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    • 2. 发明授权
    • Electrochemical device
    • 电化学装置
    • US08343669B2
    • 2013-01-01
    • US12407294
    • 2009-03-19
    • Katsuo NaoiKenji NishizawaMitsuo Kougo
    • Katsuo NaoiKenji NishizawaMitsuo Kougo
    • H01M4/00
    • H01M10/0525H01M10/058H01M10/4235H01M2200/10
    • An electrochemical device comprises an electrode matrix including a multilayer structure composed of a positive electrode, a negative electrode, and a first separator, and first and second dummy electrodes electrically connected to the positive and negative electrodes, respectively. The first and second dummy electrodes have respective opposing parts opposing each other through a second separator at an outer peripheral part of the electrode matrix. One or each of the first and second dummy electrodes has a resistance control layer at least on a side where the opposing parts oppose each other. The resistance control layer has such a resistance value that an estimated internal short circuit current between the first and second dummy electrodes is equivalent to 0.09 C to 1.00 C. The first and second dummy electrodes are adapted to short-circuit each other at a lower temperature than the positive and negative electrodes do.
    • 电化学装置包括电极基体,其包括由正极,负极和第一隔板构成的多层结构,以及分别与正极和负极电连接的第一和第二虚设电极。 第一和第二虚拟电极具有通过电极矩阵的外周部分处的第二隔板彼此相对的相对的相对部分。 第一和第二虚拟电极中的一个或每个至少在相对部分彼此相对的一侧上具有电阻控制层。 电阻控制层具有这样的电阻值,使得第一和第二虚拟电极之间的估计内部短路电流相当于0.09℃至1.00℃。第一和第二虚拟电极适于在较低温度下彼此短路 比正极和负极做的要好。
    • 7. 发明授权
    • Wound electrochemical device and method of manufacturing same
    • 伤口电化学装置及其制造方法
    • US08481198B2
    • 2013-07-09
    • US12332031
    • 2008-12-10
    • Yoshihiko OhashiMitsuo KougoKiyonori HinokiKazuo Katai
    • Yoshihiko OhashiMitsuo KougoKiyonori HinokiKazuo Katai
    • H01M2/00
    • H01M10/0431H01G9/151H01M10/0587
    • A wound electrochemical device has a wound body formed by winding a multilayer member including a multilayer structure composed of a positive electrode, a separator, and a negative electrode; wherein each of the positive and negative electrodes, includes a structure having an active material layer formed on both sides of a current collector; wherein the wound body has a space at a center portion thereof; and wherein the smallest radius of curvature R of a curved part in an innermost circumferential portion of the wound body satisfies the following expression (1): R=α×(T1+2T2)  (1) where R is the smallest radius of curvature of the curved part in the innermost circumferential portion of the wound body (unit: μm), α is a value within the range of 3.33 to 7.12, T1 is a thickness of the current collector of the electrode positioned at the innermost circumference of the wound body (unit: μm), and T2 is a thickness of the active material layer of the electrode positioned at the innermost circumference of the wound body (unit: μm), T2 being a value within the range of 8 to 30 (unit: μm).
    • 卷绕电化学装置具有通过卷绕包括由正极,隔膜和负极构成的多层结构的多层构件而形成的卷绕体; 其特征在于,所述正极和负极各自包括在集电体的两面形成有活性物质层的结构体。 其中所述卷绕体在其中心部分具有空间; 并且其中卷绕体的最内圆周部分中弯曲部分的最小曲率半径R满足以下表达式(1):R =α×(T1 + 2T2)(1)其中R是最小曲率半径 卷绕体的最内周部的弯曲部(单位:母体)α为3.33〜7.12的范围内的值,T1为位于卷绕体的最内周的电极的集电体的厚度 (单位:mum),T2是位于卷绕体的最内周的电极的活性物质层的厚度(单位:mum),T2是8〜30(单位:mum)的范围内的值, 。
    • 8. 发明授权
    • Card assembly apparatus, card inspecting apparatus and card magazine used therefor
    • 卡组合装置,卡片检查装置和用于其的卡片盒
    • US06574528B1
    • 2003-06-03
    • US09590080
    • 2000-06-09
    • Takashi ToyaMitsuo KougoYutaka Sakai
    • Takashi ToyaMitsuo KougoYutaka Sakai
    • G06F700
    • B07C5/344
    • The invention relates to a card assembly apparatus for assembling PC cards and the like, and it is an object of the invention to provide a card assembly apparatus which makes it possible to reduce costs required for card assembly and to improve the throughput of card assembly. It has a top side processing portion 1 for performing predetermined assembly processes on a top side of a card and a bottom side processing portion 2 for performing predetermined assembly processes on a bottom side of a card. A supply magazine portion 10, a resin applying portion 20, a sheet inserting portion 30, a cover inserting portion 40, a thermo-compression bonding portion 50 and a compression bonding portion 60 are provided in the top side processing portion 1, and a resin applying portion 20′, a sheet inserting portion 30′, a cover inserting portion 40′, thermo-compression bonding portions 50′ and 50″, compression bonding portions 60′ and 60″ and a housing magazine portion 80 are provided in the bottom side processing portion 2 where those portions are listed above in the order of their X values increasing in the positive direction. There is also provided a transport portion 90 for transporting PC cards in a path extending from the supply magazine portion 10 to the housing magazine portion 80.
    • 本发明涉及一种用于组装PC卡等的卡组装装置,其目的在于提供一种卡组合装置,其可以降低卡组装所需的成本并提高卡组合的产量。 它具有用于在卡的顶侧执行预定组装处理的顶侧处理部分1和用于在卡底部执行预定组装处理的底侧处理部分2。 在顶侧处理部1设置有供给盒部10,树脂施加部20,片插入部30,盖插入部40,热压接部50以及压接部60,树脂 加压部分20',片材插入部分30',盖子插入部分40',热压接部分50'和50“,压接部分60'和60”以及壳体部分80设置在 其中这些部分按照它们的X值在正方向上增加的顺序列在上面的底侧处理部分2。 还设置有用于在从供应盒部分10延伸到收纳盒部分80的路径中传送PC卡的传送部分90。