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1. 发明授权

US6042454A System for detecting the endpoint of the polishing of a semiconductor wafer by a semiconductor wafer polisher 失效
标题翻译：用于通过半导体晶片抛光机检测半导体晶片的抛光的终点的系统
公开(公告)号：US6042454A
公开(公告)日：2000-03-28
申请号：US90265
申请日：1998-06-04
申请人： Katsuhide Watanabe , Akira Ogata , Fumihiko Sakata
发明人： Katsuhide Watanabe , Akira Ogata , Fumihiko Sakata
IPC分类号： B24B37/013 , B24B49/04 , H01L21/304 , B24B49/00
CPC分类号： B24B37/013 , B24B37/04 , B24B49/04
摘要： A polisher provided with a vibration detection system which can detect vibration caused by rubbing between an article to be polished and a polishing member without any noise which is generated in prior art polishers. The polisher includes a turntable assembly with a polishing surface, a rotatable carrier assembly for holding an article to be polished in such a manner that the article is kept in contact, under pressure with the polishing member while being polished. A vibration detector is provided on the rotatable carrier assembly in order to detect the vibration caused by the rubbing between the article and the polishing member of the turntable assembly. A light signal emission device is provided on the rotatable carrier assembly and is adapted to receive electrical signals transmitted from the vibration detector to generate and emit light signals in response to the vibration detected by the detector. A light signal receiving device is provided on a stationary part of the polisher. The light emission device may be an infrared light emission device.
摘要翻译：具有振动检测系统的抛光机，其能够检测在待抛光制品和抛光部件之间摩擦所产生的振动，而不会在现有技术抛光机中产生任何噪音。抛光机包括具有抛光表面的转盘组件，可旋转的载体组件，用于在抛光时在抛光构件的压力下保持物品保持接触的方式保持要抛光的物品。振动检测器设置在可旋转托架组件上，以便检测由物品与转盘组件的抛光部件之间的摩擦引起的振动。光信号发射装置设置在可旋转载体组件上，并且适于接收从振动检测器传送的电信号，以响应于由检测器检测到的振动而产生和发射光信号。光信号接收装置设置在抛光机的固定部分上。发光装置可以是红外发光装置。

2. 发明授权

US5639388A Polishing endpoint detection method 失效
标题翻译：抛光端点检测方法
公开(公告)号：US5639388A
公开(公告)日：1997-06-17
申请号：US588241
申请日：1996-01-18
申请人： Norio Kimura , Fumihiko Sakata , Tamami Takahashi
发明人： Norio Kimura , Fumihiko Sakata , Tamami Takahashi
IPC分类号： B24B37/013 , B24B37/07 , B24B49/16 , H01L21/66
CPC分类号： B24B37/013 , B24B49/16
摘要： An endpoint detection in a polishing process of a polishing object which has a first layer and a second layer, formed under the first layer, is performed by holding the polishing object on a top ring and pressing a surface of the first layer of the polishing object onto a polishing cloth mounted on a rotating turntable so as to remove the first layer, oscillating the top ring in contact with the turntable, periodically measuring a torque on the rotating turntable when the top ring is positioned at a specific radial location defined by a radius from a rotational center of the turntable, and determining the endpoint based on a change in the torque generated when the first layer is removed and the second layer comes into contact with the polishing cloth.
摘要翻译：通过将抛光对象保持在顶环上并按压抛光对象的第一层的表面来进行在第一层下方形成有第一层和第二层的抛光对象的抛光工序中的端点检测到安装在旋转转台上的抛光布上，以便去除第一层，使顶环与转台相接触，使顶环周期性地测量旋转转台上的转矩，当顶环位于由半径限定的特定径向位置时并且基于当去除第一层并且第二层与抛光布接触时产生的扭矩的变化来确定端点。

3. 发明授权

US5830041A Method and apparatus for determining endpoint during a polishing process 失效
标题翻译：用于在抛光过程中确定端点的方法和装置
公开(公告)号：US5830041A
公开(公告)日：1998-11-03
申请号：US743361
申请日：1996-11-04
申请人： Tamami Takahashi , Fumihiko Sakata , Norio Kimura , Masako Kodera , Atsushi Shigeta
发明人： Tamami Takahashi , Fumihiko Sakata , Norio Kimura , Masako Kodera , Atsushi Shigeta
IPC分类号： B24B37/013 , B24B37/04 , B24B49/16 , B24B7/22
CPC分类号： B24B37/013 , B24B49/16
摘要： A method and apparatus for determining a planar end point on a workpiece such as a semiconductor wafer in a polishing process for polishing the workpiece to a flat mirror finish. The workpiece having an uneven surface is held by a top ring and pressed against a polishing platen. The workpiece is moved relative to the polishing platen to polish the workpiece, and a change in a frictional force between the workpiece and the polishing platen is detected. A reference time when the workpiece having an uneven surface is polished to a flat surface is determined based on the change of the frictional force between the workpiece and the polishing platen. The time when a certain period of polishing time from the reference time elapses is determined as an endpoint on the workpiece.
摘要翻译：一种用于在用于将工件抛光到平面镜面抛光的抛光工艺中确定诸如半导体晶片的工件上的平面终点的方法和装置。具有不平坦表面的工件由顶环保持并压靠在研磨台板上。工件相对于研磨台板移动以抛光工件，并且检测到工件和抛光台板之间的摩擦力的变化。基于工件和研磨台板之间的摩擦力的变化，确定具有不平坦表面的工件被抛光到平坦表面的参考时间。从参考时间经过一定时间的抛光时间经过的时间被确定为工件上的端点。

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