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1. 发明授权

US06224676B1 Gas supply apparatus and film forming apparatus 失效
标题翻译：供气装置和成膜装置
公开(公告)号：US06224676B1
公开(公告)日：2001-05-01
申请号：US09451911
申请日：1999-12-01
申请人： Katsunori Nakajima , Hiroyuki Shida , Eiji Setoyama , Koji Ishiguro , Hikaru Saruta
发明人： Katsunori Nakajima , Hiroyuki Shida , Eiji Setoyama , Koji Ishiguro , Hikaru Saruta
IPC分类号： C23C1600
CPC分类号： C23C16/44 , C23C16/52 , H01L21/67017
摘要： According to the present invention, a signal transmission system is arranged in a region surrounded by a gas control means and a plurality of blocks whereby a region between elements constituting a gas supply flow path can be utilized for the region of the signal transmission system thereby to make the occupying space small and miniaturize the apparatus.
摘要翻译：根据本发明，信号传输系统被布置在由气体控制装置和多个块包围的区域中，由此构成气体供应流路的元件之间的区域可以用于信号传输系统的区域，从而使占用空间小，装置小型化。

2. 发明授权

US07777183B2 Charge particle beam system, sample processing method, and semiconductor inspection system 有权
标题翻译：充电粒子束系统，样品处理方法和半导体检测系统
公开(公告)号：US07777183B2
公开(公告)日：2010-08-17
申请号：US11834220
申请日：2007-08-06
申请人： Noriyuki Kaneoka , Kaoru Umemura , Koji Ishiguro
发明人： Noriyuki Kaneoka , Kaoru Umemura , Koji Ishiguro
IPC分类号： G01N23/225
CPC分类号： G01N23/225 , H01J37/228 , H01J37/3056 , H01J2237/0455 , H01J2237/2482 , H01J2237/31745
摘要： A charged particle beam system, a sample processing method, and a semiconductor inspection system enable an accurate detection of a particle in a film without causing LMIS contamination and allow observation with an electron microscope quickly. A particle 65 causing a defect in a film 66 that has been detected with a separate optical inspection system is detected with an optical microscope 43 based on position information acquired by the separate optical inspection system. A sample 31 is processed with a nonmetal ion beam 22 so as to allow observation of the particle 65 with an electron microscope image or an ion microscope image, or ultimate analysis of the particle 65 with an EDX.
摘要翻译：带电粒子束系统，样品处理方法和半导体检查系统能够精确地检测膜中的颗粒而不引起LMIS污染，并且可以快速用电子显微镜观察。基于通过单独的光学检查系统获取的位置信息，用光学显微镜43检测导致用单独的光学检查系统检测到的膜66中的缺陷的颗粒65。用非金属离子束22处理样品31，以便用电子显微镜图像或离子显微镜图像观察颗粒65，或者用EDX对颗粒65进行最终分析。

3. 发明授权

US07592606B2 Manufacturing equipment using ION beam or electron beam 有权
标题翻译：使用ION光束或电子束的制造设备
公开(公告)号：US07592606B2
公开(公告)日：2009-09-22
申请号：US11779686
申请日：2007-07-18
申请人： Koji Ishiguro , Kaoru Umemura , Noriyuki Kaneoka
发明人： Koji Ishiguro , Kaoru Umemura , Noriyuki Kaneoka
IPC分类号： G08B21/00
CPC分类号： H01J37/3056 , H01J37/3005 , H01J37/304 , H01J2237/0225 , H01J2237/05 , H01J2237/24514 , H01J2237/248 , H01J2237/30455 , H01J2237/31744 , H01J2237/31745
摘要： Provided is a charged particle beam processing apparatus capable of improving yields by suppressing the spread of metal pollution to a semiconductor manufacturing process to a minimum. The charged particle beam processing apparatus includes an ion beam column 1 that is connected to a vacuum vessel 10 and irradiates a sample 35 with an ion beam 11 of nonmetal ion species, a microsampling unit 3 having a probe 16 that extracts a microsample 43 cut out from a sample 35 by the ion beam 11, a gas gun 2 that discharges a gas for bonding the microsample 43 and the probe 16, a pollution measuring beam column 6A that is connected to the same vacuum vessel 10 to which the ion beam column 1 is connected and irradiates an ion beam irradiation traces by the ion beam column 1 with a pollution measuring beam 13, and a detector 7 that detects characteristic X-rays emitted from the ion beam irradiation traces by the ion beam column 1 upon irradiation with the pollution measuring beam 13.
摘要翻译：提供一种能够通过将半导体制造工序的金属污染的扩散抑制到最小来提高产率的带电粒子束处理装置。带电粒子束处理装置包括离子束柱1，其连接到真空容器10并用非金属离子种类的离子束11照射样品35，微量取样单元3具有探针16，其提取切出的微量样品43 从样品35通过离子束11，放出用于接合微量样品43和探针16的气体的气枪2，污染测量束柱6A，连接到相同的真空容器10，离子束柱1 用离子束柱1连接并用污染测量光束13照射离子束照射迹线;以及检测器7，其在照射污染物时检测由离子束柱1从离子束照射迹线发射的特征X射线测量光束13。

4. 发明申请

US20100176297A1 ION BEAM PROCESSING APPARATUS 有权
标题翻译：离子束加工装置
公开(公告)号：US20100176297A1
公开(公告)日：2010-07-15
申请号：US12731910
申请日：2010-03-25
申请人： Hiroyasu Shichi , Satoshi Tomimatsu , Noriyuki Kaneoka , Kaoru Umemura , Koji Ishiguro
发明人： Hiroyasu Shichi , Satoshi Tomimatsu , Noriyuki Kaneoka , Kaoru Umemura , Koji Ishiguro
IPC分类号： H01J37/26 , G01N23/22
CPC分类号： H01J37/261 , H01J37/20 , H01J37/3045 , H01J2237/08 , H01J2237/20207 , H01J2237/24528 , H01J2237/28 , H01J2237/31713 , H01J2237/3174 , H01J2237/31749
摘要： An ion beam processing apparatus includes an ion beam irradiation optical system that irradiate a rectangular ion beam to a sample held on a first sample stage, an electron beam irradiation optical system that irradiates an electron beam to the sample, and a second sample stage on which a test piece, extracted from the sample by a probe, is mounted. An angle of irradiation of the ion beam can be tilted by rotating the second sample stage about a tilting axis. A controller controls the width of skew of an intensity profile representing an edge of the rectangular ion beam in a direction perpendicular to a first direction in which the tilting axis of the second sample stage is projected on the second sample stage surface so that the width will be smaller than the width of skew of an intensity profile representing another edge of the ion beam in a direction parallel to the first direction.
摘要翻译：一种离子束处理装置，包括：将矩形离子束照射到保持在第一样品台上的样品的离子束照射光学系统，向样品照射电子束的电子束照射光学系统;以及第二样品台，通过探针从样品中提取的试片被安装。离子束的照射角度可以通过使第二样品台围绕倾斜轴旋转来倾斜。控制器控制表示矩形离子束在与第二样品台的倾斜轴投射到第二样品台表面上的第一方向垂直的方向上的强度分布的偏斜宽度，使得宽度将小于在平行于第一方向的方向上表示离子束的另一边缘的强度分布的偏斜宽度。

5. 发明申请

US20090230299A1 ION SOURCE, ION BEAM PROCESSING/OBSERVATION APPARATUS, CHARGED PARTICLE BEAM APPARATUS, AND METHOD FOR OBSERVING CROSS SECTION OF SAMPLE 有权
标题翻译：离子源，离子束加工/观察装置，充电颗粒光束装置和观察样品的交叉部分的方法
公开(公告)号：US20090230299A1
公开(公告)日：2009-09-17
申请号：US12108037
申请日：2008-04-23
申请人： Hiroyasu Shichi , Satoshi Tomimatsu , Kaoru Umemura , Noriyuki Kaneoka , Koji Ishiguro
发明人： Hiroyasu Shichi , Satoshi Tomimatsu , Kaoru Umemura , Noriyuki Kaneoka , Koji Ishiguro
IPC分类号： H01J49/26 , H01J27/02
CPC分类号： C23C14/3442 , H01J27/10 , H01J37/08 , H01J37/28 , H01J37/3023 , H01J37/3056 , H01J2237/006 , H01J2237/057 , H01J2237/0807 , H01J2237/0825 , H01J2237/0827 , H01J2237/31745 , H01J2237/31749
摘要： An ion beam machining and observation method relevant to a technique of cross sectional observation of an electronic component, through which a sample is machined by using an ion beam and a charged particle beam processor capable of reducing the time it takes to fill up a processed hole with a high degree of flatness at the filled area. The observation device is capable of switching the kind of gas ion beam used for machining a sample with the kind of a gas ion beam used for observing the sample. To implement the switch between the kind of a gas ion beam used for sample machining and the kind of a gas ion beam used for sample observation, at least two gas introduction systems are used, each system having a gas cylinder a gas tube, a gas volume control valve, and a stop valve.
摘要翻译：一种与电子部件的横截面观察技术有关的离子束加工和观察方法，通过使用离子束加工样品的电子部件和能够减少填充加工孔的时间的带电粒子束处理器在填充区域具有高度的平整度。观察装置能够切换用于用于观察样品的气体离子束的种类来加工样品的气体离子束的种类。为了实现用于样品加工的气体离子束的种类和用于样品观察的气体离子束的种类之间的切换，使用至少两个气体导入系统，每个系统具有气瓶，气体管，气体音量控制阀和截止阀。

6. 发明申请

US20080283778A1 Apparatus for ion beam fabrication 有权
标题翻译：离子束制造装置
公开(公告)号：US20080283778A1
公开(公告)日：2008-11-20
申请号：US12003207
申请日：2007-12-20
申请人： Satoshi Tomimatsu , Hiroyasu Shichi , Noriyuki Kaneoka , Kaoru Umemura , Koji Ishiguro
发明人： Satoshi Tomimatsu , Hiroyasu Shichi , Noriyuki Kaneoka , Kaoru Umemura , Koji Ishiguro
IPC分类号： H01J37/08
CPC分类号： H01J37/3056 , H01J37/045 , H01J37/244 , H01J37/304 , H01J2237/24405 , H01J2237/24507 , H01J2237/24535 , H01J2237/24542 , H01J2237/30472
摘要： The apparatus for ion beam fabrication, which has been able to detect any anomalous condition of ion beams only by means of the current irradiated on the specimen, could not compensate the failure by investigating the cause and could not realize stable processing. To solve the problem described above, the present invention includes the first and second blankers and Faraday cups switches ON and OFF the first and second blankers and monitors beam current at two positions above and below the projection mask. By adopting this configuration, it will be possible to acquire the information on failure in ion beam, sort out the cause of the failure and to compensate the failure while limiting damages to the projection mask. As a result, it will be possible to realize stable processing by means of ion beam, and to use the ion beam fabricating device on a stable basis.
摘要翻译：离子束制造装置只能通过照射在样品上的电流来检测离子束的任何异常状态，不能通过调查原因补偿失效，无法实现稳定的处理。为了解决上述问题，本发明包括第一和第二消隐器和法拉第杯开关第一和第二消隐器的接通和断开，并监视在投影面罩上方和下方的两个位置处的电流。通过采用这种配置，可以获取关于离子束故障的信息，整理故障原因并补偿故障，同时限制对投影面罩的损害。结果，可以通过离子束实现稳定的处理，并且可以稳定地使用离子束制造装置。

7. 发明申请

US20080073582A1 ION BEAM PROCESSING APPARATUS 有权
标题翻译：离子束加工装置
公开(公告)号：US20080073582A1
公开(公告)日：2008-03-27
申请号：US11674262
申请日：2007-02-13
申请人： Hiroyasu Shichi , Satoshi Tomimatsu , Noriyuki Kaneoka , Kaoru Umemura , Koji Ishiguro
发明人： Hiroyasu Shichi , Satoshi Tomimatsu , Noriyuki Kaneoka , Kaoru Umemura , Koji Ishiguro
IPC分类号： H01J37/08
CPC分类号： H01J37/261 , H01J37/20 , H01J37/3045 , H01J2237/08 , H01J2237/20207 , H01J2237/24528 , H01J2237/28 , H01J2237/31713 , H01J2237/3174 , H01J2237/31749
摘要： The present invention provides an ion beam processing technology for improving the precision in processing a section of a sample using an ion beam without making a processing time longer than a conventionally required processing time, and for shortening the time required for separating a micro test piece without breaking the sample or the time required for making preparations for the separation. An ion beam processing apparatus is structured so that an axis along which an ion beam is drawn out of an ion source and an ion beam irradiation axis along which the ion beam is irradiated to a sample mounted on a first sample stage will meet at an angle. Furthermore, the ion beam processing apparatus has a tilting ability to vary an angle of irradiation, at which the ion beam is irradiated to the sample, by rotating a second sample stage, on which a test piece extracted from the sample by performing ion beam processing is mounted, about the tilting axis of the second sample stage. The ion beam processing apparatus is structured so that a segment drawn by projecting the axis, along which the ion beam is drawn out of the ion source, on a plane perpendicular to the ion beam irradiation axis can be at least substantially parallel to a segment drawn by projecting the tilting axis of the second sample stage on the plane perpendicular to the ion beam irradiation axis.
摘要翻译：本发明提供了一种离子束处理技术，用于提高使用离子束处理样品的一部分的精度，而不需要比常规所需的处理时间长的处理时间，并且缩短了分离微测试件所需的时间，而没有打破样品或准备分离所需的时间。离子束处理装置被构造成使得离子束从离子源拉出的轴和离子束照射到安装在第一样品台上的样品的离子束照射轴将以一定角度相遇。此外，离子束处理装置具有通过旋转第二样品台而使离子束照射到样品上的照射角度的倾斜能力，通过进行离子束处理从样品中提取试验片围绕第二样品台的倾斜轴安装。离子束处理装置被构造成使得通过将离子束从离子源拉出的轴在垂直于离子束照射轴线的平面上突出的拉伸而绘制的区段可以至少基本上平行于拉伸的区段通过将第二样品台的倾斜轴投影在垂直于离子束照射轴的平面上。

8. 发明申请

US20080029699A1 Charged Particle Beam System, Sample Processing Method, and Semiconductor Inspection System 有权
标题翻译：带电粒子束系统，样品处理方法和半导体检测系统
公开(公告)号：US20080029699A1
公开(公告)日：2008-02-07
申请号：US11834220
申请日：2007-08-06
申请人： Noriyuki KANEOKA , Kaoru Umemura , Koji Ishiguro
发明人： Noriyuki KANEOKA , Kaoru Umemura , Koji Ishiguro
IPC分类号： G01N23/00
CPC分类号： G01N23/225 , H01J37/228 , H01J37/3056 , H01J2237/0455 , H01J2237/2482 , H01J2237/31745
摘要： A charged particle beam system, a sample processing method, and a semiconductor inspection system enable an accurate detection of a particle in a film without causing LMIS contamination and allow observation with an electron microscope quickly. A particle 65 causing a defect in a film 66 that has been detected with a separate optical inspection system is detected with an optical microscope 43 based on position information acquired by the separate optical inspection system. A sample 31 is processed with a nonmetal ion beam 22 so as to allow observation of the particle 65 with an electron microscope image or an ion microscope image, or ultimate analysis of the particle 65 with an EDX.
摘要翻译：带电粒子束系统，样品处理方法和半导体检查系统能够精确地检测膜中的颗粒而不引起LMIS污染，并且可以快速用电子显微镜观察。基于通过单独的光学检查系统获取的位置信息，用光学显微镜43检测导致用单独的光学检查系统检测到的膜66中的缺陷的颗粒65。用非金属离子束22处理样品31，以便用电子显微镜图像或离子显微镜图像观察颗粒65，或者用EDX对颗粒65进行最终分析。

9. 发明授权

US08431891B2 Dual beam apparatus with tilting sample stage 有权
标题翻译：具有倾斜样品台的双光束装置
公开(公告)号：US08431891B2
公开(公告)日：2013-04-30
申请号：US12731910
申请日：2010-03-25
申请人： Hiroyasu Shichi , Satoshi Tomimatsu , Noriyuki Kaneoka , Kaoru Umemura , Koji Ishiguro
发明人： Hiroyasu Shichi , Satoshi Tomimatsu , Noriyuki Kaneoka , Kaoru Umemura , Koji Ishiguro
IPC分类号： G01N23/00 , G21K7/00
CPC分类号： H01J37/261 , H01J37/20 , H01J37/3045 , H01J2237/08 , H01J2237/20207 , H01J2237/24528 , H01J2237/28 , H01J2237/31713 , H01J2237/3174 , H01J2237/31749
摘要： An ion beam processing apparatus includes an ion beam irradiation optical system that irradiate a rectangular ion beam to a sample held on a first sample stage, an electron beam irradiation optical system that irradiates an electron beam to the sample, and a second sample stage on which a test piece, extracted from the sample by a probe, is mounted. An angle of irradiation of the ion beam can be tilted by rotating the second sample stage about a tilting axis. A controller controls the width of skew of an intensity profile representing an edge of the rectangular ion beam in a direction perpendicular to a first direction in which the tilting axis of the second sample stage is projected on the second sample stage surface so that the width will be smaller than the width of skew of an intensity profile representing another edge of the ion beam in a direction parallel to the first direction.
摘要翻译：一种离子束处理装置，包括：将矩形离子束照射到保持在第一样品台上的样品的离子束照射光学系统，向样品照射电子束的电子束照射光学系统;以及第二样品台，通过探针从样品中提取的试片被安装。离子束的照射角度可以通过使第二样品台围绕倾斜轴旋转来倾斜。控制器控制表示矩形离子束在与第二样品台的倾斜轴投射到第二样品台表面上的第一方向垂直的方向上的强度分布的偏斜宽度，使得宽度将小于在平行于第一方向的方向上表示离子束的另一边缘的强度分布的偏斜宽度。

10. 发明授权

US07792621B2 Apparatus for controlling swivel angles of on-vehicle headlights 有权
标题翻译：用于控制车载前灯的旋转角度的装置
公开(公告)号：US07792621B2
公开(公告)日：2010-09-07
申请号：US11980272
申请日：2007-10-30
申请人： Toshio Sugimoto , Koji Ishiguro
发明人： Toshio Sugimoto , Koji Ishiguro
IPC分类号： G05D1/00
CPC分类号： B60Q1/122 , B60Q2300/112 , B60Q2300/122 , B60Q2300/322
摘要： An apparatus controls a swivel angle of on-vehicle headlights, the swivel angle of the lights being changeable in a lateral direction of the vehicle. A target swivel angle of the headlights is determined based on, for example, load map data of the road ahead the vehicle, and a control start point is determined based on the current position information and the road map data. The swivel angle is controlled to the target swivel angle in response to a state where the current position of the vehicle has reached the control start point. Running road shape-related information and a curvature direction of the road ahead are acquired. A control of the swivel angle toward the target swivel angle is prohibited when a direction of the target swivel angle determined is inconsistent with the curvature direction of the road, even in a case where the vehicle has reached the control start point.
摘要翻译：一种装置控制车载前灯的旋转角度，灯的旋转角度可在车辆的横向方向上变化。基于例如车辆前方的路面的载荷图数据来确定头灯的目标旋转角度，并且基于当前位置信息和路线图数据来确定控制开始点。响应于车辆的当前位置已经到达控制起始点的状态，将旋转角度控制到目标旋转角度。获取道路形状相关信息和前方道路的曲率方向。即使在车辆到达控制开始点的情况下，当所确定的目标旋转角度的方向与道路的曲率方向不一致时，禁止对目标旋转角度的旋转角度的控制。

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