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    • 5. 发明授权
    • Wafer handling apparatus
    • 晶圆处理装置
    • US4597708A
    • 1986-07-01
    • US616979
    • 1984-06-04
    • William R. WheelerRusmin KudinarGeorge J. KrenDavid D. Clementson
    • William R. WheelerRusmin KudinarGeorge J. KrenDavid D. Clementson
    • H01L21/677B65G1/06
    • H01L21/67766Y10T74/1892Y10T74/1896
    • A wafer handler featuring a carriage movable along a rail path, the carriage supporting an upright rotatable arm with a cantilevered wafer chuck. Elevators for raising and lowering trays containing wafer stacks are disposed on either side of the rail path. Each elevator has a curved track section which may be interposed along the rail path. The upright arm has a track follower, parallel to a boom supporting the wafer chuck and freely movable along the rail path, except when it encounters a curved track section. In this instance, the track follower will follow the curved track section, causing rotation of the arm, boom and wafer chuck, bringing the chuck into the wafer stack at an elevation determined by the elevator. In this manner, motion in the X, Y and Z planes may be provided for stacked wafers over extended distances.
    • 具有可沿轨道移动的支架的晶片处理器,该支架支撑具有悬臂晶片卡盘的直立可旋转臂。 用于升高和降低包含晶片堆叠的托盘的升降机设置在轨道的任一侧。 每个电梯具有弯曲的轨道部分,其可以沿着轨道路线插入。 直立臂具有轨道跟随器,平行于支撑晶片卡盘的悬臂,并且可以沿着轨道路径自由移动,除非它遇到弯曲的轨道部分。 在这种情况下,跟踪跟随器将跟随弯曲的轨道部分,引起臂,吊臂和晶片卡盘的旋转,使得卡盘以电梯确定的仰角进入晶片堆叠。 以这种方式,X,Y和Z平面中的运动可以用于延长距离上的堆叠晶片。
    • 7. 发明授权
    • Wafer orientation system
    • 晶圆定向系统
    • US4376482A
    • 1983-03-15
    • US265412
    • 1981-05-19
    • William R. WheelerGeorge J. KrenDavid D. Clementson
    • William R. WheelerGeorge J. KrenDavid D. Clementson
    • B65G47/244H01L21/68B65G47/24
    • H01L21/68B65G47/244
    • A wafer orienting apparatus having inwardly biased rollers, spaced about the circumferential edge of a wafer in contact with the edge. Two of the rollers are spaced apart a distance less than the dimension of a primary flat registration edge and are mounted to follow the wafer edge upon rotation of the wafer. When a flat registration edge passes these closely spaced rollers they move inwardly, activating switches associated with a coincidence circuit. When both switches are simultaneously activated, the coincidence circuit produces a signal which stops wafer rotation, thereby orienting the wafer. The rollers are mounted so that they can be moved from the path of wafer travel after wafer orientation, permitting a queue of wafers to be oriented, one after the other.
    • 具有向内偏压的辊的晶片定向装置,其间隔开与所述边缘接触的晶片的周边边缘。 两个辊间隔开一个小于主平面配准边缘的尺寸的距离,并且在晶片旋转时安装成跟随晶片边缘。 当平面配准边缘通过这些紧密间隔的辊时,它们向内移动,启动与重合电路相关联的开关。 当两个开关同时被激活时,符合电路产生停止晶片旋转的信号,从而使晶片定向。 辊子被安装成使得它们可以在晶片取向之后从晶片移动的路径移动,从而允许晶片排队一个接一个地定向。
    • 9. 发明申请
    • AIR FLOW MANAGEMENT IN A SYSTEM WITH HIGH SPEED SPINNING CHUCK
    • 在高速旋转切割系统中的空气流量管理
    • US20130038866A1
    • 2013-02-14
    • US13565212
    • 2012-08-02
    • George J. KrenPaul DoyleAlexander Belyaev
    • George J. KrenPaul DoyleAlexander Belyaev
    • G01N21/00B23B31/30B23B31/02
    • H01L21/68735Y10T279/11Y10T279/21Y10T279/34
    • The present invention is directed to a high speed, spinning chuck for use in a semiconductor wafer inspection system. The chuck of the present disclosure is configured with a turbulence-reducing lip. Spinning of the chuck produces radial airflows proximal to a surface of the wafer and proximal to the bottom of the chuck. The turbulence-reducing lip of the chuck of the present disclosure directs the radial airflows off of the top surface of the wafer and the bottom surface of the chuck in a manner that minimizes the size of the low pressure zone formed between these radial airflows. The minimization of the low pressure zone reduces air turbulence about the periphery of the chuck and substrate, thereby reducing the possibility of contaminants in the system being directed onto the surface of the substrate by such air turbulence.
    • 本发明涉及一种用于半导体晶片检查系统的高速纺丝卡盘。 本公开的卡盘配置有减少湍流的唇部。 卡盘的旋转产生靠近晶片表面并靠近卡盘底部的径向气流。 本公开的卡盘的减少湍流的唇部以使得在这些径向气流之间形成的低压区域的尺寸最小化的方式引导径向气流离开晶片的顶表面和卡盘的底表面。 低压区域的最小化减小了卡盘和基板周围的空气紊流,从而降低了系统中的污染物通过这种空气湍流被引导到基板的表面上的可能性。
    • 10. 发明授权
    • Process for identifying defects in a substrate having non-uniform surface properties
    • 用于识别具有不均匀表面性质的基底中的缺陷的方法
    • US06781688B2
    • 2004-08-24
    • US10327484
    • 2002-12-20
    • George J. KrenMehdi Vaez-IravaniDavid W. Shortt
    • George J. KrenMehdi Vaez-IravaniDavid W. Shortt
    • G01N2100
    • G01N21/9501
    • A surface inspection method of the invention includes scanning an inspection surface taking surface measurements. Determinations of various noise levels in the surface are made based on variations in the surface measurements. A dynamic threshold is then determined. The dynamic threshold adapts to the noise levels in the inspection surface to provide a varying threshold that can provide areas of high and low defect sensitivity on the same inspection surface. Defects are then identified by comparing surface measurements with the dynamic threshold. Additionally, the invention includes a surface inspection method that uses signal-to-noise ratios to identify defects. Such a method scans an inspection surface to obtain surface measurements. Noise levels associated with the inspection surface are then determined. Signal-to-noise ratios are determined for the surface measurements. The signal-to-noise ratios are compared with a signal-to-noise ratio threshold value. Defects are identified based on the comparisons of the signal-to-noise ratio of the surface measurements with the signal-to-noise ratio threshold value.
    • 本发明的表面检查方法包括扫描检查表面进行表面测量。 基于表面测量的变化确定表面中各种噪声水平。 然后确定动态阈值。 动态阈值适应于检查表面中的噪声水平,以提供可在同一检查表面上提供高和低缺陷灵敏度区域的变化阈值。 然后通过将表面测量与动态阈值进行比较来识别缺陷。 此外,本发明包括使用信噪比来识别缺陷的表面检查方法。 这种方法扫描检查表面以获得表面测量。 然后确定与检查表面相关联的噪声水平。 确定表面测量的信噪比。 将信噪比与信噪比阈值进行比较。 基于表面测量的信噪比与信噪比阈值的比较来识别缺陷。