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1. 发明授权

US5028513A Process for producing printed circuit board 失效
标题翻译：印刷电路板生产工艺
公开(公告)号：US5028513A
公开(公告)日：1991-07-02
申请号：US336771
申请日：1989-04-13
申请人： Kanji Murakami , Mineo Kawamoto , Akio Tadokoro , Haruo Akahoshi , Toshikazu Narahara , Ritsuji Toba , Toshiaki Ishimaru , Nobuyuki Hayashi , Motoyo Wajima
发明人： Kanji Murakami , Mineo Kawamoto , Akio Tadokoro , Haruo Akahoshi , Toshikazu Narahara , Ritsuji Toba , Toshiaki Ishimaru , Nobuyuki Hayashi , Motoyo Wajima
IPC分类号： C23C18/40 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/18 , H05K3/24 , H05K3/28 , H05K3/38
CPC分类号： H05K3/282 , H05K3/108 , H05K2201/0355 , H05K2203/0591 , H05K2203/072 , H05K2203/1105 , H05K2203/124 , H05K3/0076 , H05K3/062 , H05K3/383
摘要： The present invention provide a process for producing printed circuit boards which comprises the steps of(a) roughening a surface of a copper layer formed on an insulating board.(b) coating the roughened surface of copper layer with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist layer, thereby forming plating-resist coats on circuit-negative pattern portions of the copper layer,(c) heat-treating the plating-resist coats,(d) plating chemically the circuit-corresponding portion with copper,(e) removing the plating-resist coats, and(f) removing the copper layer except the circuit-corresponding portion thereof.

2. 发明授权

US5712080A Method for manufacturing printed circuit board 失效
标题翻译：印刷电路板制造方法
公开(公告)号：US5712080A
公开(公告)日：1998-01-27
申请号：US801421
申请日：1997-02-18
申请人： Yuichi Satsu , Haruo Akahoshi , Mineo Kawamoto , Akio Takahashi , Masashi Miyazaki , Toshiaki Ishimaru
发明人： Yuichi Satsu , Haruo Akahoshi , Mineo Kawamoto , Akio Takahashi , Masashi Miyazaki , Toshiaki Ishimaru
IPC分类号： G03F7/004 , G03F7/038 , G03F7/085 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/18 , H05K3/38
CPC分类号： G03F7/085 , H05K3/108 , H05K2201/0347 , H05K2201/0355 , H05K2203/1105 , H05K2203/124 , H05K3/0076 , H05K3/062 , H05K3/384 , Y10S430/155
摘要： A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1); ##STR1## where, R.sub.1 is H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R.sub.2 is an alkylene group having 1-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2); ##STR2## where, R.sub.3 is H or an alkyl group having 1-6 carbon atoms, X is NH or S, and Z is N or C--Y, where Y is H, NH.sub.2, or SH.
摘要翻译：一种印刷电路板的制造方法，其特征在于，使用由感光性树脂组合物层构成的负极图案，通过化学金属电镀形成配线图案作为电镀抗蚀剂，其特征在于，所述感光性树脂至少含有由以下所示的重复单元构成的直链状高分子通式（1）; 具有1-9个碳原子的烷氧基，具有1-9个碳原子的羧基烷基，R2是具有1-9个碳原子的亚烷基，n是重复单元的聚合数和由以下通式（2）表示的有机化合物。（2）其中，R3为H或具有1-6个碳原子的烷基，X为NH或S，Z为N或C-Y，其中Y为H，NH2或SH。

3. 发明授权

US5476690A Process for preparing printed circuit board 失效
标题翻译：印刷电路板的制作工艺
公开(公告)号：US5476690A
公开(公告)日：1995-12-19
申请号：US253561
申请日：1994-06-03
申请人： Fumihiko Ohta , Takeshi Nojiri , Shinji Tsuchikawa , Akio Nakano , Toshiaki Ishimaru , Hiroshi Yamazaki , Haruo Akahoshi , Mineo Kawamoto , Akio Takahashi
发明人： Fumihiko Ohta , Takeshi Nojiri , Shinji Tsuchikawa , Akio Nakano , Toshiaki Ishimaru , Hiroshi Yamazaki , Haruo Akahoshi , Mineo Kawamoto , Akio Takahashi
IPC分类号： G03F7/027 , C23C18/16 , G03F7/028 , G03F7/033 , H05K3/00 , H05K3/18 , B05D5/12
CPC分类号： G03F7/033 , C23C18/1605 , C23C18/405 , H05K3/184 , C23C18/2013 , C23C18/2033 , C23C18/24 , C23C18/30 , H05K2203/0793 , H05K3/0076
摘要： Disclosed is a process for preparing a printed circuit board, which comprises the steps of:(1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of Components (a) and (b);(2) forming a negative pattern of the light-sensitive resin composition on the surface of the substrate by irradiating active light imagewisely and developing with a semi-aqueous developing solution; and(3) forming a circuit pattern by electroless copper plating by using the negative pattern of the light-sensitive resin composition on the surface of the substrate as a plating resist.
摘要翻译：公开了一种制备印刷电路板的方法，其包括以下步骤：（1）在绝缘基板的表面上，在要沉积无电镀铜的必需部分上形成光敏层树脂组合物，其包含（a）40至80重量份的酸值为10至46mgKOH / g的乙烯基聚合的高分子量粘合剂，（b）20至60重量份具有至少两个可聚合的不饱和双键，组分（a）和（b）的总量为100重量份，和（c）光聚合引发剂通过以0.1〜10重量份的量的活性光照射而产生自由基基于100重量份的组分（a）和（b）的重量; （2）通过成像地照射活性光并用半显影液显影来在感光树脂组合物的表面上形成负型图案; 和（3）通过使用感光性树脂组合物的负图案作为电镀抗蚀剂的基板表面，通过化学镀铜形成电路图案。

4. 发明授权

US5438751A Process for producing printed wiring board 失效
标题翻译：印刷线路板生产工艺
公开(公告)号：US5438751A
公开(公告)日：1995-08-08
申请号：US112337
申请日：1993-08-27
申请人： Masashi Miyazaki , Haruo Akahoshi , Shozo Nohara , Kenzi Kikuta , Toshiaki Ishimaru
发明人： Masashi Miyazaki , Haruo Akahoshi , Shozo Nohara , Kenzi Kikuta , Toshiaki Ishimaru
IPC分类号： G03F7/033 , G03F7/30 , G03F7/32 , H05K3/00 , H05K3/10 , H05K3/18 , H05K3/06
CPC分类号： G03F7/322 , G03F7/033 , G03F7/30 , H05K3/108 , H05K3/184 , H05K2203/0783 , H05K2203/0793 , H05K3/0076 , Y10T29/49126 , Y10T29/49156
摘要： In an additive process for producing printed wiring boards, by using a developer comprising a chlorine-free organic solvent and an alkaline aqueous solution and as a resist material a copolymer of methacrylic acid and methyl methacrylate or the like, the production steps are simplified even if a substrate having a large area is used, and abolishment of chlorine-containing organic solvent as a developer becomes possible.
摘要翻译：在制造印刷电路板的添加方法中，通过使用包含无氯有机溶剂和碱性水溶液的显影剂和作为抗蚀剂材料的甲基丙烯酸和甲基丙烯酸甲酯等的共聚物，即使制备步骤也简化使用面积大的基板，可以取消含氯有机溶剂作为显影剂。

5. 发明授权

US5919603A Process for producing printed wiring board 失效
公开(公告)号：US5919603A
公开(公告)日：1999-07-06
申请号：US967196
申请日：1997-10-29
申请人： Masashi Miyazaki , Haruo Akahoshi , Shozo Nohara , Kenzi Kikuta , Toshiaki Ishimaru
发明人： Masashi Miyazaki , Haruo Akahoshi , Shozo Nohara , Kenzi Kikuta , Toshiaki Ishimaru
IPC分类号： G03F7/033 , G03F7/30 , G03F7/32 , H05K3/00 , H05K3/10 , H05K3/18 , G03C1/725 , C08J3/28
CPC分类号： G03F7/322 , G03F7/033 , G03F7/30 , H05K3/108 , H05K3/184 , H05K2203/0783 , H05K2203/0793 , H05K3/0076 , Y10T29/49126 , Y10T29/49156
摘要： In an additive process for producing printed wiring boards, by using a developer comprising a chlorine-free organic solvent and an alkaline aqueous solution and as a resist material a copolymer of methacrylic acid and methyl methacrylate or the like, the production steps are simplified even if a substrate having a large area is used, and abolishment of chlorine-containing organic solvent as a developer becomes possible.

6. 发明授权

US4544625A Photosensitive resin composition and photosensitive element 失效
标题翻译：感光树脂组合物和感光元件
公开(公告)号：US4544625A
公开(公告)日：1985-10-01
申请号：US576717
申请日：1984-02-03
申请人： Toshiaki Ishimaru , Katsushige Tsukada , Nobuyuki Hayashi
发明人： Toshiaki Ishimaru , Katsushige Tsukada , Nobuyuki Hayashi
IPC分类号： C08F299/00 , B23K35/22 , C08F2/50 , C08F290/00 , C08F299/06 , C08G18/67 , C23F1/00 , G03F7/027 , G03F7/038 , H05K3/28 , G03C1/68
CPC分类号： G03F7/027 , B23K35/224 , C08F299/065 , C08G18/672 , H05K3/287 , H05K2203/0783 , Y10S430/162
摘要： A photosensitive resin composition comprising (a) 20 to 75 parts by weight of an urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate with an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule in an amount of 0.01 to 5% by weight based on the total weight of components (a) and (b) is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.
摘要翻译：一种感光性树脂组合物，其包含（a）20〜75重量份通过三甲基六亚甲基二异氰酸酯与二元醇的丙烯酸或甲基丙烯酸单酯反应得到的聚氨酯二丙烯酸酯或二甲基丙烯酸酯化合物，（b）20〜75重量份的线性聚合物玻璃化转变温度为约40〜150℃的化合物，（c）由于光化反应而产生自由基的敏化剂和/或敏化剂体系，（d）含有磷酸基团的丙烯酸或甲基丙烯酸酯相对于成分（a）和（b）的总重量，分子中的0.01〜5重量％的耐热性，耐热冲击性和耐溶剂性优异，适合于形成焊接掩模。此外，通过在支撑体上形成上述组合物层而制造的感光元件形成耐热性，耐热冲击性和耐溶剂性优异的保护涂膜，特别适用于焊接掩模。

7. 发明授权

US4438190A Photosensitive resin composition containing unsaturated monomers and unsaturated phosphates 失效
标题翻译：含有不饱和单体和不饱和磷酸盐的感光树脂组合物
公开(公告)号：US4438190A
公开(公告)日：1984-03-20
申请号：US351765
申请日：1982-02-24
申请人： Toshiaki Ishimaru , Katsushige Tsukada , Nobuyuki Hayashi
发明人： Toshiaki Ishimaru , Katsushige Tsukada , Nobuyuki Hayashi
IPC分类号： G03F7/025 , B23K35/22 , C08F2/50 , C08F291/00 , C08G18/67 , C08L75/16 , C09D4/00 , G03F7/027 , G03F7/085 , H05K3/28 , G03C1/68
CPC分类号： C08L75/16 , B23K35/224 , C08F291/00 , C08G18/672 , C09D4/00 , G03F7/027 , G03F7/085 , H05K3/287 , H05K2203/0783 , Y10S430/106 , Y10S430/111 , Y10S430/117 , Y10S430/118 , Y10S430/12 , Y10S430/121 , Y10S430/122 , Y10S430/123
摘要： A photosensitive resin composition comprising (a) at least one compound selected from the group consisting of benzotriazole, benzimidazole, benzothiazole, derivatives thereof and salts thereof, (b) a phosphate compound having photopolymeric unsaturated bonds, (c), if necessary, an organic thermoplastic polymer, (d) a photopolymerizable unsaturated compound having at least one terminal ethylene group and (e) a sensitizer and/or a sensitizer system, and a photosensitive element comprising a layer of said photosensitive resin composition and a support film therefor, are provided. The photosensitive resin composition can form a protective coating film with excellent adhesiveness to the substrate surface, and such a protective coating film or, photosensitive element obtained therefrom can be advantageously used as a resist for soldering mask, etc.
摘要翻译：一种光敏树脂组合物，其包含（a）至少一种选自苯并三唑，苯并咪唑，苯并噻唑，其衍生物及其盐的化合物，（b）具有光聚合不饱和键的磷酸酯化合物，（c）如有必要，有机热塑性聚合物，（d）具有至少一个末端亚乙基的光聚合性不饱和化合物和（e）敏化剂和/或敏化剂体系，以及包含所述感光性树脂组合物层及其支持膜的感光元件。感光性树脂组合物可以形成对基材表面具有优异粘附性的保护涂膜，并且这种保护涂膜或由其获得的感光元件可有利地用作焊接掩模等的抗蚀剂。

8. 发明授权

US4312916A Process for producing adhesive film 失效
标题翻译：粘合膜生产工艺
公开(公告)号：US4312916A
公开(公告)日：1982-01-26
申请号：US186240
申请日：1980-09-11
申请人： Hajime Kakumaru , Nobuyuki Hayashi , Toshiaki Ishimaru , Kiyoshi Nakao , Tomohisa Ohta
发明人： Hajime Kakumaru , Nobuyuki Hayashi , Toshiaki Ishimaru , Kiyoshi Nakao , Tomohisa Ohta
IPC分类号： C08G18/63 , C09D4/06 , C09J4/02 , C09J4/06 , C09J7/02 , C09J175/04 , B05D3/06
CPC分类号： C09J175/04 , C08G18/637 , C09D4/06 , C09J4/06 , C09J7/0246 , Y10T428/2809 , Y10T428/2896
摘要： A process for producing adhesive film comprising coating on a filmlike substrate a composition comprising (i) a copolymer having a glass transition temperature of -30.degree. C. or lower and obtained from one or more monomers (a) such as alkyl acrylates or methacrylates, or the like, and another monomers (b) containing at least one carboxyl, alcoholic hydroxyl, or glycidyl group, (ii) a crosslinking agent having at least two crosslinkable functional groups which can react with the monomers (b), (iii) one or more monofunctional addition polymerizable monomers having a boiling point of 200.degree. C. or higher, (iv) one or more polyfunctional addition polymerizable monomers having a boiling point of 200.degree. C. or higher, and (v) a photochemical initiator, and irradiating said composition with actinic light, is advantageous in that the amount of solvent to be removed after coating the composition on the substrate can be reduced remarkably without lowering properties of the resulting adhesive film.
摘要翻译：一种制造粘合剂膜的方法，其包括在膜状基材上涂布组合物，所述组合物包含（i）玻璃化转变温度为-30℃以下并由一种或多种单体（a）如丙烯酸烷基酯或甲基丙烯酸烷基酯获得的共聚物，（b）含有至少一个羧基，醇羟基或缩水甘油基的单体（b），（ii）具有至少两个可与单体（b）反应的交联性官能团的交联剂，（iii）一种或更多的沸点为200℃以上的单官能加聚单体，（iv）一种或多种沸点为200℃以上的多官能加聚单体和（v）光化学引发剂，以及照射所述具有光化性光的组合物的优点在于，可以显着降低在基材上涂布组合物后除去的溶剂的量，而不会降低所得粘合剂膜的性能。

9. 发明授权

US4025348A Photosensitive resin compositions 失效
标题翻译：感光树脂组合物
公开(公告)号：US4025348A
公开(公告)日：1977-05-24
申请号：US574452
申请日：1975-05-05
申请人： Katsushige Tsukada , Asao Isobe , Toshiaki Ishimaru , Nobuyuki Hayashi , Masahiro Abo
发明人： Katsushige Tsukada , Asao Isobe , Toshiaki Ishimaru , Nobuyuki Hayashi , Masahiro Abo
IPC分类号： C08F2/50 , G03F7/032 , G03F7/038 , G03C1/68
CPC分类号： G03F7/038 , G03F7/032 , Y10S430/106 , Y10S430/115 , Y10S430/117
摘要： A photosensitive resin composition consisting essentially of (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a reactive linear high molecular weight compound having in its side chain one or two functional groups selected from the class consisting of tetrahydrofurfuryl group and N-alkoxymethylcarbamoyl group, (C) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (D) a compound having at least two epoxy groups, and (E) a potential or latent curing agent for epoxy resins. The photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence can be used in the production of printed circuit boards and the precision-processing of metals.
摘要翻译：基本上由（A）具有至少两个末端亚乙基的光聚合性不饱和化合物组成的光敏树脂组合物，（B）在其侧链中具有一个或两个选自以下的官能团的反应性线性高分子量化合物：四氢糠基和N-烷氧基甲基氨基甲酰基，（C）能够在用活性射线照射时引发上述不饱和化合物的聚合的敏化剂，（D）具有至少两个环氧基的化合物，和（E）潜在或潜在性固化剂用于环氧树脂。感光性树脂组合物可以得到耐溶剂性，耐化学性，耐热性和机械强度优异的保护膜，因此可以用于印刷电路板的制造和金属的精密加工。

10. 发明授权

US4302268A Process for preparing flexible printed-circuit board 失效
标题翻译：柔性印刷电路板的制备工艺
公开(公告)号：US4302268A
公开(公告)日：1981-11-24
申请号：US151986
申请日：1980-05-21
申请人： Shigeo Tachiki , Toshiaki Ishimaru , Nobuyuki Hayashi
发明人： Shigeo Tachiki , Toshiaki Ishimaru , Nobuyuki Hayashi
IPC分类号： G03F7/09 , H05K1/00 , H05K3/00 , H05K3/28 , B32B31/00 , B44C1/22 , C23F1/02
CPC分类号： H05K3/281 , G03F7/09 , H05K1/0393 , H05K2203/066 , H05K3/0023
摘要： A flexible printed-circuit board is covered imagewise with a polymer film as a cover layer to improve the flexibility of the board. The cover layer is formed by laminating a photoprintable, photosensitive layer supported on a flexible support to the surface of a flexible printed-circuit board, exposing the photosensitive layer imagewise to light to form a polymer image in the layer and removing the unexposed areas of the layer to leave an imaged polymer film on the surface of the board. The formation of the cover layer can be easily conducted by a continuous operation.
摘要翻译：柔性印刷电路板以聚合物膜作为覆盖层成像地覆盖以提高板的柔性。覆盖层通过将支撑在柔性载体上的可照相照相感光层层压到柔性印刷电路板的表面上而形成，将感光层成像曝光以在层中形成聚合物图像，并且去除未曝光的区域层，以在板的表面上留下成像的聚合物膜。覆盖层的形成可以通过连续操作容易地进行。

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