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    • 10. 发明授权
    • Metal-polishing liquid and chemical-mechanical polishing method using the same
    • 金属抛光液和化学机械抛光方法使用相同
    • US08034252B2
    • 2011-10-11
    • US11701403
    • 2007-02-02
    • Katsuhiro Yamashita
    • Katsuhiro Yamashita
    • H01L21/461
    • H01L21/3212C09G1/02C09K3/1463C23F3/06
    • A metal-polishing liquid includes colloidal silica and a compound represented by Formula (I) or a compound represented by Formula (II). The colloidal silica is substituted by aluminum atoms at least one portion of the silicon atoms on the surfaces thereof. In Formula (I), R1 represents an alkyl group, alkynyl group, alkenyl group, allyl group or aryl group; R2 represents hydrogen atom, an alkyl group, alkynyl group, alkenyl group, allyl group or aryl group; m represents an integer from 0 to 6. In Formula (II), R3 represents an alkyl group or aryl group; n represents an integer from 1 to 30. R1—OOC—(CH2)m—COO—R2  Formula (I) R3—O—(CH2CH2O)n—SO3H  Formula (II)
    • 金属抛光液包括胶体二氧化硅和由式(I)表示的化合物或由式(II)表示的化合物。 胶体二氧化硅被铝原子的至少一部分硅表面的硅原子取代。 在式(I)中,R 1表示烷基,炔基,烯基,烯丙基或芳基; R2表示氢原子,烷基,炔基,烯基,烯丙基或芳基; m表示0至6的整数。在式(II)中,R 3表示烷基或芳基; n表示1〜30的整数。R1-OOC-(CH2)m -COO-R2式(Ⅰ)R3-O-(CH2CH2O)n-SO3H式(Ⅱ)