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    • 4. 发明申请
    • FET with Self-Aligned Back Gate
    • 具有自对准后门的FET
    • US20110316083A1
    • 2011-12-29
    • US12823798
    • 2010-06-25
    • Kangguo ChengBruce DorisAli KhakifiroozPranita Kulkarni
    • Kangguo ChengBruce DorisAli KhakifiroozPranita Kulkarni
    • H01L29/78H01L21/336
    • H01L29/66545H01L29/78648
    • A back-gated field effect transistor (FET) includes a substrate, the substrate comprising top semiconductor layer on top of a buried dielectric layer on top of a bottom semiconductor layer; a front gate located on the top semiconductor layer; a channel region located in the top semiconductor layer under the front gate; a source region located in the top semiconductor layer on a side of the channel region, and a drain region located in the top semiconductor layer on the side of the channel region opposite the source regions; and a back gate located in the bottom semiconductor layer, the back gate configured such that the back gate abuts the buried dielectric layer underneath the channel region, and is separated from the buried dielectric layer by a separation distance underneath the source region and the drain region.
    • 背栅式场效应晶体管(FET)包括衬底,该衬底包括位于底部半导体层顶部的掩埋电介质层顶部的顶部半导体层; 位于顶部半导体层上的前门; 位于前门下的顶部半导体层中的沟道区; 位于沟道区一侧的顶部半导体层中的源极区域和位于与源极区域相反的沟道区域侧的顶部半导体层中的漏极区域; 以及位于底部半导体层中的背栅,后栅配置成使得后栅极邻接沟道区下方的掩埋介电层,并且在源极区和漏极区之下与掩埋介电层分离距离 。
    • 8. 发明授权
    • FET with self-aligned back gate
    • 具有自对准背栅的FET
    • US08421156B2
    • 2013-04-16
    • US12823798
    • 2010-06-25
    • Kangguo ChengBruce DorisAli KhakifiroozPranita Kulkarni
    • Kangguo ChengBruce DorisAli KhakifiroozPranita Kulkarni
    • H01L29/66H01L29/78H01L21/336
    • H01L29/66545H01L29/78648
    • A back-gated field effect transistor (FET) includes a substrate, the substrate comprising top semiconductor layer on top of a buried dielectric layer on top of a bottom semiconductor layer; a front gate located on the top semiconductor layer; a channel region located in the top semiconductor layer under the front gate; a source region located in the top semiconductor layer on a side of the channel region, and a drain region located in the top semiconductor layer on the side of the channel region opposite the source regions; and a back gate located in the bottom semiconductor layer, the back gate configured such that the back gate abuts the buried dielectric layer underneath the channel region, and is separated from the buried dielectric layer by a separation distance underneath the source region and the drain region.
    • 背栅式场效应晶体管(FET)包括衬底,该衬底包括位于底部半导体层顶部的掩埋电介质层顶部的顶部半导体层; 位于顶部半导体层上的前门; 位于前门下的顶部半导体层中的沟道区; 位于沟道区一侧的顶部半导体层中的源极区域和位于与源极区域相反的沟道区域侧的顶部半导体层中的漏极区域; 以及位于底部半导体层中的背栅,后栅配置成使得后栅极邻接沟道区下方的掩埋介质层,并且在源极区和漏极区之下与掩埋介电层分离距离 。