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1. 发明授权

US07242077B2 Leadframe with die pad 有权
标题翻译：带芯片的引线框架
公开(公告)号：US07242077B2
公开(公告)日：2007-07-10
申请号：US11076951
申请日：2005-03-11
申请人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
发明人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
IPC分类号： H01L23/495
CPC分类号： H01L23/49551 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01079 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the sides of the die pad but separated from the tie bars. Each metal extrusion has a locking hole and a bonding surface, which is higher than the die pad. The metal extrusions are configured for improving ground connections by wire-bonding. When a bottom surface of the die pad is exposed from an encapsulant for a semiconductor package, the metal extrusions help to secure the die pad without stress transmission.
摘要翻译：引线框架包括管芯焊盘，多个连接杆，多个金属挤压件和多个引线。引线布置在管芯焊盘的周围。连接杆连接到管芯焊盘的角部，并且金属挤压件连接到管芯焊盘的侧面，但与连接条分离。每个金属挤压件具有一个锁定孔和一个高于管芯焊盘的焊接表面。金属挤压件用于通过引线接合来改善接地连接。当芯片焊盘的底表面从用于半导体封装的密封剂暴露时，金属挤压件有助于固定芯片焊盘而不产生应力传输。

2. 发明申请

US20050199986A1 Leadframe with die pad 有权
标题翻译：带芯片的引线框架
公开(公告)号：US20050199986A1
公开(公告)日：2005-09-15
申请号：US11076951
申请日：2005-03-11
申请人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
发明人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
IPC分类号： H01L23/495 , H01L23/498
CPC分类号： H01L23/49551 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01079 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the sides of the die pad but separated from the tie bars. Each metal extrusion has a locking hole and a bonding surface, which is higher than the die pad. The metal extrusions are configured for improving ground connections by wire-bonding. When a bottom surface of the die pad is exposed from an encapsulant for a semiconductor package, the metal extrusions help to secure the die pad without stress transmission.
摘要翻译：引线框架包括管芯焊盘，多个连接杆，多个金属挤压件和多个引线。引线布置在管芯焊盘的周围。连接杆连接到管芯焊盘的角部，并且金属挤压件连接到管芯焊盘的侧面，但与连接条分离。每个金属挤压件具有一个锁定孔和一个高于管芯焊盘的焊接表面。金属挤压件用于通过引线接合来改善接地连接。当芯片焊盘的底表面从用于半导体封装的密封剂暴露时，金属挤压件有助于固定芯片焊盘而不产生应力传输。

3. 发明授权

US08811009B2 Air duct and computer system with air duct 有权
标题翻译：风道和带风道的计算机系统
公开(公告)号：US08811009B2
公开(公告)日：2014-08-19
申请号：US13473676
申请日：2012-05-17
申请人： Li-Ping Chen
发明人： Li-Ping Chen
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , H05K7/20145
摘要： An air duct includes a top wall and a blocking plate. The top wall includes a limiting block, a resilient arm, and a pair of hooks. A latching slot is defined between the pair of hooks. The blocking plate is rotatably secured to the top panel and includes a body and a shaft connected to the body. The shaft is rotatably engaged in the latching slot. The limiting block and the resilient arm abut two opposite surfaces of the body and block the body preventing the blocking plate from rotating relative to the top wall. The blocking plate is adapted to abut an electronic component and guide airflow towards the electronic component.
摘要翻译：风道包括顶壁和阻挡板。顶壁包括限制块，弹性臂和一对钩。在一对钩之间限定一个锁定槽。阻挡板可旋转地固定到顶板，并且包括主体和连接到主体的轴。轴可旋转地接合在闩锁槽中。限制块和弹性臂邻接主体的两个相对表面并阻挡主体，防止阻挡板相对于顶壁旋转。阻挡板适于邻接电子部件并将气流引向电子部件。

4. 发明授权

US08587954B2 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US08587954B2
公开(公告)日：2013-11-19
申请号：US13186378
申请日：2011-07-19
申请人： Chung-Cheng Hsieh , Li-Ping Chen
发明人： Chung-Cheng Hsieh , Li-Ping Chen
IPC分类号： H05K5/00 , H05K7/02 , H05K7/10
CPC分类号： H05K7/142
摘要： An electronic device includes a bottom plate, a circuit board, and a securing assembly. The circuit board is located on the bottom plate. The securing assembly comprises a positioning member, a locking member, and a linking member. The positioning member is mounted to the bottom plate and located between the bottom plate and the circuit board. The locking member is locked to the positioning member, to secure the circuit board to the bottom plate. The linking member is located on the positioning member and connected to the circuit board and the bottom plate to electronically connect the circuit board to the bottom plate.
摘要翻译：电子设备包括底板，电路板和固定组件。电路板位于底板上。固定组件包括定位构件，锁定构件和连接构件。定位构件安装到底板并且位于底板和电路板之间。锁定构件被锁定到定位构件，以将电路板固定到底板。连接构件位于定位构件上并连接到电路板和底板，以将电路板电连接到底板。

5. 发明授权

US08567736B2 Mounting apparatus for expansion card 失效
标题翻译：扩充卡安装装置
公开(公告)号：US08567736B2
公开(公告)日：2013-10-29
申请号：US13106794
申请日：2011-05-12
申请人： Li-Ping Chen
发明人： Li-Ping Chen
IPC分类号： A47F5/00
CPC分类号： G06F1/186
摘要： A mounting apparatus includes a chassis, a mounting tray accommodated in the chassis, and a securing member. The chassis includes a bottom plate and a rear plate connected to the bottom plate. The mounting tray is secured to the rear plate. The securing member is located between the bottom plate and the mounting tray. A through hole is defined in the securing member. The mounting tray is attached to a flange of a securing plate, and the through hole receives an insertion portion of the securing plate.
摘要翻译：安装装置包括底盘，容纳在底盘中的安装托盘和固定构件。底盘包括底板和连接到底板的后板。安装托盘固定在后板上。固定构件位于底板和安装托盘之间。在固定构件中限定有通孔。安装托盘附接到固定板的凸缘，并且通孔容纳固定板的插入部分。

6. 发明授权

US08534776B2 Bezel assembly for computer 失效
标题翻译：计算机挡板组合件
公开(公告)号：US08534776B2
公开(公告)日：2013-09-17
申请号：US13364427
申请日：2012-02-02
申请人： Li-Ping Chen , Chen-Lu Fan
发明人： Li-Ping Chen , Chen-Lu Fan
IPC分类号： A47B81/00
CPC分类号： G06F1/181
摘要： A bezel assembly includes a bezel, at least one base member secured to the bezel, and at least one engaging member slidably attached to the at least one base member. The at least one base member includes a side flange substantially perpendicular to the bezel. At least one opening is defined in the side flange. The at least one engaging member includes at least one engaging protrusion. The at least one engaging member is slidable between an original position, wherein the at least one engaging protrusion engages into the at least one opening and protrudes out from an exterior surface of the side flange, and a release position, wherein the at least one engaging protrusion is disengaged from the at least one opening and retracts to an inner side of the side flange.
摘要翻译：挡板组件包括边框，固定到边框的至少一个基座构件和可滑动地附接到至少一个基座构件的至少一个接合构件。所述至少一个基座构件包括大致垂直于所述挡板的侧凸缘。至少一个开口限定在侧法兰中。所述至少一个接合构件包括至少一个接合突起。所述至少一个接合构件可以在原始位置之间滑动，其中所述至少一个接合突起接合到所述至少一个开口中并从所述侧凸缘的外表面突出并且释放位置，其中所述至少一个接合突起与至少一个开口分离，并且缩回到侧凸缘的内侧。

7. 发明授权

US08432670B2 Disk drive assembly 失效
标题翻译：磁盘驱动器总成
公开(公告)号：US08432670B2
公开(公告)日：2013-04-30
申请号：US12903076
申请日：2010-10-12
申请人： Li-Ping Chen
发明人： Li-Ping Chen
IPC分类号： G06F1/16 , H05K5/00 , H05K7/00
CPC分类号： G11B33/124
摘要： A tray assembly for mounting a disk drive includes an enclosure; and a tray mounted to the enclosure. The tray includes a tray body configured to receive the disk drive, a handle pivotably mounted to the tray body, and a securing member pivotably mounted to the tray body. The handle is configured to secure the tray body to the enclosure as the handle rotates. The securing member is configured to engage the handle as the tray body is in a secured state.
摘要翻译：用于安装磁盘驱动器的托盘组件包括外壳; 和安装到外壳的托盘。托盘包括构造成容纳盘驱动器的托盘主体，可枢转地安装到托盘主体的手柄以及可枢转地安装到托盘主体的固定构件。手柄被配置成当手柄旋转时将托盘主体固定到外壳。固定构件构造成当托盘主体处于固定状态时与手柄接合。

8. 发明授权

US08383942B2 Connecting member 失效
标题翻译：连接件
公开(公告)号：US08383942B2
公开(公告)日：2013-02-26
申请号：US12900633
申请日：2010-10-08
申请人： Chung-Cheng Hsieh , Li-Ping Chen
发明人： Chung-Cheng Hsieh , Li-Ping Chen
IPC分类号： H01B7/06
CPC分类号： H01R31/06 , H01R13/72
摘要： A connecting member includes a cable configured to transfer signal, and a resilient component secured to the cable. The cable includes a first connector and a second connector for being electronically connected to two electronic components. The resilient component is elastically deformable between a first state, in which the resilient component and the cable are contracted, spiraled about the second connector in a first direction up to the first connector, shortening a distance between the first and second connectors, and a second state, in which the resilient component and the cable are pulled away from the first connector, thus a greater distance between the first and second connectors.
摘要翻译：连接构件包括被配置为传递信号的电缆和固定到电缆的弹性部件。电缆包括用于电连接到两个电子部件的第一连接器和第二连接器。所述弹性部件可弹性变形，所述第一状态在所述弹性部件和所述电缆收缩之间沿第一方向围绕所述第二连接器螺旋，直到所述第一连接器，缩短所述第一和第二连接器之间的距离，状态，其中弹性部件和电缆被拉离第一连接器，因此第一和第二连接器之间的距离更大。

9. 发明授权

US08154865B2 Computer including a disk drive, motherboard and fan 失效
标题翻译：电脑包括磁盘驱动器，主板和风扇
公开(公告)号：US08154865B2
公开(公告)日：2012-04-10
申请号：US12695725
申请日：2010-01-28
申请人： Chung-Cheng Hsieh , Che-Yu Kuo , Chien-Fa Huang , Li-Ping Chen
发明人： Chung-Cheng Hsieh , Che-Yu Kuo , Chien-Fa Huang , Li-Ping Chen
IPC分类号： H05K7/20 , F28F7/00 , H05K5/00 , A47B77/08
CPC分类号： G06F1/20 , G06F1/187
摘要： A computer includes an enclosure, at least one disk drive, a panel and a fan. The at least one disk drive is located in the enclosure. The panel is mounted to a side of the enclosure. The panel has different material relative to the enclosure. The fan is mounted to the panel. The vibration generated from fan is indirectly transferred to the at least one disk drive.
摘要翻译：计算机包括外壳，至少一个磁盘驱动器，面板和风扇。至少一个磁盘驱动器位于机箱中。面板安装在外壳的一侧。面板相对于外壳具有不同的材质。风扇安装在面板上。从风扇产生的振动被间接传递到至少一个磁盘驱动器。

10. 发明授权

US08077459B2 Electronic device with expansion card 失效
标题翻译：带扩展卡的电子设备
公开(公告)号：US08077459B2
公开(公告)日：2011-12-13
申请号：US12721406
申请日：2010-03-10
申请人： Ya-Ni Zhang , Wen-Hu Lu , Yi-Lung Chou , Li-Ping Chen
发明人： Ya-Ni Zhang , Wen-Hu Lu , Yi-Lung Chou , Li-Ping Chen
IPC分类号： H05K7/20 , H05K7/00
CPC分类号： G06F1/20 , G06F1/186
摘要： An electronic device includes a chassis. The chassis has a bottom wall and a rear wall, substantially perpendicular to the bottom wall. A motherboard is disposed on the bottom wall, and a riser card is perpendicularly connected to the motherboard. An expansion card is substantially parallel to the motherboard and coupled to the riser card. The expansion card has a first end and a second end, and the first end is secured to the rear wall. An airflow duct is located on the bottom wall of the chassis. A supporting bar protrudes from the airflow duct. A securing member is pivotably mounted to the airflow duct. The securing member includes a pressing plate. The second end of the expansion card is clamped between the pressing plate and the supporting bar of the airflow duct.
摘要翻译：电子设备包括底盘。底盘具有基本垂直于底壁的底壁和后壁。主板设置在底壁上，并且转接卡垂直连接到主板。扩展卡基本上平行于母板并且耦合到转接卡。扩展卡具有第一端和第二端，并且第一端固定到后壁。气流管道位于底盘的底壁上。支撑杆从气流导管突出。固定构件可枢转地安装到气流管道。固定构件包括压板。扩展卡的第二端夹在压板和气流管的支撑杆之间。

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