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1. 发明授权

US06254435B1 Edge card connector for a printed circuit board 失效
标题翻译：用于印刷电路板的边缘卡连接器
公开(公告)号：US06254435B1
公开(公告)日：2001-07-03
申请号：US09323317
申请日：1999-06-01
申请人： Kai Mook Cheong , James L. McGrath , Richard A. Nelson , Augusto P. Panella , Javier Resendez , Timothy R. McClelland
发明人： Kai Mook Cheong , James L. McGrath , Richard A. Nelson , Augusto P. Panella , Javier Resendez , Timothy R. McClelland
IPC分类号： H01R2400
CPC分类号： H01R12/721 , H01R13/6471 , H01R13/6474 , H01R13/6625
摘要： An edge card electrical connector is adapted for receiving an edge of a printed circuit board having contact pads on at least one side of the board adjacent the edge. The connector includes an elongated dielectric housing having a board-receiving face with an elongated slot for receiving the edge of the printed circuit board. A plurality of terminal-receiving cavities are spaced longitudinally of the slot along at least one side thereof and separated by transverse walls. A plurality of first and second terminals are received in the cavities. The shapes of the terminals are such as to provide excellent capacitive coupling between the first and second terminals to improve electrical performance and reduce crosstalk of the connector.
摘要翻译：边缘卡电连接器适于接收印刷电路板的边缘，所述印刷电路板在邻近边缘的板的至少一侧上具有接触焊盘。连接器包括具有板接收面的细长绝缘壳体，该板接收面具有用于容纳印刷电路板的边缘的细长槽。多个端子容纳腔沿其至少一个侧面间隔开狭槽的纵向并由横向壁分开。多个第一和第二端子容纳在空腔中。端子的形状可以提供第一和第二端子之间优异的电容耦合，以改善电性能并减少连接器的串扰。

2. 发明授权

US6095821A Card edge connector with improved reference terminals 失效
标题翻译：具有改进参考端子的卡缘连接器
公开(公告)号：US6095821A
公开(公告)日：2000-08-01
申请号：US120527
申请日：1998-07-22
申请人： Augusto P. Panella , Kai Mook Cheong , Harold Keith Lang , Irvin R. Triner , Shyh-Lin Tung , Alan S. Walse
发明人： Augusto P. Panella , Kai Mook Cheong , Harold Keith Lang , Irvin R. Triner , Shyh-Lin Tung , Alan S. Walse
IPC分类号： H01R12/50 , H01R12/72 , H01R24/00 , H01R12/00
CPC分类号： H01R12/721 , H01R23/688
摘要： A card edge connector for mounting on a circuit board and removeably receiving a circuit card includes an elongated housing defining a card receiving slot. Numerous terminal receiving cavities intersect and extend to both sides of the slot. Alternate cavities include stamped reference (ground or power) terminals and signal terminals, all having downwardly extending board contacts and upwardly extending spring arms. There are numerous similar sets of face to face contacts, each including a reference contact parallel to and substantially overlying an opposed pair of signal contacts. The upwardly extending reference terminal spring arms include oversize pad portions for reducing crosstalk by increasing coupling between the reference and signal terminals. The circuit paths to the circuit board are in an array symmetrical about the centerline of the circuit card, with parallel inner lines of circuits containing only reference contacts and outer lines of circuits containing only signal contacts.
摘要翻译：用于安装在电路板上并可移除地接收电路卡的卡缘连接器包括限定卡接收槽的细长壳体。多个端子接收腔相交并延伸到槽的两侧。备用空腔包括冲压参考（接地或电源）端子和信号端子，全部具有向下延伸的板触点和向上延伸的弹簧臂。存在许多类似的一组面对面接触，每个包括平行于并基本上覆盖相对的一对信号触点的参考触点。向上延伸的参考端子弹簧臂包括用于通过增加参考和信号端子之间的耦合来减少串扰的超大型焊盘部分。到电路板的电路路径是关于电路卡的中心线对称的阵列，其平行内部线路仅包含参考触点和仅包含信号触点的电路外线。

3. 发明授权

US07298628B2 Power delivery to base of processor 有权
标题翻译：供电到处理器基地
公开(公告)号：US07298628B2
公开(公告)日：2007-11-20
申请号：US11475405
申请日：2006-06-27
申请人： Augusto P. Panella , John E. Lopata , James L. McGrath , Arindum Dutta
发明人： Augusto P. Panella , John E. Lopata , James L. McGrath , Arindum Dutta
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K1/0262 , H05K1/141 , H05K2201/10189 , H05K2201/10325 , H05K2201/10545 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734
摘要： A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.
摘要翻译：安装到电路板的处理器通过在处理器的与电路板相对的一侧安装用于处理器的电压调节器模块，通过低电感电路板迹线提供调节电压。来自稳压器的电流通过调节器和处理器之间的一个或多个导体从一侧延伸到另一侧而提供给处理器。通过将电压调节器放置在靠近负载的位置，减少了引脚长度的电感。通过将电压调节器移动到相对侧，可以增加电路板处理器侧的电路板空间。

4. 发明授权

US06936917B2 Power delivery connector for integrated circuits utilizing integrated capacitors 有权
标题翻译：使用集成电容器的集成电路的电力输送连接器
公开(公告)号：US06936917B2
公开(公告)日：2005-08-30
申请号：US10254496
申请日：2002-09-25
申请人： John E. Lopata , Augusto P. Panella , Arindum Dutta , James L. McGrath
发明人： John E. Lopata , Augusto P. Panella , Arindum Dutta , James L. McGrath
IPC分类号： H01L23/12 , H01L23/32 , H01L23/36 , H01L23/498 , H01L23/50 , H01L23/52 , H01R13/66 , H01R33/76 , H01R33/945 , H05K7/10 , H01G4/228
CPC分类号： H01L23/49805 , H01L23/50 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01021 , H01L2924/01077 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15331 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R13/6625 , H05K7/1092 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents.
摘要翻译：用于向集成电路递送电力的系统包括位于形成为IC的插座或框架的连接器中的去耦电容。电力输送系统采用集成到连接器中的电力储存器的形式，从而不需要在安装在IC连接到的电路板上的分立电容器中形成复杂且昂贵的电力迹线。该系统包括连接器，该连接器采用装配在IC上的盖构件的形式，并且其包含容纳IC的一部分的凹部。盖构件包括设置在其中的至少一对间隔开的电容器板。向板提供电，使其成为电容器，并且板形成有与IC接触的多个端子，使得板可以选择性地放电到IC，从而为其提供操作和浪涌电流。

5. 发明授权

US06885563B2 Power delivery and other systems for integrated circuits 有权
标题翻译：集成电路的供电和其他系统
公开(公告)号：US06885563B2
公开(公告)日：2005-04-26
申请号：US10255376
申请日：2002-09-26
申请人： Augusto P. Panella , James L. McGrath
发明人： Augusto P. Panella , James L. McGrath
IPC分类号： H01L23/12 , H01L23/32 , H01L23/36 , H01L23/498 , H01L23/50 , H01L23/52 , H01R13/66 , H01R33/76 , H01R33/945 , H05K7/10 , H05K1/11 , H05K1/14
CPC分类号： H01L23/49805 , H01L23/50 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01021 , H01L2924/01077 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15331 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R13/6625 , H05K7/1092 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Systems for power delivery, signal transfer, package design, thermal management, and electromagnetic interference (“EMI”) control are provided to support an integrated circuit (“IC”). The power delivery system includes a power supply, a voltage regulator module and a decoupling capacitance in the form of discrete and/or integral capacitors. The voltage regulator module and decoupling capacitance are located in a connector that may be formed as a cover, socket or a frame for the IC. The power delivery system delivers power to the IC along top, bottom or sides of the IC. The signal transfer system couples signals from the IC to one or more circuits on a circuit board. The package design system for the IC permits signals and/or power to be coupled to selected sides of the IC at connections outside, flush with, recessed or inside the IC package. The package design system also permits the transferred signals to have different frequencies, such as high and low frequencies, and to utilize different types of signal interfaces, such as galvanic, capacitive or the like. The thermal management system utilizes a heat sink, a fan and/or a heat spreader to dissipate heat generated by the IC and/or voltage regulator module. The EMI control system blocks EMI generated by the IC.
摘要翻译：提供功率传输，信号传输，封装设计，热管理和电磁干扰（“EMI”）控制的系统以支持集成电路（“IC”）。电力输送系统包括电源，电压调节器模块和离散和/或积分电容器形式的去耦电容。电压调节器模块和去耦电容位于可以形成为IC的盖，插座或框架的连接器中。电力输送系统通过IC的顶部，底部或侧面向IC提供电力。信号传送系统将来自IC的信号耦合到电路板上的一个或多个电路。 IC的封装设计系统允许信号和/或功率在IC封装的外部，齐平，凹入或内部的连接处耦合到IC的选定侧。封装设计系统还允许传送的信号具有不同的频率，例如高频和低频，并且可以利用不同类型的信号接口，例如电流，电容等。热管理系统利用散热器，风扇和/或散热器来散发由IC和/或电压调节器模块产生的热量。 EMI控制系统阻止IC产生的EMI。

6. 发明授权

US06853559B2 Thermal management of power delivery systems for integrated circuits 有权
标题翻译：集成电路供电系统的热管理
公开(公告)号：US06853559B2
公开(公告)日：2005-02-08
申请号：US10255350
申请日：2002-09-26
申请人： Augusto P. Panella , Arindum Dutta , James L. McGrath
发明人： Augusto P. Panella , Arindum Dutta , James L. McGrath
IPC分类号： H01L23/12 , H01L23/32 , H01L23/36 , H01L23/498 , H01L23/50 , H01L23/52 , H01R13/66 , H01R33/76 , H01R33/945 , H05K7/10 , H05K1/18
CPC分类号： H01L23/49805 , H01L23/50 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01021 , H01L2924/01077 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15331 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R13/6625 , H05K7/1092 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The power reservoir is integrated into a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least one opening that opens up to a operational surface of the integrated circuit. A heat-dissapating device, such as a finned heat sink or the like is supported by the cover member and extends through its opening into contact with a heat-generating surface of the integrated circuit to cool it during operation.
摘要翻译：用于向集成电路递送电力的系统包括位于形成为IC的插座或框架的连接器中的去耦电容。电力输送系统采用集成到连接器中的电力储存器的形式，从而不需要在安装在IC连接到的电路板上的分立电容器中形成复杂且昂贵的电力迹线。电力储存器集成到盖子中，该盖件装配在IC上并且包含容纳IC的一部分的凹部。盖构件包括至少一个开口，其开口到集成电路的操作表面。散热片等散热装置由盖构件支撑，并且通过其开口延伸，与集成电路的发热表面接触，以在操作期间使其冷却。

7. 发明授权

US06767252B2 High speed differential signal edge card connector and circuit board layouts therefor 失效
标题翻译：高速差分信号边缘卡连接器和电路板布局
公开(公告)号：US06767252B2
公开(公告)日：2004-07-27
申请号：US10267443
申请日：2002-10-09
申请人： James L. McGrath , James P. Capadona , Daniel B. McGowan , Augusto P. Panella
发明人： James L. McGrath , James P. Capadona , Daniel B. McGowan , Augusto P. Panella
IPC分类号： H01R2370
CPC分类号： H05K1/117 , H01R12/721 , H01R13/6585 , H05K1/0219 , H05K2201/093 , H05K2201/0949 , H05K2201/0969 , H05K2201/09709 , H05K2201/09727
摘要： A differential signal connector that is used for edge card application has a plurality of differential signal terminals and associated ground terminals arranged in “triplets”, i.e., distinct sets of three conductive terminals, each such triplet including a pair of differential signal terminals and one associated ground terminal. The ground terminal is flanked by the two differential signal terminals and each triplet is spaced apart from an adjacent triplet by a spacing which is greater than any single spacing between adjacent terminals within a triplet. Circuit boards to which such a connector is mounted are also disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet. This reduces the capacitance of the signal vias and thereby increases the impedance of the circuit board within the launch area to lessen impedance discontinuities in the connector-circuit board interface.
摘要翻译：用于边缘卡应用的差分信号连接器具有多个差分信号端子和以“三联体”排列的相关联的接地端子，即，三组导电端子的不同组合，每个这样的三联组件包括一对差分信号端子和一个相关联的接地端。接地端子侧面是两个差分信号端子，每个三极管与相邻的三通线隔开一个间隔，该间隔大于三线态内的相邻端子之间的任何单个间隔。还公开了安装这种连接器的电路板，并且它们具有特定的端接迹线图案，通常采用延伸穿过电路板的电镀通孔的形式。这些通孔被布置成三角形图案，并且电路板的接地参考平面设置有空隙，一个空隙相关联并且包围一对单个三端口的差分信号通路。这减小了信号通路的电容，从而增加了发射区域内的电路板的阻抗，以减少连接器 - 电路板接口中的阻抗不连续性。

8. 发明授权

US07095619B2 Power delivery to base of processor 有权
公开(公告)号：US07095619B2
公开(公告)日：2006-08-22
申请号：US10383028
申请日：2003-02-25
申请人： Augusto P. Panella , John E. Lopata , James L. McGrath , Arindum Dutta
发明人： Augusto P. Panella , John E. Lopata , James L. McGrath , Arindum Dutta
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K1/0262 , H05K1/141 , H05K2201/10189 , H05K2201/10325 , H05K2201/10545 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734
摘要： A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.

9. 发明授权

US07568960B2 Capacitive signal connector 失效
标题翻译：电容信号连接器
公开(公告)号：US07568960B2
公开(公告)日：2009-08-04
申请号：US12105976
申请日：2008-04-18
申请人： Augusto P. Panella , Robert D. Malucci
发明人： Augusto P. Panella , Robert D. Malucci
IPC分类号： G11C7/00
CPC分类号： H01R13/03 , H01R13/6625
摘要： The present disclosure is directed to connectors and methods for passing signals through capacitive coupling and electron tunneling. The connectors according to the present disclosure can include contacts that have a dielectric film or coating applied at least at a contact interface area where the contacts engage with the contacts of a complementary mating connector. The contacts of the either or both of the connector and complementary connector can be coated with a dielectric film. The dielectric film can be selected from metal oxides and can be applied using known methods such as vapor deposition methods, oxidative methods, plating methods and adhesive coating methods. Performance parameters such as capacitance and resistance can be selected by selecting the material for the film and the thickness of the dielectric film and provides a contrast between the requirements for high frequency signal transfer using capacitive coupling and electron tunneling versus traditional metallic contact.
摘要翻译：本公开涉及用于通过电容耦合和电子隧道传递信号的连接器和方法。根据本公开的连接器可以包括具有至少在触点接合区域处施加的电介质膜或涂层的触点，其中触点与互补配合连接器的触点接合。连接器和互补连接器中的一个或两个的触点可以涂覆有电介质膜。电介质膜可以选自金属氧化物，并且可以使用已知的方法例如气相沉积法，氧化法，电镀法和粘合剂涂布法进行应用。可以通过选择膜的材料和电介质膜的厚度来选择诸如电容和电阻的性能参数，并且提供使用电容耦合和电子隧道与传统金属接触的高频信号传输的要求之间的对比。

10. 发明授权

US06362972B1 Contactless interconnection system 有权
标题翻译：非接触式互连系统
公开(公告)号：US06362972B1
公开(公告)日：2002-03-26
申请号：US09548636
申请日：2000-04-13
申请人： Augusto P. Panella
发明人： Augusto P. Panella
IPC分类号： H05K702
CPC分类号： H01L23/48 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/10253 , H01L2924/19041 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A contactless interconnecting system is provided between a computer chip package and a circuit board. The system includes a computer chip package having a silicon wafer mounted on a support structure which includes a wall with a substantially planar upper surface. The wall is fabricated of a dielectric material. A pattern of discrete terminal lands are disposed on the upper surface of the wall and are electrically coupled to the silicon wafer. A circuit board is juxtaposed below the wall of the chip package and includes a substantially planar upper surface having a pattern of discrete circuit pads aligned with the terminal lands.
摘要翻译：在计算机芯片封装和电路板之间提供非接触式互连系统。该系统包括具有安装在支撑结构上的硅晶片的计算机芯片封装，其包括具有基本平坦的上表面的壁。壁由电介质材料制成。离散端子台面的图案设置在壁的上表面上并且电耦合到硅晶片。电路板并置在芯片封装的壁下方，并且包括具有与端子焊盘对准的分立电路板的图案的基本平坦的上表面。

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