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    • 5. 发明申请
    • LIGHT-EMITTING DEVICE AND DISPLAY
    • 发光装置和显示器
    • US20110175860A1
    • 2011-07-21
    • US12985079
    • 2011-01-05
    • Kensuke Kojima
    • Kensuke Kojima
    • G09G5/00H01L33/36
    • H01L33/20H01L33/0079H01L33/54
    • A light-emitting device includes: a semiconductor layer including a first conductive contact layer, a first conductive cladding layer, an active layer, a second conductive cladding layer, a second conductive contact layer and a resin block layer in this order; a first electrode in contact with the first conductive contact layer; and a second electrode in contact with the second conductive contact layer. The second conductive contact layer includes a first opening at least in a region facing the first electrode. Moreover, the resin block layer includes a plurality of second openings communicated with the first opening, and the first opening has an air gap.
    • 发光装置包括:依次包括第一导电接触层,第一导电覆层,有源层,第二导电覆层,第二导电接触层和树脂阻挡层的半导体层; 与所述第一导电接触层接触的第一电极; 以及与第二导电接触层接触的第二电极。 第二导电接触层至少在面向第一电极的区域中包括第一开口。 此外,树脂阻挡层包括与第一开口连通的多个第二开口,第一开口具有气隙。
    • 6. 发明申请
    • LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF
    • 发光二极管及其制造方法
    • US20100301380A1
    • 2010-12-02
    • US12775674
    • 2010-05-07
    • Kensuke Kojima
    • Kensuke Kojima
    • H01L33/30H01L21/20H01L33/28
    • H01L33/20H01L33/0079H01L33/16
    • A method for manufacturing a light-emitting diode includes the steps of: growing a light-emitting diode structure-forming semiconductor layer of a compound semiconductor having a zincblende crystal structure on a first substrate formed of a compound semiconductor having a zincblende crystal structure and that has a principal surface tilted in a [110] direction with respect to a (001) plane; bonding the first substrate to a second substrate on the side of the semiconductor layer; removing the first substrate so as to expose the semiconductor layer; forming an etching mask on the exposed surface of the semiconductor layer in a rectangular planar shape so that a longer side extends in a [110] or [−1-10] direction, and that a shorter side extends in a [−110] or [1-10] direction; and patterning the semiconductor layer by wet etching using the etching mask.
    • 一种制造发光二极管的方法包括以下步骤:在由具有锌辉石晶体结构的化合物半导体形成的第一衬底上生长具有锌辉晶体结构的化合物半导体的发光二极管结构形成半导体层,并且 具有相对于(001)面在[110]方向上倾斜的主表面; 将所述第一衬底接合到所述半导体层侧的第二衬底; 去除所述第一衬底以暴露所述半导体层; 在半导体层的暴露表面上形成矩形平面形状的蚀刻掩模,使得较长边在[110]或[ - 10]方向上延伸,并且较短边在[-110]或 方向; 并通过使用蚀刻掩模的湿蚀刻图案化半导体层。
    • 7. 发明授权
    • Light-emitting diode and manufacturing method thereof
    • 发光二极管及其制造方法
    • US08344395B2
    • 2013-01-01
    • US12775674
    • 2010-05-07
    • Kensuke Kojima
    • Kensuke Kojima
    • H01L33/00
    • H01L33/20H01L33/0079H01L33/16
    • A method for manufacturing a light-emitting diode includes the steps of: growing a light-emitting diode structure-forming semiconductor layer of a compound semiconductor having a zincblende crystal structure on a first substrate formed of a compound semiconductor having a zincblende crystal structure and that has a principal surface tilted in a [110] direction with respect to a (001) plane; bonding the first substrate to a second substrate on the side of the semiconductor layer; removing the first substrate so as to expose the semiconductor layer; forming an etching mask on the exposed surface of the semiconductor layer in a rectangular planar shape so that a longer side extends in a [110] or [−1-10] direction, and that a shorter side extends in a [−110] or [1-10] direction; and patterning the semiconductor layer by wet etching using the etching mask.
    • 一种制造发光二极管的方法包括以下步骤:在由具有锌辉石晶体结构的化合物半导体形成的第一衬底上生长具有锌辉晶体结构的化合物半导体的发光二极管结构形成半导体层,并且 具有相对于(001)面在[110]方向上倾斜的主表面; 将所述第一衬底接合到所述半导体层侧的第二衬底; 去除所述第一衬底以暴露所述半导体层; 在半导体层的暴露表面上形成矩形平面形状的蚀刻掩模,使得较长边在[110]或[ - 10]方向上延伸,并且较短边在[-110]或 方向; 并通过使用蚀刻掩模的湿蚀刻图案化半导体层。
    • 9. 发明授权
    • Light-emitting device and display
    • 发光装置和显示器
    • US08294175B2
    • 2012-10-23
    • US12985079
    • 2011-01-05
    • Kensuke Kojima
    • Kensuke Kojima
    • H01L33/00
    • H01L33/20H01L33/0079H01L33/54
    • A light-emitting device includes: a semiconductor layer including a first conductive contact layer, a first conductive cladding layer, an active layer, a second conductive cladding layer, a second conductive contact layer and a resin block layer in this order; a first electrode in contact with the first conductive contact layer; and a second electrode in contact with the second conductive contact layer. The second conductive contact layer includes a first opening at least in a region facing the first electrode. Moreover, the resin block layer includes a plurality of second openings communicated with the first opening, and the first opening has an air gap.
    • 发光装置包括:依次包括第一导电接触层,第一导电覆层,有源层,第二导电覆层,第二导电接触层和树脂阻挡层的半导体层; 与所述第一导电接触层接触的第一电极; 以及与第二导电接触层接触的第二电极。 第二导电接触层至少在面向第一电极的区域中包括第一开口。 此外,树脂阻挡层包括与第一开口连通的多个第二开口,第一开口具有气隙。