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1. 发明授权

US07280435B2 Switching circuitry for reconfigurable arrays of sensor elements 有权
标题翻译：用于可重构阵列的传感器元件的开关电路
公开(公告)号：US07280435B2
公开(公告)日：2007-10-09
申请号：US10978196
申请日：2004-10-29
申请人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , David Martin Mills
发明人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , David Martin Mills
IPC分类号： H04R17/00 , A61B8/00
CPC分类号： H03M11/00 , B06B1/0207 , B06B1/0292 , G01N29/262 , G01N2291/044 , G01N2291/106
摘要： A device comprising an array of sensors that are reconfigurable by means of a switching network. The sensors may be optical, thermal or pressure sensors or ultrasonic transducers. More specifically, the device comprises: a multiplicity of sensor elements; a plurality of bus lines; a set of access switches for selectively connecting a set of the sensor elements in a row to a bus line, one of the access switches being connected to a first sensor element; a multiplicity of sets of matrix switches, each of the sets of matrix switches selectively connecting a respective sensor element of the multiplicity of sensor elements to a respective set of adjacent sensor elements, one of the matrix switches being connected to the first sensor element and to a second sensor element that is not a member of the set of sensor elements; and control circuitry that controls the access switches and the matrix switches in accordance with a selected switching configuration such that the first sensor element is connected to the bus line via said one access switch, while at the same time the second sensor element is connected to said one access switch via said one matrix switch.
摘要翻译：一种包括可通过交换网络重新配置的传感器阵列的设备。传感器可以是光学，热或压力传感器或超声换能器。更具体地，该装置包括：多个传感器元件; 多条总线; 一组接入开关，用于选择性地将一行中的传感器元件连接到总线，其中一个接入开关连接到第一传感器元件; 多个矩阵开关组，每组矩阵开关选择性地将多个传感器元件的相应传感器元件连接到相应的一组相邻传感器元件，矩阵开关中的一个连接到第一传感器元件，并且第二传感器元件，其不是该组传感器元件的构件; 以及控制电路，其根据选择的开关配置来控制接入开关和矩阵开关，使得第一传感器元件经由所述一个接入开关连接到总线，同时第二传感器元件连接到所述一个接入开关经由所述一个矩阵开关。

2. 发明授权

US07443765B2 Reconfigurable linear sensor arrays for reduced channel count 有权
标题翻译：可重构线性传感器阵列，减少通道数
公开(公告)号：US07443765B2
公开(公告)日：2008-10-28
申请号：US11018238
申请日：2004-12-21
申请人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , Bruno Hans Haider , Kenneth Wayne Rigby
发明人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , Bruno Hans Haider , Kenneth Wayne Rigby
IPC分类号： G10K11/00 , H04R17/00
CPC分类号： B06B1/0292 , A61B2562/028 , G01N29/0609 , G01N29/069 , G01N29/245 , G01N2291/0423 , G01N2291/106
摘要： A reconfigurable linear array of sensors (e.g., optical, thermal, pressure, ultrasonic). The reconfigurability allows the size and spacing of the sensor elements to be a function of the distance from the beam center. This feature improves performance for imaging systems having a limited channel count. The improved performance, for applications in which multiple transmit focal zones are employed, arises from the ability to adjust the aperture for a particular depth.
摘要翻译：传感器的可重构线性阵列（例如光学，热学，压力，超声波）。可重新配置允许传感器元件的尺寸和间距是与梁中心距离的函数。该功能提高了具有有限通道数的成像系统的性能。对于使用多个透射聚焦区域的应用而言，改进的性能来自于为特定深度调整孔径的能力。

3. 发明授权

US07353056B2 Optimized switching configurations for reconfigurable arrays of sensor elements 失效
标题翻译：用于可重构阵列传感器元件的优化开关配置
公开(公告)号：US07353056B2
公开(公告)日：2008-04-01
申请号：US10978175
申请日：2004-10-29
申请人： Christopher Robert Hazard , Robert Gideon Wodnicki , Rayette Ann Fisher , Kai E. Thomenius , Lowell Scott Smith , David Martin Mills
发明人： Christopher Robert Hazard , Robert Gideon Wodnicki , Rayette Ann Fisher , Kai E. Thomenius , Lowell Scott Smith , David Martin Mills
IPC分类号： A61B5/05 , A61B8/00
CPC分类号： G10K11/34 , A61B2562/028 , B06B1/0292 , G01S7/52046 , G01S15/8925
摘要： The reconfigurable ultrasound array disclosed herein is one that allows groups of subelements to be connected together dynamically so that the shape of the resulting element can be made to match the shape of the wave front. This can lead to improved performance and/or reduced channel count. Reconfigurability can be achieved using a switching network. A methodology and an algorithm are disclosed that allows the performance of this switching network to be improved by properly choosing the configuration of the switching network.
摘要翻译：本文公开的可重构超声波阵列是允许一组子元件动态地连接在一起的结构，使得所得元件的形状可以与波前的形状相匹配。这可以导致改进的性能和/或减少的通道数。可以使用交换网络实现可重构性。公开了一种通过适当选择交换网络的配置来改善该交换网络的性能的方法和算法。

4. 发明授权

US08659148B2 Tileable sensor array 有权
标题翻译：可分层传感器阵列
公开(公告)号：US08659148B2
公开(公告)日：2014-02-25
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
IPC分类号： H01L23/34
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译：提出了一种形成可瓦片检测器阵列的方法。该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫，传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块在第二基板上形成可瓦片检测器阵列。

5. 发明申请

US20080296708A1 Integrated sensor arrays and method for making and using such arrays 审中-公开
标题翻译：集成传感器阵列和制造和使用这种阵列的方法
公开(公告)号：US20080296708A1
公开(公告)日：2008-12-04
申请号：US11809165
申请日：2007-05-31
申请人： Robert Gideon Wodnicki , Wei-Cheng Tian , Kevin Matthew Durocher , Charles Gerard Woychik , Rayette Ann Fisher , Stacey Joy Kennerly , Lowell Scott Smith , Douglas Glenn Wildes
发明人： Robert Gideon Wodnicki , Wei-Cheng Tian , Kevin Matthew Durocher , Charles Gerard Woychik , Rayette Ann Fisher , Stacey Joy Kennerly , Lowell Scott Smith , Douglas Glenn Wildes
IPC分类号： H01L21/50 , H01L23/00
CPC分类号： G01N29/2406 , B06B1/0292 , G01N2291/106 , H01L2224/04105 , H01L2224/24 , H01L2224/73267 , H01L2224/82
摘要： The present invention relates to a method for making an integrated sensor comprising providing a sensor array fabricated on a top surface of a bulk silicon wafer having a top surface and a bottom surface, and comprising a plurality of sensors fabricated on the top surface of the bulk silicon wafer. The method further comprises coupling an SOI wafer to the top surface of the bulk silicon wafer, thinning the back surface of the bulk silicon wafer, coupling a plurality of integrated circuit die to the back surface of the bulk silicon wafer, and removing the SOI wafer from the top surface of the bulk silicon wafer.
摘要翻译：本发明涉及一种用于制造集成传感器的方法，其包括提供制造在具有顶表面和底表面的体硅晶片的顶表面上的传感器阵列，并且包括在本体的顶表面上制造的多个传感器硅晶片。该方法还包括将SOI晶片耦合到体硅晶片的顶表面，使体硅晶片的背表面变薄，将多个集成电路管芯耦合到体硅晶片的背面，以及去除SOI晶片从体硅晶片的顶表面。

6. 发明申请

US20120133001A1 TILEABLE SENSOR ARRAY 有权
标题翻译：可传感器阵列
公开(公告)号：US20120133001A1
公开(公告)日：2012-05-31
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
IPC分类号： H01L27/00 , H01L31/18 , H01L21/60
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译：提出了一种形成可瓦片检测器阵列的方法。该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫，传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块在第二基板上形成可瓦片检测器阵列。

7. 发明授权

US07892176B2 Monitoring or imaging system with interconnect structure for large area sensor array 有权
标题翻译：具有互连结构的大面积传感器阵列的监控或成像系统
公开(公告)号：US07892176B2
公开(公告)日：2011-02-22
申请号：US11743391
申请日：2007-05-02
申请人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
发明人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
IPC分类号： A61B8/14
CPC分类号： H01L27/0207 , A61B8/0833 , A61B8/4483 , B06B1/0629 , H01L27/11803 , H01L27/14634
摘要： An ultrasonic monitoring system is formed with a probe unit. In one example an array of transducer cells is arranged in rows and columns formed along a first plane with a first pitch along a first direction. An integrated circuit including an array of circuit cells is formed along a second plane parallel to the first plane. The circuit cells are spaced apart along the first direction at a second pitch smaller than the first pitch. A first of the transducer cells is vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto. A second of the transducer cells is offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell. A connection subsystem is positioned between the array of transducer cells and the array of circuit cells, configured to form connection of the first transducer cell to the first circuit cell and connection of the second transducer cell with the second circuit cell.
摘要翻译：用探针单元形成超声波监测系统。在一个示例中，换能器单元的阵列沿着沿着第一方向以第一间距沿第一平面形成的行和列布置。包括电路单元阵列的集成电路沿与第一平面平行的第二平面形成。电路单元沿着第一方向以比第一间距小的第二间距分开。换能器单元中的第一个沿着垂直于一个平面的方向与第一个电路单元垂直对齐并且具有与其的连接。第二个换能器单元相对于第二电路单元的位置偏离垂直对准，以便不覆盖第二电路单元。连接子系统位于换能器单元阵列和电路单元阵列之间，被配置为形成第一换能器单元与第一电路单元的连接以及第二换能器单元与第二电路单元的连接。

8. 发明申请

US20080315331A1 ULTRASOUND SYSTEM WITH THROUGH VIA INTERCONNECT STRUCTURE 审中-公开
标题翻译：超声波系统通过互连结构
公开(公告)号：US20080315331A1
公开(公告)日：2008-12-25
申请号：US11767554
申请日：2007-06-25
申请人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
发明人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
IPC分类号： H01L21/00 , H01L27/14
CPC分类号： B06B1/0629 , G01S7/52079 , G01S15/8925 , G01S15/8927 , G10K11/004
摘要： An ultrasound monitoring system. In one embodiment, an array of transducer cells is formed along a first plane and an integrated circuit structure, formed along a second plane parallel to the first plane, includes an array of circuit cells. A connector provides electrical connections between the array of transducer cells and the array of circuit cells, and an interconnection structure is connected to transfer signals between the circuit cells and processing and control circuitry. The integrated circuit structure includes a semiconductor substrate and a plurality of conductive through-die vias formed through the substrate to provide Input/Output (I/O) connections between the transducer cells and the interconnection structure. The monitoring system may be configured as an imaging system and the processing and control circuitry may be external to the probe unit.
摘要翻译：超声波监测系统。在一个实施例中，沿着第一平面形成一组换能器单元，并且沿着平行于第一平面的第二平面形成的集成电路结构包括电路单元阵列。连接器提供换能器阵列阵列与电路单元阵列之间的电连接，并且连接互连结构以在电路单元和处理和控制电路之间传送信号。集成电路结构包括半导体衬底和通过衬底形成的多个导电贯通管道通孔，以在换能器单元和互连结构之间提供输入/输出（I / O）连接。监视系统可以被配置为成像系统，并且处理和控制电路可以在探针单元的外部。

9. 发明申请

US20080273424A1 MONITORING OR IMAGING SYSTEM WITH INTERCONNECT STRUCTURE FOR LARGE AREA SENSOR ARRAY 有权
标题翻译：用于大面积传感器阵列的互连结构的监测或成像系统
公开(公告)号：US20080273424A1
公开(公告)日：2008-11-06
申请号：US11743391
申请日：2007-05-02
申请人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
发明人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
IPC分类号： H02N2/00
CPC分类号： H01L27/0207 , A61B8/0833 , A61B8/4483 , B06B1/0629 , H01L27/11803 , H01L27/14634
摘要： An ultrasonic monitoring system is formed with a probe unit. In one example an array of transducer cells is arranged in rows and columns formed along a first plane with a first pitch along a first direction. An integrated circuit including an array of circuit cells is formed along a second plane parallel to the first plane. The circuit cells are spaced apart along the first direction at a second pitch smaller than the first pitch. A first of the transducer cells is vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto. A second of the transducer cells is offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell. A connection subsystem is positioned between the array of transducer cells and the array of circuit cells, configured to form connection of the first transducer cell to the first circuit cell and connection of the second transducer cell with the second circuit cell.
摘要翻译：用探针单元形成超声波监测系统。在一个示例中，换能器单元的阵列沿着沿着第一方向以第一间距沿第一平面形成的行和列布置。包括电路单元阵列的集成电路沿与第一平面平行的第二平面形成。电路单元沿着第一方向以比第一间距小的第二间距分开。换能器单元中的第一个沿着垂直于一个平面的方向与第一个电路单元垂直对齐并且具有与其的连接。第二个换能器单元相对于第二电路单元的位置偏离垂直对准，以便不覆盖第二电路单元。连接子系统位于换能器单元阵列和电路单元阵列之间，被配置为形成第一换能器单元与第一电路单元的连接以及第二换能器单元与第二电路单元的连接。

10. 发明授权

US07451651B2 Modular sensor assembly and methods of fabricating the same 有权
公开(公告)号：US07451651B2
公开(公告)日：2008-11-18
申请号：US11636822
申请日：2006-12-11
申请人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
发明人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
IPC分类号： G01N29/00
CPC分类号： G01D11/245 , B06B1/0292 , B06B1/0629 , G01N29/2437 , G01N2291/106 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/16145 , H01L2224/48091 , H01L2224/73257 , H01L2924/00014 , H01L2924/01322 , Y10T29/49004 , Y10T29/49007 , H01L2924/00 , H01L2224/05099
摘要： A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.

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