专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5888412A Method for making a sculptured diaphragm 失效
标题翻译：制作雕刻膜片的方法
公开(公告)号：US5888412A
公开(公告)日：1999-03-30
申请号：US610033
申请日：1996-03-04
申请人： Kathirgamasundaram Sooriakumar , Andrew C. McNeil , Kenneth G. Goldman , Mahesh K. Shah
发明人： Kathirgamasundaram Sooriakumar , Andrew C. McNeil , Kenneth G. Goldman , Mahesh K. Shah
IPC分类号： G01L9/00 , B44C1/22
CPC分类号： G01L9/0042
摘要： A sculptured diaphragm of a sensor is fabricated by providing a semiconductor material, forming at least one cavity on the front side of the semiconductor material, forming a diaphragm layer over the semiconductor material, and the etching a cavity on the back side of the semiconductor material. If a sensor having a diaphragm with a central boss is desired, then the diaphragm layer is planarized to form a thick and a thin portion in the diaphragm layer.
摘要翻译：通过提供半导体材料制造传感器的雕刻隔膜，在半导体材料的正面上形成至少一个空腔，在半导体材料上形成隔膜层，并且蚀刻半导体材料背面的空腔。如果需要具有带有中心凸台的隔膜的传感器，则隔膜层被平坦化以在隔膜层中形成厚而薄的部分。

2. 发明授权

US08925384B2 MEMS sensor with stress isolation and method of fabrication 有权
标题翻译：具有应力隔离的MEMS传感器和制造方法
公开(公告)号：US08925384B2
公开(公告)日：2015-01-06
申请号：US13482332
申请日：2012-05-29
申请人： Andrew C. McNeil , Gary G. Li , Lisa Z. Zhang , Yizhen Lin
发明人： Andrew C. McNeil , Gary G. Li , Lisa Z. Zhang , Yizhen Lin
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P15/0802 , G01P15/18 , G01P2015/0831
摘要： A MEMS sensor (20, 86) includes a support structure (26) suspended above a surface (28) of a substrate (24) and connected to the substrate (24) via spring elements (30, 32, 34). A proof mass (36) is suspended above the substrate (24) and is connected to the support structure (26) via torsional elements (38). Electrodes (42, 44), spaced apart from the proof mass (36), are connected to the support structure (26) and are suspended above the substrate (24). Suspension of the electrodes (42, 44) and proof mass (36) above the surface (28) of the substrate (24) via the support structure (26) substantially physically isolates the elements from deformation of the underlying substrate (24). Additionally, connection via the spring elements (30, 32, 34) result in the MEMS sensor (22, 86) being less susceptible to movement of the support structure (26) due to this deformation.
摘要翻译： MEMS传感器（20,86）包括悬挂在基板（24）的表面（28）上方并通过弹簧元件（30,32,34）连接到基板（24）的支撑结构（26）。证明物质（36）悬挂在基底（24）上方，并通过扭转元件（38）连接到支撑结构（26）。与证明物质（36）间隔开的电极（42,44）连接到支撑结构（26）并悬挂在基底（24）上方。通过支撑结构（26）将基片（24）的表面（28）上方的电极（42,44）和检验质量块（36）悬挂在基本上物理上隔离下面的基底（24）的变形。此外，通过弹簧元件（30,32,34）的连接导致MEMS传感器（22,86）由于这种变形而不易受支撑结构（26）的移动的影响。

3. 发明授权

US08610222B2 MEMS device with central anchor for stress isolation 有权
标题翻译：具有中心锚杆的MEMS器件用于应力隔离
公开(公告)号：US08610222B2
公开(公告)日：2013-12-17
申请号：US13088579
申请日：2011-04-18
申请人： Yizhen Lin , Gary G. Li , Andrew C. McNeil , Todd F. Miller , Lisa Z. Zhang
发明人： Yizhen Lin , Gary G. Li , Andrew C. McNeil , Todd F. Miller , Lisa Z. Zhang
IPC分类号： H01L27/14
CPC分类号： B81B3/0072 , B81B2203/0136 , B81B2203/0307
摘要： A MEMS device (20) includes a proof mass (32) coupled to and surrounding an immovable structure (30). The immovable structure (30) includes fixed fingers (36, 38) extending outwardly from a body (34) of the structure (30). The proof mass (32) includes movable fingers (60), each of which is disposed between a pair (62) of the fixed fingers (36, 38). A central area (42) of the body (34) is coupled to an underlying substrate (24), with the remainder of the immovable structure (30) and the proof mass (32) being suspended above the substrate (24) to largely isolate the MEMS device (20) from package stress, Additionally, the MEMS device (20) includes isolation trenches (80) and interconnects (46, 50, 64) so that the fixed fingers (36), the fixed fingers (38), and the movable fingers (60) are electrically isolated from one another to yield a differential device configuration.
摘要翻译： MEMS装置（20）包括联接到并围绕不可移动结构（30）的检验质量块（32）。不动结构（30）包括从结构（30）的主体（34）向外延伸的固定指状物（36,38）。检测质量块（32）包括可动指状物（60），每个指状物设置在固定指状物（36,38）的一对（62）之间。主体（34）的中心区域（42）联接到下面的基板（24），其中不可移动的结构（30）的其余部分和证明质量块（32）悬挂在基板（24）上方以大大隔离另外，MEMS器件（20）包括隔离沟槽（80）和互连（46,50,64），使得固定指状物（36），固定指状物（38）和可动指状物（60）彼此电隔离以产生差分装置构型。

4. 发明申请

US20130104651A1 INERTIAL SENSOR WITH OFF-AXIS SPRING SYSTEM 有权
标题翻译：具有偏轴弹簧系统的惯性传感器
公开(公告)号：US20130104651A1
公开(公告)日：2013-05-02
申请号：US13282192
申请日：2011-10-26
申请人： Gary G. Li , Yizhen Lin , Andrew C. McNeil , Lisa Z. Zhang
发明人： Gary G. Li , Yizhen Lin , Andrew C. McNeil , Lisa Z. Zhang
IPC分类号： G01C19/56
CPC分类号： G01C19/5747 , G01C19/5762
摘要： An inertial sensor (20) includes a drive mass (30) configured to undergo oscillatory motion and a sense mass (32) linked to the drive mass (30). On-axis torsion springs (58) are coupled to the sense mass (32), the on-axis torsion springs (58) being co-located with an axis of rotation (22). The inertial sensor (20) further includes an off-axis spring system (60). The off-axis spring system (60) includes off-axis springs (68, 70, 72, 74), each having a connection interface (76) coupled to the sense mass (32) at a location on the sense mass (32) that is displaced away from the axis of rotation (22). Together, the on-axis torsion springs (58) and the off-axis spring system (60) enable the sense mass (32) to oscillate out of plane about the axis of rotation (22) at a sense frequency that substantially matches a drive frequency of the drive mass (30).
摘要翻译：惯性传感器（20）包括构造成经历振荡运动的驱动质量块（30）和与驱动质量块（30）连接的感测质量块（32）。轴上扭转弹簧（58）联接到感测质量块（32），所述轴上扭转弹簧（58）与旋转轴线（22）共同定位。惯性传感器（20）还包括离轴弹簧系统（60）。离轴弹簧系统（60）包括离轴弹簧（68,70,72,74），每个离轴弹簧具有在感测质量块（32）上的位置处耦合到感测质量块（32）的连接界面（76）其远离旋转轴线（22）移位。一起，轴上扭转弹簧（58）和离轴弹簧系统（60）使得感测质量（32）能够以基本匹配驱动器的感测频率围绕旋转轴线（22）摆动离开平面驱动质量（30）的频率。

5. 发明申请

US20120175747A1 MEMS DEVICE ASSEMBLY AND METHOD OF PACKAGING SAME 有权
标题翻译： MEMS器件组件及其封装方法
公开(公告)号：US20120175747A1
公开(公告)日：2012-07-12
申请号：US13360920
申请日：2012-01-30
申请人： Mark E. Schlarmann , Andrew C. McNeil , Hemant D. Desai
发明人： Mark E. Schlarmann , Andrew C. McNeil , Hemant D. Desai
IPC分类号： H01L29/02 , H01L21/56
CPC分类号： H04R31/00 , B81B7/0054 , B81B2201/0264 , B81C1/00309 , B81C2203/0154 , G01L9/0054 , G01L19/142 , G01L19/148 , H01L2224/48137 , H04R21/02 , H04R23/006 , H04R2201/003
摘要： An assembly (220) includes a MEMS die (222) and an integrated circuit (IC) die (224) attached to a substrate (226). The MEMS die (222) includes a MEMS device (237) formed on a substrate (242). A packaging process (264) entails forming the MEMS device (237) on the substrate (242) and removing a material portion of the substrate (237) surrounding the device (237) to form a cantilevered substrate platform (246) suspended above the substrate (226) at which the MEMS device (237) resides. The MEMS die (222) is electrically interconnected with the IC die (224). A plug element (314) can be positioned overlying the platform (246). Molding compound (32) is applied to encapsulate the die (222), the IC die (224), and substrate (226). Following encapsulation, the plug element (314) can be removed, and a cap (236) can be coupled to the substrate (242) overlying an active region (244) of the MEMS device (237).
摘要翻译：组件（220）包括附接到衬底（226）的MEMS管芯（222）和集成电路（IC）管芯（224）。 MEMS管芯（222）包括形成在衬底（242）上的MEMS器件（237）。包装工艺（264）需要在衬底（242）上形成MEMS器件（237）并且去除围绕器件（237）的衬底（237）的材料部分，以形成悬浮在衬底上的悬臂衬底平台（246）（226），其中MEMS器件（237）所在的位置。 MEMS管芯（222）与IC管芯（224）电互连。插头元件（314）可以被定位在平台（246）上方。施加成型化合物（32）以封装模具（222），IC管芯（224）和基板（226）。在封装之后，插塞元件（314）可以被去除，并且帽（236）可以耦合到覆盖在MEMS器件（237）的有源区域（244）上的衬底（242）。

6. 发明申请

US20100107763A1 TRANSDUCER WITH DECOUPLED SENSING IN MUTUALLY ORTHOGONAL DIRECTIONS 有权
标题翻译：传感器在异常正交方向上具有解耦感测功能
公开(公告)号：US20100107763A1
公开(公告)日：2010-05-06
申请号：US12262042
申请日：2008-10-30
申请人： Yizhen Lin , Andrew C. McNeil
发明人： Yizhen Lin , Andrew C. McNeil
IPC分类号： G01P15/18
CPC分类号： G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/082 , G01P2015/0831
摘要： A microelectromechanical systems (MEMS) transducer (90) is adapted to sense acceleration in mutually orthogonal directions (92, 94, 96). The MEMS transducer (90) includes a proof mass (100) suspended above a substrate (98) by an anchor system (116). The anchor system (116) pivotally couples the proof mass (100) to the substrate (98) at a rotational axis (132) to enable the proof mass (100) to rotate about the rotational axis (132) in response to acceleration in a direction (96). The proof mass (100) has an opening (112) extending through it. Another proof mass (148) resides in the opening (112), and another anchor system (152) suspends the proof mass (148) above the surface (104) of the substrate (98). The anchor system (152) enables the proof mass (148) to move substantially parallel to the surface (104) of the substrate (98) in response to acceleration in at least another direction (92, 94).
摘要翻译：微机电系统（MEMS）传感器（90）适于感测相互正交的方向上的加速度（92,94,96）。 MEMS换能器（90）包括通过锚系统（116）悬挂在基板（98）上方的检验质量块（100）。锚定系统（116）在旋转轴线（132）处将证明物质（100）枢转地联接到基底（98），以使得证明物质（100）能够响应于旋转轴线（132）中的加速而围绕旋转轴线（132）旋转方向（96）。证明物质（100）具有延伸通过其的开口（112）。另一个检验质量块（148）位于开口（112）中，另一个锚定系统（152）将校准物质（148）悬挂在衬底（98）的表面（104）上方。锚系统（152）使得证明物质（148）响应于至少另一方向（92,94）上的加速，基本上平行于衬底（98）的表面（104）移动。

7. 发明授权

US07637160B2 MEMS suspension and anchoring design 失效
标题翻译： MEMS悬挂和锚定设计
公开(公告)号：US07637160B2
公开(公告)日：2009-12-29
申请号：US11479792
申请日：2006-06-30
申请人： Daniel N. Koury, Jr. , Andrew C. McNeil
发明人： Daniel N. Koury, Jr. , Andrew C. McNeil
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , B81B3/0094 , B81B2201/0235 , G01C19/5719 , G01P15/08 , G01P15/135 , G01P2015/0814
摘要： A MEMS device that has a sensitivity to a stimulus in at least one sensing direction includes a substrate, a movable mass with corner portions suspended in proximity to the substrate, at least one suspension structure coupled approximately to the corner portions of the movable mass for performing a mechanical spring function, and at least one anchor for coupling the substrate to the at least one suspension structure. The at least one anchor is positioned approximately on a center line in the at least one sensing direction.
摘要翻译：对至少一个感测方向上的刺激具有敏感性的MEMS器件包括基底，具有悬挂在基底附近的拐角部分的可移动物体，至少一个悬挂结构，其大致耦合到可移动块的角部，用于执行机械弹簧功能，以及用于将衬底耦合到至少一个悬挂结构的至少一个锚固件。所述至少一个锚固件大致位于所述至少一个感测方向上的中心线上。

8. 发明申请

US20090293616A1 CAPACITIVE SENSOR WITH STRESS RELIEF THAT COMPENSATES FOR PACKAGE STRESS 有权
标题翻译：具有应力消耗的电容传感器，用于包装应力补偿
公开(公告)号：US20090293616A1
公开(公告)日：2009-12-03
申请号：US12129548
申请日：2008-05-29
申请人： Yizhen Lin , Andrew C. McNeil
发明人： Yizhen Lin , Andrew C. McNeil
IPC分类号： G01P15/125
CPC分类号： H01L27/1203 , G01P15/125 , G01P21/00 , G01P2015/0831 , H01L28/40 , H01L28/60 , Y10T29/49002
摘要： A microelectromechanical systems (MEMS) capacitive sensor (52) includes a movable element (56) pivotable about a rotational axis (68) offset between ends (80, 84) thereof. A static conductive layer (58) is spaced away from the movable element (56) and includes electrode elements (62, 64). The movable element (56) includes a section (74) between the rotational axis (68) and one end (80) that exhibits a length (78). The movable element (56) further includes a section (76) between the rotational axis (68) and the other end (84) that exhibits a length (82) that is less than the length (78) of the section (74). The section (74) includes slots (88) extending through movable element (56) from the end (80) toward the rotational axis (68). The slots (88) provide stress relief in section (74) that compensates for package stress to improve sensor performance.
摘要翻译：微电子机械系统（MEMS）电容传感器（52）包括可围绕其端部（80,84）之间偏移的旋转轴线（68）枢转的可移动元件（56）。静电导电层（58）与可动元件（56）间隔开并且包括电极元件（62,64）。可移动元件（56）包括在旋转轴线（68）和呈现长度（78）的一端（80）之间的部分（74）。可移动元件（56）还包括在旋转轴线（68）和另一端（84）之间的部分（76），该部分具有小于部分（74）的长度（78）的长度（82）。部分（74）包括从端部（80）朝向旋转轴线（68）延伸穿过可移动元件（56）的槽（88）。槽（88）在部分（74）中提供应力释放，其补偿包装应力以改善传感器性能。

9. 发明授权

US06308577B1 Circuit and method of compensating for membrane stress in a sensor 失效
标题翻译：补偿传感器膜应力的电路和方法
公开(公告)号：US06308577B1
公开(公告)日：2001-10-30
申请号：US08722384
申请日：1996-09-30
申请人： Ira E. Baskett , Andrew C. McNeil
发明人： Ira E. Baskett , Andrew C. McNeil
IPC分类号： G01B716
CPC分类号： G01L1/2275 , G01L9/0055 , G01L9/06
摘要： A circuit and method for correcting a sense signal of a sensor (100) where the sense signal is reduced by a negative nonlinear error component introduced by membrane stress in a sensor structure (101). A first transducer (103) is disposed at a location (203) having substantial bending stress to produce a sense signal having a linear component and the nonlinear error component. A second transducer (102) is disposed at a location (202) with substantially zero bending stress to produce a sense signal having the nonlinear error component but a substantially zero linear component. The sense signal from the second transducer (102) is added to the sense signal from the first transducer (103) to correct the nonlinear error for producing a linear output sense signal (VOUT) of the sensor (100) which is representative of the physical condition.
摘要翻译：一种用于校正传感器（100）的感测信号的电路和方法，其中感测信号由传感器结构（101）中的膜应力引入的负非线性误差分量减小。第一传感器（103）设置在具有大的弯曲应力的位置（203），以产生具有线性分量和非线性误差分量的感测信号。第二传感器（102）设置在基本上零弯曲应力的位置（202）处，以产生具有非线性误差分量但基本为零线性分量的感测信号。来自第二换能器（102）的感测信号被添加到来自第一换能器（103）的感测信号，以校正非线性误差，以产生代表物理的传感器（100）的线性输出感测信号（VOUT）条件。

10. 发明申请

US20140210018A1 MICROELECTROMECHANICAL SYSTEM DEVICES HAVING CRACK RESISTANT MEMBRANE STRUCTURES AND METHODS FOR THE FABRICATION THEREOF 有权
标题翻译：具有抗裂膜结构的微电子系统装置及其制造方法
公开(公告)号：US20140210018A1
公开(公告)日：2014-07-31
申请号：US13753034
申请日：2013-01-29
申请人： Chad S. Dawson , Dubravka Bilic , Lianjun Liu , Andrew C. McNeil
发明人： Chad S. Dawson , Dubravka Bilic , Lianjun Liu , Andrew C. McNeil
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81B3/0018 , B81B3/0072 , B81B2203/0127 , B81C1/00015
摘要： Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure. The multi-layer membrane structure is produced by first forming a base membrane layer over and around the sacrificial body such that the base membrane layer has a non-planar upper surface. A predetermined thickness of the base membrane layer is then removed to impart the base membrane layer with a planar upper surface. A cap membrane layer is formed over the planar upper surface of the base membrane layer. The cap membrane layer is composed of a material having a substantially parallel grain orientation.
摘要翻译：提供了制造抗电微机电（MEMS）器件的方法，以及根据这些方法制造的MEMS器件。在一个实施例中，该方法包括在衬底上形成牺牲体，在衬底上产生多层膜结构，以及去除牺牲体的至少一部分以在多层膜结构内形成内腔。多层膜结构通过首先在牺牲体上方和周围形成基膜层使得基膜层具有非平面的上表面来制造。然后去除预定厚度的基膜层，以使基膜层具有平坦的上表面。在基膜层的平面上表面上形成盖膜层。盖膜层由具有基本上平行的晶粒取向的材料构成。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式