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1. 发明申请

US20080054418A1 CHIP CARRIER WITH SIGNAL COLLECTION TAPE AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：带有信号收集带的芯片载体及其制造方法
公开(公告)号：US20080054418A1
公开(公告)日：2008-03-06
申请号：US11832174
申请日：2007-08-01
申请人： Chun-Chi Chen , Kang-Wei Ma
发明人： Chun-Chi Chen , Kang-Wei Ma
IPC分类号： H01L23/495
CPC分类号： H01L23/49527 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/484 , H01L2224/4911 , H01L2924/00014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19107 , H01L2224/45099 , H01L2224/05599
摘要： A chip carrier for carrying a chip including a carrier and at least one signal collection tape is provided. The carrier has a surface, a die pad and a plurality of inner leads surrounding the die pad, and the signal collection tape is disposed on the surface of the carrier, and is electrically connected to the chip. The signal collection tape is used to replace the conventional power ring and ground ring and to decrease the length of bonding wire, thus reducing the package size.
摘要翻译：提供了用于承载包括载体和至少一个信号收集带的芯片的芯片载体。载体具有表面，芯片焊盘和围绕芯片焊盘的多个内引线，信号采集带设置在载体的表面上，并与芯片电连接。信号采集带用于替代传统的电源环和接地环，并减少接合线的长度，从而减小封装尺寸。

2. 发明申请

US20050199986A1 Leadframe with die pad 有权
标题翻译：带芯片的引线框架
公开(公告)号：US20050199986A1
公开(公告)日：2005-09-15
申请号：US11076951
申请日：2005-03-11
申请人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
发明人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
IPC分类号： H01L23/495 , H01L23/498
CPC分类号： H01L23/49551 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01079 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the sides of the die pad but separated from the tie bars. Each metal extrusion has a locking hole and a bonding surface, which is higher than the die pad. The metal extrusions are configured for improving ground connections by wire-bonding. When a bottom surface of the die pad is exposed from an encapsulant for a semiconductor package, the metal extrusions help to secure the die pad without stress transmission.
摘要翻译：引线框架包括管芯焊盘，多个连接杆，多个金属挤压件和多个引线。引线布置在管芯焊盘的周围。连接杆连接到管芯焊盘的角部，并且金属挤压件连接到管芯焊盘的侧面，但与连接条分离。每个金属挤压件具有一个锁定孔和一个高于管芯焊盘的焊接表面。金属挤压件用于通过引线接合来改善接地连接。当芯片焊盘的底表面从用于半导体封装的密封剂暴露时，金属挤压件有助于固定芯片焊盘而不产生应力传输。

3. 发明授权

US06713836B2 Packaging structure integrating passive devices 有权
标题翻译：集成无源器件的封装结构
公开(公告)号：US06713836B2
公开(公告)日：2004-03-30
申请号：US10078317
申请日：2002-02-15
申请人： Sheng-Tsung Liu , Kang-Wei Ma
发明人： Sheng-Tsung Liu , Kang-Wei Ma
IPC分类号： H01L2900
CPC分类号： H01L23/49589 , H01L23/49541 , H01L2924/0002 , H01L2924/19105 , H01L2924/00
摘要： In a leadframe packaging structure, a leadframe includes a plurality of first leads, a plurality of second leads, and a die pad. The first leads define a chip-bonding region in which is arranged the die pad. The second leads extend and terminate into a plurality of contact pads in the chip-bonding region. An adhesive tape further is bonded on bottom surfaces of the contact pads. A chip is bonded on the die pad. At least a passive device is mounted between and electrically connects the contact pads. A plurality of bonding wires respectively connect the chip, the passive device, and the first and second leads. An encapsulant material encapsulates the chip, the passive device, and the bonding wires.
摘要翻译：在引线框封装结构中，引线框架包括多个第一引线，多个第二引线和管芯焊盘。第一引线限定芯片接合区域，其中布置有芯片焊盘。第二引线延伸并终止于芯片接合区域中的多个接触焊盘。另外粘合胶粘在接触垫的底面上。芯片焊接在芯片焊盘上。至少一个无源器件安装在接触焊盘之间并电连接接触焊盘。多个接合线分别连接芯片，无源器件以及第一和第二引线。封装材料封装芯片，无源器件和接合线。

4. 发明授权

US07242077B2 Leadframe with die pad 有权
标题翻译：带芯片的引线框架
公开(公告)号：US07242077B2
公开(公告)日：2007-07-10
申请号：US11076951
申请日：2005-03-11
申请人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
发明人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
IPC分类号： H01L23/495
CPC分类号： H01L23/49551 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01079 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the sides of the die pad but separated from the tie bars. Each metal extrusion has a locking hole and a bonding surface, which is higher than the die pad. The metal extrusions are configured for improving ground connections by wire-bonding. When a bottom surface of the die pad is exposed from an encapsulant for a semiconductor package, the metal extrusions help to secure the die pad without stress transmission.
摘要翻译：引线框架包括管芯焊盘，多个连接杆，多个金属挤压件和多个引线。引线布置在管芯焊盘的周围。连接杆连接到管芯焊盘的角部，并且金属挤压件连接到管芯焊盘的侧面，但与连接条分离。每个金属挤压件具有一个锁定孔和一个高于管芯焊盘的焊接表面。金属挤压件用于通过引线接合来改善接地连接。当芯片焊盘的底表面从用于半导体封装的密封剂暴露时，金属挤压件有助于固定芯片焊盘而不产生应力传输。

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