclosed is an aluminum alloy sheet resistant to deterioration through natural aging. The aluminum alloy sheet is an Al—Mg—Si aluminum alloy sheet containing 0.35 to 1.0 percent by mass of magnesium; 0.5 to 1.5 percent by mass of silicon; 0.01 to 1.0 percent by mass of manganese; and 0.001 to 1.0 percent by mass of copper, with the remainder being aluminum and inevitable impurities, in which the amount of dissolved silicon is 0.55 to 0.80 percent by mass, the amount of dissolved magnesium is 0.35 to 0.60 percent by mass, and the ratio of the former to the latter is 1.1 to 2. The aluminum alloy sheet may further contain 0.005 to 0.2 percent by mass of titanium with or without 0.0001 to 0.05 percent by mass of boron.
摘要翻译：公开了一种耐天然老化劣化的铝合金板。铝合金板是含有0.35〜1.0质量％的镁的Al-Mg-Si铝合金板; 0.5〜1.5质量％的硅; 0.01〜1.0质量％的锰; 和0.001〜1.0质量％的铜，其余为铝和不可避免的杂质，其中溶解的硅的量为0.55〜0.80质量％，溶解的镁的含量为0.35〜0.60质量％前者为1.1〜2.铝合金板还可以含有0.005〜0.2质量％的钛，其含有或不含有0.0001〜0.05质量％的硼。

3. 发明授权

US08357248B2 Copper alloy having high strength, high electric conductivity and excellent bending workability 有权
标题翻译：铜合金具有高强度，高导电性和优异的弯曲加工性能
公开(公告)号：US08357248B2
公开(公告)日：2013-01-22
申请号：US13491911
申请日：2012-06-08
申请人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
发明人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
IPC分类号： C22C9/02 , C22C9/04 , C22C9/06
CPC分类号： H01B1/026 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H01H1/025
摘要： A copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.
摘要翻译：铜合金具有高强度，高导电性和优异的弯曲性，该铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。

4. 发明申请

US20090101243A1 Copper Alloy Having High Strength, High Electric Conductivity and Excellent Bending Workability 有权
标题翻译：铜合金具有高强度，高导电性和优异的弯曲加工性能
公开(公告)号：US20090101243A1
公开(公告)日：2009-04-23
申请号：US12297069
申请日：2007-05-23
申请人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
发明人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
IPC分类号： C22C9/02 , C22C9/06 , C22C9/04
CPC分类号： H01B1/026 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H01H1/025
摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.
摘要翻译：本发明涉及一种具有高强度，高导电性和优异的弯曲性的铜合金，铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。

5. 发明授权

US09177686B2 Copper alloy having high strength, high electric conductivity and excellent bending workability 有权
标题翻译：铜合金具有高强度，高导电性和优异的弯曲加工性能
公开(公告)号：US09177686B2
公开(公告)日：2015-11-03
申请号：US13491942
申请日：2012-06-08
申请人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
发明人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
IPC分类号： C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22F1/00 , H01B1/02 , C22C9/10 , C22F1/08 , H01H1/025
CPC分类号： H01B1/026 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H01H1/025
摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer.
摘要翻译：本发明涉及一种具有高强度，高导电性和优异的弯曲性的铜合金，铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。

6. 发明申请

US20090084473A1 COPPER ALLOY WITH HIGH STRENGTH AND EXCELLENT PROCESSABILITY IN BENDING AND PROCESS FOR PRODUCING COPPER ALLOY SHEET 审中-公开
标题翻译：具有高强度和优异处理性能的铜合金，用于生产铜合金板材的弯曲和工艺
公开(公告)号：US20090084473A1
公开(公告)日：2009-04-02
申请号：US11994136
申请日：2006-06-19
申请人： Yasuhiro Aruga , Katsura Kajihara , Takeshi Kudo
发明人： Yasuhiro Aruga , Katsura Kajihara , Takeshi Kudo
IPC分类号： C22F1/08 , C22C9/00
CPC分类号： C22F1/08 , B21B2003/005 , B22D11/004 , B22D21/025 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/05 , C22C9/06
摘要： The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.
摘要翻译：本发明提供一种具有高强度，高导电性和优异的弯曲加工性的Cu-Fe-P合金。铜合金含有0.01〜1.0％的Fe，0.01〜0.4％的P，0.1〜1.0％的Mg，余量为Cu和不可避免的杂质。控制铜合金中包含Mg的氧化物和析出物的大小，使得通过规定的提取残渣法，通过规定的测定方法测定的Mg量与所述铜合金中的Mg含量之比为60％以下，从而赋予合金高强度和优异的弯曲加工性。

7. 发明授权

US08268098B2 Copper alloy having high strength, high electric conductivity and excellent bending workability 有权
标题翻译：铜合金具有高强度，高导电性和优异的弯曲加工性能
公开(公告)号：US08268098B2
公开(公告)日：2012-09-18
申请号：US12297069
申请日：2007-05-23
申请人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
发明人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
IPC分类号： C22C9/02 , C22C9/04 , C22C9/06
CPC分类号： H01B1/026 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H01H1/025
摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.
摘要翻译：本发明涉及一种具有高强度，高导电性和优异的弯曲性的铜合金，铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。

8. 发明授权

US08715431B2 Copper alloy plate for electric and electronic parts having bending workability 有权
标题翻译：具有弯曲加工性能的电气电子部件用铜合金板
公开(公告)号：US08715431B2
公开(公告)日：2014-05-06
申请号：US11573041
申请日：2005-08-11
申请人： Yasuhiro Aruga , Katsura Kajihara
发明人： Yasuhiro Aruga , Katsura Kajihara
IPC分类号： C22C9/00 , C22C9/06
CPC分类号： H01L23/49579 , C22C9/00 , C22C9/02 , H01L2924/0002 , H01L2924/3011 , H05K1/09 , H05K2201/0355 , H01L2924/00
摘要： A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis, wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.
摘要翻译：提供了具有高强度和高导电性的Cu-Fe-P铜合金板，具有优异的弯曲性。 Cu-Fe-P铜合金板含有0.01％〜3.0％的Fe和0.01〜0.3％的P，以质量计为基准，其中黄铜取向的取向密度为20以下，黄铜取向的密度，S取向和铜取向在铜合金板的组织中为10以上且50以下。

9. 发明申请

US20090053099A1 ALUMINUM ALLOY SHEET WITH EXCELLENT HIGH-TEMPERATURE PROPERTY FOR BOTTLE CAN 审中-公开
标题翻译：铝合金板材，具有出色的高温特性
公开(公告)号：US20090053099A1
公开(公告)日：2009-02-26
申请号：US11909665
申请日：2006-03-07
申请人： Katsura Kajihara , Kiyohito Tsuruda , Yasuhiro Aruga
发明人： Katsura Kajihara , Kiyohito Tsuruda , Yasuhiro Aruga
IPC分类号： C22C21/08
CPC分类号： C22C21/08 , C22C21/00
摘要： An aluminum alloy sheet for bottle cans superior in high-temperature properties and capable of preventing thermal deformation thereof in coating and heat treatment and securing can strength after the heat treatment. The aluminum alloy sheet has the following composition: Mn 0.7-1.5%, Mg 0.8-1.7%, Fe 0.1-0.7%, Si 0.05-0.5%, Cu 0.1-0.6%, with the remainder being Al and inevitable impurities, and has a crystal structure elongated in a rolling direction and with an aspect ratio of crystal grains of 3 or more as determined through an examination from above of a part located at the center in the through-thickness direction. In the sheet, the amount of solute Cu is 0.05-0.3%, which means the amount of Cu in a solution separated from a precipitate exceeding 0.2 m in particle size by the extracted residue method using hot phenol, and the amount of solute Mg is 0.75-1.6%, which means the amount of solute Mg separated from a precipitate exceeding 0.2 m in particle size by the extracted residue method using hot phenol. The aluminum alloy sheet can have improved high-temperature properties without impairing its formability.
摘要翻译：一种用于高温性能优异且能够防止其热涂覆和热处理和固化的热变形的瓶罐用铝合金板，可以在热处理后具有强度。铝合金板具有以下组成：Mn 0.7-1.5％，Mg 0.8-1.7％，Fe 0.1-0.7％，Si 0.05-0.5％，Cu 0.1-0.6％，其余为Al和不可避免的杂质，并具有通过从位于贯穿厚度方向的中心的部分的上方检查确定的，在轧制方向上延伸的晶体结构和晶粒的纵横比为3以上。在片材中，溶质Cu的量为0.05〜0.3％，这意味着通过使用热苯酚的提取残渣法从沉淀超过0.2μm的析出物中分离出的溶液中的Cu的量，溶质Mg的量为 0.75-1.6％，这意味着通过使用热苯酚的提取残留方法从沉淀超过0.2μm的沉淀物中分离出的溶质Mg的量。铝合金板可以具有改善的高温性能而不损害其成形性。

10. 发明申请

US20080025867A1 COPPER ALLOY HAVING HIGH STRENGTH AND HIGH SOFTENING RESISTANCE 审中-公开
标题翻译：铜合金具有高强度和高抗电阻性能
公开(公告)号：US20080025867A1
公开(公告)日：2008-01-31
申请号：US11756117
申请日：2007-05-31
申请人： Yasuhiro ARUGA , Ryoichi Ozaki , Katsura Kajihara
发明人： Yasuhiro ARUGA , Ryoichi Ozaki , Katsura Kajihara
IPC分类号： C22C9/02
CPC分类号： C22C9/02 , C22C9/00 , C22C9/04 , C22F1/08 , H01L23/49579 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a Cu—Fe—P alloy capable of enabling high strength, high electrical conductivity, and excellent softening resistance to coexist. The Cu—Fe—P alloy is suitable for use as a constituent material of a lead frame for a semiconductor device. With the Cu—Fe—P alloy with strength rendered higher by micronizing Fe-containing compounds, when enhancing softening resistance by increasing Sn content so as to exceed 0.5 mass %, at least one element selected from the group consisting of Ni, Mg, Ca, Al, Si, and Cr, in trace amounts, are caused to be additionally contained to thereby check cracking likely to occur at the time of forging and hot rolling in a process of producing the copper alloy, as a result of an increase in the Sn content.
摘要翻译：公开了能够实现高强度，高导电性和优异的耐软化性共存的Cu-Fe-P合金。 Cu-Fe-P合金适用于半导体器件的引线框架的构成材料。对于通过使含Fe化合物微粉化而使强度提高的Cu-Fe-P合金，当通过使Sn含量增加超过0.5质量％来提高耐软化性时，选自Ni，Mg，Ca ，Al，Si和Cr的微量添加，从而可以检测在铜合金的制造过程中在锻造和热轧时容易发生的裂纹，结果是 Sn含量。

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