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1. 发明申请

US20070023320A1 Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit 审中-公开
标题翻译：晶片保持器，具有晶片保持器的加热器单元和具有加热器单元的晶片探测器
公开(公告)号：US20070023320A1
公开(公告)日：2007-02-01
申请号：US11492223
申请日：2006-07-25
申请人： Katsuhira Itakura , Masuhiro Natsuhara , Tomoyuki Awazu , Hirohiko Nakata , Kenji Shinma
发明人： Katsuhira Itakura , Masuhiro Natsuhara , Tomoyuki Awazu , Hirohiko Nakata , Kenji Shinma
IPC分类号： B65D85/00
CPC分类号： H01L21/68757 , H01L21/67103
摘要： A wafer holder hardly deformable under high load and capable of effectively preventing a contact failure with a wafer and further capable of preventing temperature increase of a driving system of a wafer prober is provided. In a wafer holder having a chuck top and a supporter, variation in thickness of the chuck top from a wafer-mounting surface to a contact surface with the supporter, and variation in thickness of the supporter from a bottom surface to a contact surface with the chuck top are both set to at most 50 μm. When the supporter is of a structure having a circular tube portion and a base portion separate from each other, variation in thickness of the circular tube portion from a contact surface with the chuck top to a contact surface with the base portion, and variation in thickness of the base portion from a bottom surface to a contact surface with the circular tube portion are preferably both set to at most 25 μm.
摘要翻译：晶片保持器在高负载下几乎不变形，并且能够有效地防止与晶片的接触故障，并且还能够防止晶片探测器的驱动系统的温度升高。在具有卡盘顶部和支撑件的晶片保持器中，卡盘顶部从晶片安装表面到支撑件的接触表面的厚度变化，以及支撑件从底表面到接触表面的厚度的变化卡盘顶部都设定为最多50马姆。当支撑体具有圆形管部分和基部彼此分离的结构时，圆形管部分从与卡盘顶部的接触表面到与基部的接触表面的厚度的变化以及厚度的变化从底面到与圆管部分的接触表面的底部部分优选地设定为至多25μm。

2. 发明申请

US20090283034A1 WAFER HOLDER, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR MANUFACTURING APPARATUS 审中-公开
标题翻译：滤波器及其制造方法及半导体制造设备
公开(公告)号：US20090283034A1
公开(公告)日：2009-11-19
申请号：US11996728
申请日：2007-05-21
申请人： Masuhiro Natsuhara , Tomoyuki Awazu , Kenji Shinma , Hirohiko Nakata
发明人： Masuhiro Natsuhara , Tomoyuki Awazu , Kenji Shinma , Hirohiko Nakata
IPC分类号： B05C13/02 , B32B38/14
CPC分类号： H01L21/67109 , C23C16/4586 , H01L21/6831 , H01L21/68757
摘要： A wafer holder is provided that can be used in wafer processes at room temperature or lower and that is particularly suited for use in a CVD apparatus.The wafer holder 1 has a wafer-mounting surface. The wafer holder 1 is made of ceramic and has a flow channel 3 that allows coolant to flow to the interior of the wafer holder in order to cool the wafer holder 1, and is furthermore preferably provided with a high-frequency generating electrode 2. The wafer holder 1 can be manufactured having a flow channel 3 formed in one of the ceramic substrates, at least another ceramic substrate is joined to the ceramic substrate so as to cover the flow channel 3, and a ceramic plate in which a high-frequency generating electrode 2 is formed is preferably additionally joined to the other substrates.
摘要翻译：提供了可以在室温或更低的晶片工艺中使用并且特别适用于CVD设备的晶片保持器。晶片保持架1具有晶片安装面。晶片保持器1由陶瓷制成，并且具有允许冷却剂流向晶片保持器内部以便冷却晶片保持器1的流动通道3，并且还优选地设置有高频发生电极2。可以制造具有形成在一个陶瓷基板中的流路3的晶片保持架1，至少另一陶瓷基板与陶瓷基板接合以覆盖流路3，陶瓷基板的高频发生形成的电极2优选地另外连接到其它基板。

3. 发明申请

US20070173185A1 WAFER HOLDER FOR SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE EQUIPPED WITH THE SAME 审中-公开
标题翻译：用于半导体制造装置的半固态装置和配备其的半导体制造装置
公开(公告)号：US20070173185A1
公开(公告)日：2007-07-26
申请号：US11625594
申请日：2007-01-22
申请人： Masuhiro Natsuhara , Tomoyuki Awazu , Kenji Shinma , Hirohiko Nakata
发明人： Masuhiro Natsuhara , Tomoyuki Awazu , Kenji Shinma , Hirohiko Nakata
IPC分类号： B24B29/00
CPC分类号： H01L21/68735
摘要： A wafer holder uniformly heats a wafer at high temperatures without being damaged. A semiconductor manufacturing apparatus is provided with this wafer holder. The contact surface area where the wafer and the wafer mounting surface of the wafer-holding part are in contact includes a contact surface area A in an outer circumferential area that is farther than 1/√2R from the center of the wafer, where R is the radius of the wafer, and a contact surface area B in an inner circumferential area that is within 1/√2R of the center. The contact surface area is established so that A>B. In order to obtain this relationship, the wafer-contacting part of the wafer mounting surface is preferably formed into annular convexities or embossed convexities.
摘要翻译：晶片保持器在高温下均匀地加热晶片而不被损坏。半导体制造装置设置有该晶片保持器。晶片保持部的晶片和晶片安装面接触面的接触面积包括比晶片中心更远离1 /√2R的外周区域的接触面积A，其中R为晶圆的半径以及在中心的1 /√2R以内的内周区域的接触面积B. 建立接触面积，使A> B。为了获得这种关系，晶片安装表面的晶片接触部分优选地形成为环形凸起或压花凸起。

4. 发明申请

US20070205787A1 Wafer holder, and heater unit and wafer prober provided therewith 审中-公开
标题翻译：晶片支架，加热器单元和提供的晶圆探测器
公开(公告)号：US20070205787A1
公开(公告)日：2007-09-06
申请号：US11701416
申请日：2007-02-02
申请人： Masuhiro Natsuhara , Tomoyuki Awazu , Hirohiko Nakata , Katsuhiro Itakura
发明人： Masuhiro Natsuhara , Tomoyuki Awazu , Hirohiko Nakata , Katsuhiro Itakura
IPC分类号： G01R31/02
CPC分类号： G01R31/2865 , G01R1/18 , G01R31/2875
摘要： A wafer holder with which probing can be performed with little or virtually no noise due to the wafer being shielded from electromagnetic waves; and a wafer prober on which the wafer holder is mounted. The wafer holder of the present invention includes a chuck top for mounting a wafer, and a resistance heat generator for heating the chuck top. At least part of the resistance heat generator is covered by an insulating layer, and an electrically conductive layer is present on an opposite side of the resistance heat generator having the insulating layer. The electrically conductive layer blocks electromagnetic waves that adversely affect inspection. The insulating layer preferably covers the entire surface of the resistance heat generator, and the electrically conductive layer preferably covers the entire surface of the resistance heat generator comprising the insulating layer.
摘要翻译：晶片保持器，由于晶片被电磁波屏蔽，可以进行很少或几乎没有噪声的探测; 以及安装晶片保持器的晶片探测器。本发明的晶片保持器包括用于安装晶片的卡盘顶板和用于加热卡盘顶部的电阻发热器。电阻发热体的至少一部分被绝缘层覆盖，导电层存在于具有绝缘层的电阻发热体的相反侧。导电层阻止对检查产生不利影响的电磁波。绝缘层优选覆盖电阻发热体的整个表面，并且导电层优选覆盖包括绝缘层的电阻发热体的整个表面。

5. 发明申请

US20070028834A1 Wafer holder for wafer prober and wafer prober equipped with same 审中-公开
标题翻译：用于晶圆探针和晶圆探测器的晶片支架配备相同
公开(公告)号：US20070028834A1
公开(公告)日：2007-02-08
申请号：US11496022
申请日：2006-07-31
申请人： Tomoyuki Awazu , Katsuhiro Itakura , Masuhiro Natsuhara , Hirohiko Nakata
发明人： Tomoyuki Awazu , Katsuhiro Itakura , Masuhiro Natsuhara , Hirohiko Nakata
IPC分类号： C30B25/00
CPC分类号： G01R31/2886 , G01R31/2831
摘要： The present invention provides a wafer prober wafer holder that is highly rigid and increases the heat insulating effect, thereby improving positional accuracy, thermal uniformity, and chip temperature ramp-up and cooling rates, as well as a wafer prober device equipped therewith. A wafer holder of the present invention includes a chuck top that mounts a wafer, and a support member that supports the chuck top. A cavity is formed between the chuck top and the support member, and a vacuum space member is provided to the lowest part of a member that is attached to a surface of the chuck top on the side opposite the wafer mounting surface.
摘要翻译：本发明提供了一种高刚性的晶片探针晶片保持器，并且增加了隔热效果，从而提高了位置精度，热均匀性和芯片温度升高和冷却速度，以及配备其的晶片探测器。本发明的晶片保持器包括安装晶片的卡盘顶部和支撑卡盘顶部的支撑构件。在卡盘顶部和支撑构件之间形成空腔，并且在与晶片安装表面相对的一侧附接到卡盘顶表面的构件的最下部设置真空空间构件。

6. 发明授权

US07361230B2 Substrate processing apparatus 失效
标题翻译：基板加工装置
公开(公告)号：US07361230B2
公开(公告)日：2008-04-22
申请号：US10119955
申请日：2002-04-09
申请人： Masuhiro Natsuhara , Hirohiko Nakata , Akira Kuibira , Kenji Shinma
发明人： Masuhiro Natsuhara , Hirohiko Nakata , Akira Kuibira , Kenji Shinma
IPC分类号： H01L21/00 , C23C16/00
CPC分类号： H01L21/67103 , C23C16/4581 , C23C16/4586 , H01L21/68714 , Y10T279/23
摘要： In the substrate processing apparatus, a ceramic module for mounting a substrate has a flat plate portion having an electric circuitry and a ceramic base body, and as at least a part of a surface of the flat plate portion other than the surface mounting the substrate is in contact with a chamber, it is supported by the chamber. Thus, a substrate processing apparatus can be provided which improves thermal uniformity, reduces cost, is suitable for size reduction of the apparatus and which can ease restrictions in mounting a power supply conductive member or the like.
摘要翻译：在基板处理装置中，用于安装基板的陶瓷模块具有具有电路和陶瓷基体的平板部分，并且作为安装基板的表面以外的平板部分的至少一部分表面，与腔室接触，它由腔室支撑。因此，可以提供提高热均匀性，降低成本的衬底处理装置，适合于装置的尺寸减小，并且可以减轻安装电源导电构件等的限制。

7. 发明申请

US20050263516A1 Heating device 审中-公开
标题翻译：加热装置
公开(公告)号：US20050263516A1
公开(公告)日：2005-12-01
申请号：US11140668
申请日：2005-05-27
申请人： Masuhiro Natsuhara , Hirohiko Nakata , Akira Kuibira , Kenji Shinma
发明人： Masuhiro Natsuhara , Hirohiko Nakata , Akira Kuibira , Kenji Shinma
IPC分类号： H05B3/20 , F27B17/00 , F27D11/00 , F27D99/00 , H01L21/00 , H01L21/02 , H01L21/66 , H01L21/68 , H01L21/683 , H05B3/06 , H05B3/10 , H05B3/74
CPC分类号： F27D99/0006 , F27B17/0025 , F27D2099/0008 , H01L21/67103
摘要： The present invention provides a heating device which is rigid with little likelihood of warping. The workpiece mounting surface has a high thermal conductivity, and there is improved heat uniformity, and rapid cooling is possible. The heating device of the present invention comprises: a mounting part for mounting the workpiece; a heating part which has a resistance heating element and which heats the mounting part; and a support part which supports the mounting part and heating part. The Young's modulus for each of the mounting part and support part is 100 GPa or greater. By having a Young's modulus of 100 GPa or greater, even if the mounting part is thin, there is little deformation when pressed by a probe card.
摘要翻译：本发明提供一种加热装置，该加热装置具有几乎不变形的刚性。工件安装面具有高导热性，并且具有改善的热均匀性，并且可以进行快速冷却。本发明的加热装置包括：用于安装工件的安装部件; 加热部，其具有电阻加热元件，并加热所述安装部; 以及支撑安装部和加热部的支撑部。每个安装部分和支撑部分的杨氏模量为100GPa或更大。通过具有100GPa以上的杨氏模量，即使安装部分较薄，当由探针卡按压时几乎没有变形。

8. 发明申请

US20090126903A1 HEAT TRANSFER MEMBER, CONVEX STRUCTURAL MEMBER, ELECTRONIC APPARATUS, AND ELECTRIC PRODUCT 审中-公开
标题翻译：热转印构件，导电结构构件，电子设备和电气产品
公开(公告)号：US20090126903A1
公开(公告)日：2009-05-21
申请号：US11996580
申请日：2007-04-18
申请人： Akira Kuibira , Masuhiro Natsuhara , Tomoyuki Awazu , Hirohiko Nakata
发明人： Akira Kuibira , Masuhiro Natsuhara , Tomoyuki Awazu , Hirohiko Nakata
IPC分类号： F28F9/00
CPC分类号： H05K7/20963 , F28F3/048 , F28F13/18 , F28F19/02 , H01L23/3677 , H01L23/3735 , H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A heat transfer member (20) has a support (1), and columnar bodies (2) all or some of which are disposed so as to be inclined at an angle with respect to the support (1). The columnar bodies (2) are in contact with a contacted body (21), and the columnar bodies (2) elastically deform and/or plastically deform along the shape of the contact surface with the contacted body (21) to thereby make direct contact along the wavy and rough irregularities of the contacted body (21), and to cause heat to move through the columnar bodies (2).
摘要翻译：传热构件（20）具有支撑件（1），并且柱状体（2）全部或部分设置成相对于支撑件（1）倾斜一定角度。柱状体（2）与接触体（21）接触，并且柱状体（2）沿着与接触体（21）的接触表面的形状弹性变形和/或塑性变形，从而直接接触沿着接触体（21）的波浪和粗糙的不规则，并且使热量移动通过柱状体（2）。

9. 发明申请

US20070182433A1 Wafer holder, and wafer prober and semiconductor manufacturing apparatus provided therewith 审中-公开
标题翻译：晶片支架，以及提供的晶圆探测器和半导体制造装置
公开(公告)号：US20070182433A1
公开(公告)日：2007-08-09
申请号：US11699043
申请日：2007-01-29
申请人： Masuhiro Natsuhara , Tomoyuki Awazu , Hirohiko Nakata , Katsuhiro Itakura
发明人： Masuhiro Natsuhara , Tomoyuki Awazu , Hirohiko Nakata , Katsuhiro Itakura
IPC分类号： G01R31/02
CPC分类号： G01R31/2877
摘要： A wafer holder that includes a cooling module for rapid cooling, that can further improve the heating uniformity of a wafer, and that can be appropriately used with a wafer prober, a coater/developer, or the like. The wafer holder includes a mounting stage arranged to mount a wafer on a mounting surface, a heat generator 1 arranged to heat the mounting stage, and a cooling module arranged to cool the mounting stage, wherein an outside diameter of the cooling module is smaller than an outside diameter of the mounting stage, and the heat generator 1 attached to the mounting stage is positioned further to the outside than the cooling module. Along with the heat generator 1, a supplementary heat generator may be positioned between the cooling module and the mounting stage or on a surface of the cooling module opposite the mounting stage.
摘要翻译：包括用于快速冷却的冷却模块的晶片保持器，其可以进一步提高晶片的加热均匀性，并且可以与晶片探测器，涂布机/显影剂等适当地使用。晶片保持器包括安装台，用于将晶片安装在安装表面上，布置成加热安装台的热发生器1和布置成冷却安装台的冷却模块，其中冷却模块的外径小于安装台的外径和附接到安装台的发热体1比冷却模块更靠外侧。与发热体1一起，辅助热发生器可以位于冷却模块和安装台之间或冷却模块的与安装台相对的表面上。

10. 发明申请

US20070126457A1 Wafer holder, and heating unit and wafer prober provided with the wafer holder 审中-公开
标题翻译：晶片支架，以及配有晶片支架的加热单元和晶圆探测器
公开(公告)号：US20070126457A1
公开(公告)日：2007-06-07
申请号：US11603233
申请日：2006-11-22
申请人： Masuhiro Natsuhara , Tomoyuki Awazu , Hirohiko Nakata , Katsuhiro Itakura
发明人： Masuhiro Natsuhara , Tomoyuki Awazu , Hirohiko Nakata , Katsuhiro Itakura
IPC分类号： G01R31/26
CPC分类号： G01R31/2893
摘要： A wafer holder is provided with a mounting stage having a mounting surface for mounting a wafer, and a holding member for holding the mounting stage, wherein relationships are established such that K1>K2 and Y1 K3, where K3 is the thermal conductivity of the holding member.
摘要翻译：晶片保持器设置有具有用于安装晶片的安装表面的安装台和用于保持安装台的保持构件，其中建立K 1> K 2和Y 1 K 3，其中K 3是保持构件的热导率。

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