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1. 发明申请

US20090053099A1 ALUMINUM ALLOY SHEET WITH EXCELLENT HIGH-TEMPERATURE PROPERTY FOR BOTTLE CAN 审中-公开
标题翻译：铝合金板材，具有出色的高温特性
公开(公告)号：US20090053099A1
公开(公告)日：2009-02-26
申请号：US11909665
申请日：2006-03-07
申请人： Katsura Kajihara , Kiyohito Tsuruda , Yasuhiro Aruga
发明人： Katsura Kajihara , Kiyohito Tsuruda , Yasuhiro Aruga
IPC分类号： C22C21/08
CPC分类号： C22C21/08 , C22C21/00
摘要： An aluminum alloy sheet for bottle cans superior in high-temperature properties and capable of preventing thermal deformation thereof in coating and heat treatment and securing can strength after the heat treatment. The aluminum alloy sheet has the following composition: Mn 0.7-1.5%, Mg 0.8-1.7%, Fe 0.1-0.7%, Si 0.05-0.5%, Cu 0.1-0.6%, with the remainder being Al and inevitable impurities, and has a crystal structure elongated in a rolling direction and with an aspect ratio of crystal grains of 3 or more as determined through an examination from above of a part located at the center in the through-thickness direction. In the sheet, the amount of solute Cu is 0.05-0.3%, which means the amount of Cu in a solution separated from a precipitate exceeding 0.2 m in particle size by the extracted residue method using hot phenol, and the amount of solute Mg is 0.75-1.6%, which means the amount of solute Mg separated from a precipitate exceeding 0.2 m in particle size by the extracted residue method using hot phenol. The aluminum alloy sheet can have improved high-temperature properties without impairing its formability.
摘要翻译：一种用于高温性能优异且能够防止其热涂覆和热处理和固化的热变形的瓶罐用铝合金板，可以在热处理后具有强度。铝合金板具有以下组成：Mn 0.7-1.5％，Mg 0.8-1.7％，Fe 0.1-0.7％，Si 0.05-0.5％，Cu 0.1-0.6％，其余为Al和不可避免的杂质，并具有通过从位于贯穿厚度方向的中心的部分的上方检查确定的，在轧制方向上延伸的晶体结构和晶粒的纵横比为3以上。在片材中，溶质Cu的量为0.05〜0.3％，这意味着通过使用热苯酚的提取残渣法从沉淀超过0.2μm的析出物中分离出的溶液中的Cu的量，溶质Mg的量为 0.75-1.6％，这意味着通过使用热苯酚的提取残留方法从沉淀超过0.2μm的沉淀物中分离出的溶质Mg的量。铝合金板可以具有改善的高温性能而不损害其成形性。

2. 发明申请

US20080302454A1 Cold-Rolled Aluminum Alloy Sheet for Bottle Can with Excellent Neck Part Formability and Process for Producing the Cold-Rolled Aluminum Alloy Sheet 审中-公开
标题翻译：用于生产冷轧铝合金板的优良颈部部件成形性和冷轧铝合金板
公开(公告)号：US20080302454A1
公开(公告)日：2008-12-11
申请号：US12090879
申请日：2006-09-14
申请人： Katsura Kajihara , Kiyohito Tsuruda
发明人： Katsura Kajihara , Kiyohito Tsuruda
IPC分类号： C22F1/047 , C22C21/08
CPC分类号： C22C21/08 , C22C21/00 , C22F1/047
摘要： A cold-rolled aluminum alloy sheet has a composition containing 0.7 to 1.5% by mass Mn, 0.8 to 1.7% by mass Mg, 0.1 to 0.7% by mass Fe, 0.05 to 0.5% by mass Si, 0.1 to 0.6% by mass Cu, and Al and inevitable impurities as other elements. In the structure of the cold-rolled aluminum alloy sheet, 50 to 400 particles of particle sizes in the range of 0.05 to 1 μm are dispersed in an area of 300 μm2 when observed under a TEM at a magnification in the range of 5,000× to 15,000× magnification, and the ratio of the number of the dispersed particles of sizes of 0.3 μm or above to the number of all the dispersed particles is in the range of 15 to 70%.
摘要翻译：冷轧铝合金板具有Mn：0.7〜1.5质量％，Mg：0.8〜1.7质量％，Fe：0.1〜0.7质量％，Si：0.05〜0.5质量％，Cu：0.1〜0.6质量％，Al和不可避免的杂质作为其它元素。在冷轧铝合金板的结构中，当在TEM下观察时，将粒径在0.05〜1μm范围内的50〜400个粒子分散在300mum2的范围内，放大率为5000× 15000倍放大倍数，0.3μm以上的分散粒子数与全部分散粒子数的比例为15〜70％。

3. 发明授权

US08715431B2 Copper alloy plate for electric and electronic parts having bending workability 有权
标题翻译：具有弯曲加工性能的电气电子部件用铜合金板
公开(公告)号：US08715431B2
公开(公告)日：2014-05-06
申请号：US11573041
申请日：2005-08-11
申请人： Yasuhiro Aruga , Katsura Kajihara
发明人： Yasuhiro Aruga , Katsura Kajihara
IPC分类号： C22C9/00 , C22C9/06
CPC分类号： H01L23/49579 , C22C9/00 , C22C9/02 , H01L2924/0002 , H01L2924/3011 , H05K1/09 , H05K2201/0355 , H01L2924/00
摘要： A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis, wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.
摘要翻译：提供了具有高强度和高导电性的Cu-Fe-P铜合金板，具有优异的弯曲性。 Cu-Fe-P铜合金板含有0.01％〜3.0％的Fe和0.01〜0.3％的P，以质量计为基准，其中黄铜取向的取向密度为20以下，黄铜取向的密度，S取向和铜取向在铜合金板的组织中为10以上且50以下。

4. 发明申请

US20080025867A1 COPPER ALLOY HAVING HIGH STRENGTH AND HIGH SOFTENING RESISTANCE 审中-公开
标题翻译：铜合金具有高强度和高抗电阻性能
公开(公告)号：US20080025867A1
公开(公告)日：2008-01-31
申请号：US11756117
申请日：2007-05-31
申请人： Yasuhiro ARUGA , Ryoichi Ozaki , Katsura Kajihara
发明人： Yasuhiro ARUGA , Ryoichi Ozaki , Katsura Kajihara
IPC分类号： C22C9/02
CPC分类号： C22C9/02 , C22C9/00 , C22C9/04 , C22F1/08 , H01L23/49579 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a Cu—Fe—P alloy capable of enabling high strength, high electrical conductivity, and excellent softening resistance to coexist. The Cu—Fe—P alloy is suitable for use as a constituent material of a lead frame for a semiconductor device. With the Cu—Fe—P alloy with strength rendered higher by micronizing Fe-containing compounds, when enhancing softening resistance by increasing Sn content so as to exceed 0.5 mass %, at least one element selected from the group consisting of Ni, Mg, Ca, Al, Si, and Cr, in trace amounts, are caused to be additionally contained to thereby check cracking likely to occur at the time of forging and hot rolling in a process of producing the copper alloy, as a result of an increase in the Sn content.
摘要翻译：公开了能够实现高强度，高导电性和优异的耐软化性共存的Cu-Fe-P合金。 Cu-Fe-P合金适用于半导体器件的引线框架的构成材料。对于通过使含Fe化合物微粉化而使强度提高的Cu-Fe-P合金，当通过使Sn含量增加超过0.5质量％来提高耐软化性时，选自Ni，Mg，Ca ，Al，Si和Cr的微量添加，从而可以检测在铜合金的制造过程中在锻造和热轧时容易发生的裂纹，结果是 Sn含量。

5. 发明授权

US08357248B2 Copper alloy having high strength, high electric conductivity and excellent bending workability 有权
标题翻译：铜合金具有高强度，高导电性和优异的弯曲加工性能
公开(公告)号：US08357248B2
公开(公告)日：2013-01-22
申请号：US13491911
申请日：2012-06-08
申请人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
发明人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
IPC分类号： C22C9/02 , C22C9/04 , C22C9/06
CPC分类号： H01B1/026 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H01H1/025
摘要： A copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.
摘要翻译：铜合金具有高强度，高导电性和优异的弯曲性，该铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。

6. 发明申请

US20090101243A1 Copper Alloy Having High Strength, High Electric Conductivity and Excellent Bending Workability 有权
标题翻译：铜合金具有高强度，高导电性和优异的弯曲加工性能
公开(公告)号：US20090101243A1
公开(公告)日：2009-04-23
申请号：US12297069
申请日：2007-05-23
申请人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
发明人： Yasuhiro Aruga , Akira Fugono , Takeshi Kudo , Katsura Kajihara
IPC分类号： C22C9/02 , C22C9/06 , C22C9/04
CPC分类号： H01B1/026 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H01H1/025
摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.
摘要翻译：本发明涉及一种具有高强度，高导电性和优异的弯曲性的铜合金，铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。

7. 发明授权

US08641837B2 Copper alloy having excellent stress relaxation property 有权
标题翻译：铜合金具有优异的应力松弛性能
公开(公告)号：US08641837B2
公开(公告)日：2014-02-04
申请号：US11469648
申请日：2006-09-01
申请人： Yasuhiro Aruga , Katsura Kajihara
发明人： Yasuhiro Aruga , Katsura Kajihara
IPC分类号： C22C9/06
CPC分类号： C22C9/02 , C22C9/06 , C22F1/08
摘要： A Cu—Ni—Sn—P alloy is provided, which is excellent in stress relaxation property in a direction perpendicular to a rolling direction, and has any of high strength, high conductivity, and excellent bendability. A copper alloy contains 0.1 to 3.0% of Ni, 0.1 to 3.0% of Sn, and 0.01 to 0.3% of P in mass percent respectively, and includes copper and inevitable impurities as the remainder; wherein in a radial distribution function around a Ni atom according to a XAFS analysis method, a first peak position is within a range of 2.16 to 2.35 Å, the position indicating a distance between a Ni atom in Cu and an atom nearest to the Ni atom. Thus, distances to atoms around the Ni atom in Cu are comparatively increased, so that the stress relaxation property in a direction perpendicular to the rolling direction of the copper alloy is improved.
摘要翻译：提供了一种Cu-Ni-Sn-P合金，其在与轧制方向垂直的方向上的应力松弛性优异，并且具有高强度，高导电性和优异的弯曲性。铜合金分别含有0.1〜3.0％的Ni，0.1〜3.0％的Sn和0.01〜0.3％的P，以及其余的铜和不可避免的杂质; 其中，根据XAFS分析方法在围绕Ni原子的径向分布函数中，第一峰位置在2.16〜2.35的范围内，该位置表示Cu中的Ni原子和最接近Ni原子的原子之间的距离。因此，Cu中的Ni原子周围的原子的距离相对增加，从而提高了与铜合金的轧制方向垂直的方向上的应力松弛性。

8. 发明申请

US20090116996A1 COPPER ALLOY, COPPER ALLOY PLATE, AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：铜合金，铜合金板及其制造方法
公开(公告)号：US20090116996A1
公开(公告)日：2009-05-07
申请号：US11916730
申请日：2006-06-08
申请人： Yasuhiro Aruga , Koya Nomura , Katsura Kajihara , Yukio Sugishita , Hiroshi Sakamoto
发明人： Yasuhiro Aruga , Koya Nomura , Katsura Kajihara , Yukio Sugishita , Hiroshi Sakamoto
IPC分类号： C22C9/02 , C22C9/06
CPC分类号： C22C9/06 , C22C9/02 , C22F1/08
摘要： A copper alloy with an excellent stress relaxation resistance including Ni: 0.1 through 3.0 mass %, Sn: 0.01 through 3.0 mass %, P: 0.01 through 0.3 mass % and remainder copper and inevitable impurities, and the Ni content in extracted residues separated and left on a filter having filter mesh size of 0.1 μm by using an extracted residues method accounting for 40 mass % or less of the Ni content in the copper alloy, wherein the extracted residues method requires that 10 g of the copper alloy is immersed in 300 ml of a methanol solution which contains 10 mass % of ammonium acetate, and using the copper alloy as the anode and platinum as the cathode, constant-current electrolysis is performed at the current density of 10 mA/cm2, and the solution in which the copper alloy is thus dissolved is subjected to suction filtration using a membrane filter of polycarbonate whose filter mesh size is 0.1 μm, thereby separating and extracting undissolved residues on said filter, and the Ni content in the extracted residues is identified through analysis by ICP after dissolving said undissolved residues separated and left on said filter into a solution prepared by mixing aqua regia and water at the ratio of 1:1.
摘要翻译：具有Ni：0.1〜3.0质量％，Sn：0.01〜3.0质量％，P：0.01〜0.3质量％，Cu和不可避免的杂质的余量为好的耐应力松弛性的铜合金，残渣分离残留的Ni含量通过使用在铜合金中的Ni含量为40质量％以下的提取残渣法，在筛网尺寸为0.1μm的过滤器上，其中提取的残渣法要求将10g铜合金浸渍在300ml 的含有10质量％的乙酸铵的甲醇溶液，使用铜合金作为阳极，将铂作为阴极，以10mA / cm 2的电流密度进行恒流电解，将其中的铜溶解的合金使用过滤网尺寸为0.1μm的聚碳酸酯膜过滤器进行抽滤，由此分离和提取所述过滤器上的未溶解残余物，并且Ni含量在将所分离的未溶解的残留物溶解在所述过滤器上后，通过ICP分析鉴定提取的残留物，使其以1:1的比例混合王水和水混合制成的溶液。

9. 发明授权

US07125515B2 Aluminum base alloy containing boron and manufacturing method thereof 有权
标题翻译：含硼基铝合金及其制造方法
公开(公告)号：US07125515B2
公开(公告)日：2006-10-24
申请号：US10413158
申请日：2003-04-15
申请人： Yasuhiro Aruga , Katsura Kajihara , Yasuaki Sugizaki
发明人： Yasuhiro Aruga , Katsura Kajihara , Yasuaki Sugizaki
IPC分类号： B22D30/00 , C22F1/04
CPC分类号： C22C21/00 , C22C1/026 , C22C32/0073 , G21C19/40 , G21F1/08
摘要： A aluminum base alloy containing boron and manufacturing method thereof, said alloy exhibiting good mechanical properties (such as high-temperature strength and creep strength) over a long period of time and also having a neutron absorbing capacity owing to boron present therein in the form of a compound without segregation. The alloy contains 0.5–10 mass % of boron with an isotopic element satisfying a relation of 10B/(10B +11B)≦30%. said boron being present in the form of a boron compound which is 300 μm or below in size. The alloy is obtained by melting at a temperature in excess of 950° C. and cast at a temperature in the range of 800° C. to 950° C., in such a way that the molten metal is kept for 60–180° seconds until it cools from 950° C. to the casting temperature.
摘要翻译：一种含硼的铝基合金及其制造方法，所述合金长时间表现出良好的机械性能（如高温强度和蠕变强度），并且由于其中存在硼的形式的中子吸收能力没有分离的化合物。该合金含有0.5-10质量％的硼，其同位素元素满足关系为^{10 B /（^{10 B + 11 B） = 30％。所述硼以硼化合物的形式存在，其尺寸为300μm或更小。该合金通过在超过950℃的温度下熔融而获得，并且在800℃至950℃的温度范围内铸造，使得熔融金属保持在60-180℃ 秒，直到其从950℃冷却至铸造温度。}}

10. 发明申请

US20050161126A1 High-strength high-conductivity copper alloy 审中-公开
标题翻译：高强度高导电铜合金
公开(公告)号：US20050161126A1
公开(公告)日：2005-07-28
申请号：US11022785
申请日：2004-12-28
申请人： Yasuhiro Aruga , Katsura Kajihara
发明人： Yasuhiro Aruga , Katsura Kajihara
IPC分类号： C22C9/00 , C22C9/02
CPC分类号： C22C9/00 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a copper alloy containing Fe of 0.01 to 0.5% and P of 0.01 to 0.3% in mass with the balance consisting of copper and unavoidable impurities, wherein the mass content ratio of Fe to P, namely Fe/P, is in the range from 0.5 to 6.0 and the volume fraction and the number of dispersoids of 1 to 20 nm in average particle diameter in the microstructure of the copper alloy are 1.0% or more and 300 pieces/μm2 or more, respectively. The Cu—Fe—P alloy can secure a high strength and a high conductivity simultaneously.
摘要翻译：公开了含有0.01〜0.5％的Fe和0.01〜0.3质量％的P的铜合金，余量由铜和不可避免的杂质构成，Fe与P的质量含量比Fe / P为 0.5〜6.0，铜合金的组织中的平均粒径为1〜20nm的分散体的体积分数和数量分别为1.0％以上且300个/μm2以上，分别。 Cu-Fe-P合金可以同时确保高强度和高导电性。

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