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1. 发明授权

US5059379A Method of resin sealing semiconductor devices 失效
标题翻译：树脂密封半导体器件的方法
公开(公告)号：US5059379A
公开(公告)日：1991-10-22
申请号：US447917
申请日：1989-12-08
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Seuzaki , Hiromichi Yamada
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Seuzaki , Hiromichi Yamada
IPC分类号： B29C45/02 , B29C45/17 , B30B15/06
CPC分类号： B29C45/1744 , B29C45/02 , B30B15/06
摘要： A method of resin sealing semiconductor devices wherein semiconductor devices, such as semiconductor chips, are placed in cavities provided in a pair of chase blocks which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks to resin seal the semiconductor devices.
摘要翻译：一种树脂密封半导体器件的方法，其中半导体器件（例如半导体芯片）被放置在设置在一对追逐块中的空腔中，空腔通过压力机通过能够弹性压缩变形的支撑构件夹紧。然后将塑料注入到追逐块的空腔中以树脂密封半导体器件。

2. 发明授权

US4983111A Device for resin sealing semiconductor devices 失效
标题翻译：树脂密封半导体器件
公开(公告)号：US4983111A
公开(公告)日：1991-01-08
申请号：US447866
申请日：1989-12-08
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Suezaki , Hiromichi Yamada
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Suezaki , Hiromichi Yamada
IPC分类号： B29C45/02 , B29C45/17 , B30B15/06
CPC分类号： B30B15/06 , B29C45/02 , B29C45/1744
摘要： Apparatus for resin sealing semiconductor devices is disclosed, wherein semiconductor devices such as semiconductor chips are placed in cavities provided in a pair of chase blocks, which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks such as to resin seal the semiconductor devices.Also disclosed is a device for resin sealing semiconductor devices, which device comprises: a pair of chase blocks equipped with cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members adapted to hold the chase blocks over the respective press surfaces of the press machine and to undergo elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities provided in the chase blocks.

3. 发明授权

US4915608A Device for resin sealing semiconductor devices 失效
标题翻译：树脂密封半导体器件
公开(公告)号：US4915608A
公开(公告)日：1990-04-10
申请号：US219483
申请日：1988-07-15
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Suezaki , Hiromichi Yamada
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Suezaki , Hiromichi Yamada
IPC分类号： B29C45/02 , B29C45/17 , B30B15/06
CPC分类号： B30B15/06 , B29C45/02 , B29C45/1744
摘要： A device for resin sealing semiconductor devices includes a pair of chase blocks having cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members for holding the chase blocks over the respective press surfaces of the press machine and undergoing elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities in the chase blocks.
摘要翻译：用于树脂密封半导体器件的装置包括一对具有用于保持半导体器件的空腔的追逐块，用于通过一对压力表面将追逐块相对地挤压的压制机，用于将追逐块保持在压制机的各个压制表面在压制机的压制操作期间经历弹性压缩变形，以及塑料注射器，用于将塑料注入到追加块中的空腔中。

4. 发明授权

US5281121A Resin sealing apparatus 失效
标题翻译：树脂密封装置
公开(公告)号：US5281121A
公开(公告)日：1994-01-25
申请号：US817383
申请日：1992-01-06
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Yutaka Morita
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Yutaka Morita
IPC分类号： B29C45/26 , B29C45/02 , B29C33/30
CPC分类号： B29C45/2602 , Y10S425/228
摘要： A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to each of the chase blocks so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges.
摘要翻译：树脂密封装置包括上模具和下模具，每个模具具有多个腔体，其中注入有熔融树脂;一个支撑部件，用于支撑追加块，上模具和下模具的追逐块相互嵌合，以及位置确定构件，其附接到每个追逐块，使得当它们组装时确定追踪块的位置，其中每个追逐块被附接到每个支撑构件，以便能够在垂直方向上移动，给定范围内的横向。

5. 发明授权

US5108278A Resin sealing apparatus 失效
标题翻译：树脂密封装置
公开(公告)号：US5108278A
公开(公告)日：1992-04-28
申请号：US666562
申请日：1991-03-08
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Yutaka Morita
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Yutaka Morita
IPC分类号： B29C33/30 , B29C33/76 , B29C45/26 , B29C45/36 , B29L31/34
CPC分类号： B29C45/2602 , Y10S425/228
摘要： A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to a center block so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges. The center block is provided on the supporting member and is disposed between two of the chase block with center plates interposed therebetween to form an integral unit.
摘要翻译：树脂密封装置包括上模具和下模具，每个模具具有多个腔体，其中注入有熔融树脂;一个支撑部件，用于支撑追加块，上模具和下模具的追逐块相互嵌合，以及位置确定构件，其附接到中心块，使得当它们组装时确定跟踪块的位置，其中每个追逐块被附接到每个支撑构件，以便可以在垂直和横向方向上移动在给定范围内。中心块设置在支撑构件上，并且设置在夹具之间的中间板之间的两个追逐块之间，以形成一体的单元。

6. 发明授权

US5336272A Method for molding a semiconductor package on a continuous leadframe 失效
标题翻译：在连续引线框上模制半导体封装的方法
公开(公告)号：US5336272A
公开(公告)日：1994-08-09
申请号：US876306
申请日：1992-04-30
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka
IPC分类号： B29C45/14 , H01L21/56 , H01L21/28 , B28B7/00 , B29C43/22 , H01L21/60
CPC分类号： B29C45/14655 , H01L21/56 , H01L2924/0002 , Y10T29/41 , Y10T29/49121
摘要： A method and apparatus for sealing a semiconductor wherein an upper seal block of a cope and a lower seal block of a drag are provided with sealants for nipping a portion of a long size lead frame, so that the airtightness of a cavity enclosed with the cope and drag can be completely kept. The long size lead frame may have a continuing part extending from one of two side members to the other, provided between adjacent lead patterns to be pressed by the sealants, so that the airtightness of the cavity can be further completely kept.
摘要翻译：一种用于密封半导体的方法和装置，其中上盖的上密封块和阻力的下密封块设置有用于夹紧长尺寸引线框架的一部分的密封剂，使得封闭在上盖体上的空腔的气密性并拖动可以完全保存。长尺寸引线框架可以具有从两个侧构件中的一个延伸到另一个的连续部分，设置在相邻的引线图案之间，以被密封剂挤压，从而可以进一步完全保持空腔的气密性。

7. 发明授权

US5662848A Plastic molding method for semiconductor devices 失效
标题翻译：半导体器件的塑料成型方法
公开(公告)号：US5662848A
公开(公告)日：1997-09-02
申请号：US602679
申请日：1996-02-16
申请人： Sueyoshi Tanaka , Zyunzi Sakakibara , Yasutsugu Tsutsumi
发明人： Sueyoshi Tanaka , Zyunzi Sakakibara , Yasutsugu Tsutsumi
IPC分类号： B29C45/14 , B29C45/26 , B29C45/34 , H01L21/00 , H01L21/56 , B29C33/10 , B29C45/02
CPC分类号： B29C45/14655 , B29C45/34 , H01L21/565 , B29C45/2673 , H01L2924/0002 , Y10S425/047
摘要： A plastic molding method for semiconductor devices, the method including placing semiconductor devices mounted on lead-frames between lower die cavities in a lower die chase block and upper die cavities in an upper die chase block and clamping the upper and lower die chase blocks together; evacuating an ejector chamber in the lower die chase block through a lower die common surface table, evacuating an ejector chamber in the upper die chase block through an upper die common surface table, and evacuating a parting chamber at a parting surface between the lower die chase block and the upper die chase block through one of the lower die common surface table and the upper die common surface table; and injecting a sealing resin into the upper die cavities and the lower die cavities to plastically package the semiconductor devices.
摘要翻译：一种用于半导体器件的塑料模制方法，所述方法包括将安装在引线框架上的半导体器件放置在下模块中的下模腔和上模块中的上模腔之间，并将上模块和下模块嵌套在一起; 通过下模公共表台将下模块中的喷射器室排空，通过上模公共表台对上模块中的喷射室进行抽空，并在下模追逐之间的分离表面排空分离室块和上模块通过下模公共表面和上模公共表面之一; 以及将密封树脂注入到上模腔和下模腔中以塑性封装半导体器件。

8. 发明授权

US5366364A Plastic molding apparatus 失效
标题翻译：塑料成型设备
公开(公告)号：US5366364A
公开(公告)日：1994-11-22
申请号：US113823
申请日：1993-08-31
申请人： Sueyoshi Tanaka , Zyunzi Sakakibara , Yasutsugu Tsutsumi
发明人： Sueyoshi Tanaka , Zyunzi Sakakibara , Yasutsugu Tsutsumi
IPC分类号： B29C45/14 , B29C45/26 , B29C45/34 , H01L21/00 , H01L21/56 , B29C45/02 , B29C45/36
CPC分类号： B29C45/14655 , B29C45/34 , H01L21/565 , B29C45/2673 , H01L2924/0002 , Y10S425/047
摘要： A plastic molding apparatus for semiconductor devices includes a first evacuation passage via which an ejector chamber in a lower die chase block is evacuated through a lower die common surface table, a second evacuation passage via which an ejector chamber in the upper die chase block is evacuated through the upper die common surface table, and a third evacuation passage via which a parting chamber on a parting surface between the lower die chase block and the upper die chase block is evacuated through one of the lower die common surface table and the upper die common surface table. Since the evacuation passages are separate and the volume of the evacuation chamber is reduced, evacuation performance is improved and the size of the apparatus is reduced. The plastic packaging performance is also improved.
摘要翻译：一种用于半导体器件的塑料成型装置，包括：第一排气通道，通过该第一抽空通道将下模具走块中的喷射室通过下模公共表面表面排出;第二抽空通道，上模具走块中的顶出室被排出通过上模公共表面台面和第三排气通道，通过该第三抽空通道，通过下模具公共表面台和上模具公共部件中的一个将下模具走块和上模移动块之间的分型面上的分型室抽空表面。由于排气通道是分离的并且排气室的体积减小，排气性能得以改善，并且设备的尺寸减小。塑料包装性能也有所提高。

9. 发明授权

US5134458A Long size lead frame for semiconductor elements 失效
标题翻译：用于半导体元件的长尺寸引线框架
公开(公告)号：US5134458A
公开(公告)日：1992-07-28
申请号：US790016
申请日：1991-11-05
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka
IPC分类号： B29C45/14 , H01L21/56 , H01L23/50
CPC分类号： H01L21/56 , B29C45/14655 , H01L2924/0002
摘要： An upper seal block of a cope and a lower seal block of a drag are provided with sealants for nipping a portion of a long size lead frame, so that of a cavity enclosed with the cope and drag can be completely kept airtight. The long size lead frame may have a continuing part extending from one of two side members to the other, provided between adjacent lead patterns to be pressed by the sealants, so that the cavity can be further completely kept airtight.
摘要翻译：一个上部密封块和一个阻力的下部密封块设置有用于夹紧长尺寸引线框架的一部分的密封剂，使得被上下罩和拖曳物包围的空腔可以完全保持气密。长尺寸引线框架可以具有从两个侧部构件中的一个延伸到另一个侧部构件的连续部分，设置在相邻引导图案之间，以被密封剂压制，使得空腔可以进一步完全保持气密。

10. 发明授权

US5074779A Mold for resin-sealing a semiconductor device 失效
标题翻译：用于树脂密封半导体器件的模具
公开(公告)号：US5074779A
公开(公告)日：1991-12-24
申请号：US612628
申请日：1990-11-14
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka
IPC分类号： H01L21/56 , B29C33/12 , B29C45/02 , B29C45/37 , B29C45/40 , B29L31/34
CPC分类号： B29C45/37 , B29C45/40
摘要： A mold for resin-sealing of a semiconductor device includes a molding board, a cavity retainer which is secured to the molding board forming a void facing the molding board, a plurality of cavity inserts, each of which is embedded in the cavity retainer so that the face thereof is exposed, each cavity insert having a cavity formed in the face, a plurality of ejecting pins arranged to travel freely and penetrating each cavity insert and the cavity retainer, one end of the ejecting pin protruding into the inside of the void of the cavity retainer, the other end of each ejecting pin protruding into the inside of the cavity of the cavity insert, an ejector plate to which one end of each ejecting pin is secured, the ejector plate being positioned in the void of the cavity retainer, and elastic pins which penetrate through the ejector plate to elastically support the cavity inserts on the molding board.
摘要翻译：一种用于半导体器件的树脂密封的模具包括：成型板，固定到成型板上的空腔保持器，其形成面向模制板的空腔;多个空腔插入件，每个嵌入件嵌入在空腔保持器中，使得其表面被暴露，每个空腔插入件具有形成在该表面中的空腔，多个排出销布置成自由行进并穿过每个空腔插入件和空腔保持器，弹出销的一端突出到空腔的内部每个排出销的另一端突出到空腔插入件的腔体的内部，每个排出销的一端被固定到的顶出板，顶出板位于空腔保持器的空隙中，以及穿过顶出板弹性地支撑成型板上的腔嵌件的弹性销。

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