专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4254498A Time division telephone switching systems 失效
标题翻译：时分电话交换系统
公开(公告)号：US4254498A
公开(公告)日：1981-03-03
申请号：US002208
申请日：1979-01-09
申请人： Kanzi Tawara , Kazuo Hamazato , Tatsuro Takahashi , Tetsuaki Egawa
发明人： Kanzi Tawara , Kazuo Hamazato , Tatsuro Takahashi , Tetsuaki Egawa
IPC分类号： H04Q11/04
CPC分类号： H04Q11/04
摘要： The telephone switching system comprises a plurality of speech path units, a juncture switch unit for interconnecting the speech path units, a central processing unit for controlling the speech path units and the junctor switch unit. Each speech path unit comprises a time switch which shifts a signal which is time-division-multiplexed from time slots of a plurality of incoming highways to other time slots on a plurality of outgoing highways, a digital trunk circuit for processing a register signal received by the time slot and other control signals, and a speech path control equipment which receives and distributes a control signal between the time division switch, the digital trunk circuit and the central processing unit. The junctor switch unit is constructed to change the connections between the speech path units by using a plurality of time slots as one group, whereby the change of connection between respective speech path units by the junctor switch and effects changes in terms of a group units of a plurality of time slots when the number of the speech path units is varied.
摘要翻译：电话交换系统包括多个语音路径单元，用于互连语音路径单元的接合开关单元，用于控制语音路径单元的中央处理单元和连接器开关单元。每个语音路径单元包括一个时间开关，该时间开关将多个输入高速公路的时隙的时分多路复用的信号移位到多条输出高速公路上的其他时隙，用于处理由时隙和其他控制信号，以及语音路径控制设备，其在时分开关，数字中继电路和中央处理单元之间接收和分配控制信号。通过使用多个时隙作为一组，构成了通过使用多个时隙来改变语音路径单元之间的连接的顺序切换单元，由此，通过连接器切换的各个语音路径单元之间的连接的改变和效果根据当语音路径单元的数量变化时，多个时隙。

2. 发明授权

US4983111A Device for resin sealing semiconductor devices 失效
标题翻译：树脂密封半导体器件
公开(公告)号：US4983111A
公开(公告)日：1991-01-08
申请号：US447866
申请日：1989-12-08
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Suezaki , Hiromichi Yamada
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Suezaki , Hiromichi Yamada
IPC分类号： B29C45/02 , B29C45/17 , B30B15/06
CPC分类号： B30B15/06 , B29C45/02 , B29C45/1744
摘要： Apparatus for resin sealing semiconductor devices is disclosed, wherein semiconductor devices such as semiconductor chips are placed in cavities provided in a pair of chase blocks, which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks such as to resin seal the semiconductor devices.Also disclosed is a device for resin sealing semiconductor devices, which device comprises: a pair of chase blocks equipped with cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members adapted to hold the chase blocks over the respective press surfaces of the press machine and to undergo elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities provided in the chase blocks.

3. 发明授权

US4915608A Device for resin sealing semiconductor devices 失效
标题翻译：树脂密封半导体器件
公开(公告)号：US4915608A
公开(公告)日：1990-04-10
申请号：US219483
申请日：1988-07-15
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Suezaki , Hiromichi Yamada
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Suezaki , Hiromichi Yamada
IPC分类号： B29C45/02 , B29C45/17 , B30B15/06
CPC分类号： B30B15/06 , B29C45/02 , B29C45/1744
摘要： A device for resin sealing semiconductor devices includes a pair of chase blocks having cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members for holding the chase blocks over the respective press surfaces of the press machine and undergoing elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities in the chase blocks.
摘要翻译：用于树脂密封半导体器件的装置包括一对具有用于保持半导体器件的空腔的追逐块，用于通过一对压力表面将追逐块相对地挤压的压制机，用于将追逐块保持在压制机的各个压制表面在压制机的压制操作期间经历弹性压缩变形，以及塑料注射器，用于将塑料注入到追加块中的空腔中。

4. 发明授权

US4788679A Packet switch with variable data transfer rate links 失效
标题翻译：具有可变数据传输速率链路的分组交换机
公开(公告)号：US4788679A
公开(公告)日：1988-11-29
申请号：US083646
申请日：1987-08-10
申请人： Hideki Kataoka , Tatsuro Takahashi , Shiro Kikuchi , Naoaki Yamanaka , Hajime Sakakibara , Miki Hirano
发明人： Hideki Kataoka , Tatsuro Takahashi , Shiro Kikuchi , Naoaki Yamanaka , Hajime Sakakibara , Miki Hirano
IPC分类号： H04L12/933 , H04L12/935 , H04J3/26
CPC分类号： H04L49/103 , H04L49/1515 , H04L49/30
摘要： A packet switch has pluralities of incoming and outgoing trunks, a data memory accessible from them in common, and FIFO memories each provided in each of input and output circuits. Data from the incoming trunks is written into and read out from the buffer memory for transfer to the outgoing trunks, on a time-shared basis, to perform packet switching between trunks of different data transfer rates. Furthermore, the packet switch has an arbiter for detecting process requests from the input circuits and an arbiter for detecting process requests from the output circuits, so that priority control is effected for servicing the requests. As a result, dynamic allocation of access to the buffer memory to the input and output circuits is permitted.
摘要翻译：分组交换机具有多个入站和出站中继线，可共同访问的数据存储器以及每个输入和输出电路中各提供的FIFO存储器。来自传入干线的数据被写入并从缓冲存储器中读出，以便在时间共享的基础上传送到输出中继线，以在不同数据传输速率的干线之间执行分组交换。此外，分组交换机具有用于检测来自输入电路的处理请求的仲裁器和用于检测来自输出电路的处理请求的仲裁器，从而对服务请求进行优先级控制。结果，允许对输入和输出电路的缓冲存储器的访问的动态分配。

5. 发明授权

US5059379A Method of resin sealing semiconductor devices 失效
标题翻译：树脂密封半导体器件的方法
公开(公告)号：US5059379A
公开(公告)日：1991-10-22
申请号：US447917
申请日：1989-12-08
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Seuzaki , Hiromichi Yamada
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Seuzaki , Hiromichi Yamada
IPC分类号： B29C45/02 , B29C45/17 , B30B15/06
CPC分类号： B29C45/1744 , B29C45/02 , B30B15/06
摘要： A method of resin sealing semiconductor devices wherein semiconductor devices, such as semiconductor chips, are placed in cavities provided in a pair of chase blocks which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks to resin seal the semiconductor devices.
摘要翻译：一种树脂密封半导体器件的方法，其中半导体器件（例如半导体芯片）被放置在设置在一对追逐块中的空腔中，空腔通过压力机通过能够弹性压缩变形的支撑构件夹紧。然后将塑料注入到追逐块的空腔中以树脂密封半导体器件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式