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1. 发明授权

US07280435B2 Switching circuitry for reconfigurable arrays of sensor elements 有权
标题翻译：用于可重构阵列的传感器元件的开关电路
公开(公告)号：US07280435B2
公开(公告)日：2007-10-09
申请号：US10978196
申请日：2004-10-29
申请人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , David Martin Mills
发明人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , David Martin Mills
IPC分类号： H04R17/00 , A61B8/00
CPC分类号： H03M11/00 , B06B1/0207 , B06B1/0292 , G01N29/262 , G01N2291/044 , G01N2291/106
摘要： A device comprising an array of sensors that are reconfigurable by means of a switching network. The sensors may be optical, thermal or pressure sensors or ultrasonic transducers. More specifically, the device comprises: a multiplicity of sensor elements; a plurality of bus lines; a set of access switches for selectively connecting a set of the sensor elements in a row to a bus line, one of the access switches being connected to a first sensor element; a multiplicity of sets of matrix switches, each of the sets of matrix switches selectively connecting a respective sensor element of the multiplicity of sensor elements to a respective set of adjacent sensor elements, one of the matrix switches being connected to the first sensor element and to a second sensor element that is not a member of the set of sensor elements; and control circuitry that controls the access switches and the matrix switches in accordance with a selected switching configuration such that the first sensor element is connected to the bus line via said one access switch, while at the same time the second sensor element is connected to said one access switch via said one matrix switch.
摘要翻译：一种包括可通过交换网络重新配置的传感器阵列的设备。传感器可以是光学，热或压力传感器或超声换能器。更具体地，该装置包括：多个传感器元件; 多条总线; 一组接入开关，用于选择性地将一行中的传感器元件连接到总线，其中一个接入开关连接到第一传感器元件; 多个矩阵开关组，每组矩阵开关选择性地将多个传感器元件的相应传感器元件连接到相应的一组相邻传感器元件，矩阵开关中的一个连接到第一传感器元件，并且第二传感器元件，其不是该组传感器元件的构件; 以及控制电路，其根据选择的开关配置来控制接入开关和矩阵开关，使得第一传感器元件经由所述一个接入开关连接到总线，同时第二传感器元件连接到所述一个接入开关经由所述一个矩阵开关。

2. 发明授权

US07353056B2 Optimized switching configurations for reconfigurable arrays of sensor elements 失效
标题翻译：用于可重构阵列传感器元件的优化开关配置
公开(公告)号：US07353056B2
公开(公告)日：2008-04-01
申请号：US10978175
申请日：2004-10-29
申请人： Christopher Robert Hazard , Robert Gideon Wodnicki , Rayette Ann Fisher , Kai E. Thomenius , Lowell Scott Smith , David Martin Mills
发明人： Christopher Robert Hazard , Robert Gideon Wodnicki , Rayette Ann Fisher , Kai E. Thomenius , Lowell Scott Smith , David Martin Mills
IPC分类号： A61B5/05 , A61B8/00
CPC分类号： G10K11/34 , A61B2562/028 , B06B1/0292 , G01S7/52046 , G01S15/8925
摘要： The reconfigurable ultrasound array disclosed herein is one that allows groups of subelements to be connected together dynamically so that the shape of the resulting element can be made to match the shape of the wave front. This can lead to improved performance and/or reduced channel count. Reconfigurability can be achieved using a switching network. A methodology and an algorithm are disclosed that allows the performance of this switching network to be improved by properly choosing the configuration of the switching network.
摘要翻译：本文公开的可重构超声波阵列是允许一组子元件动态地连接在一起的结构，使得所得元件的形状可以与波前的形状相匹配。这可以导致改进的性能和/或减少的通道数。可以使用交换网络实现可重构性。公开了一种通过适当选择交换网络的配置来改善该交换网络的性能的方法和算法。

3. 发明授权

US07451651B2 Modular sensor assembly and methods of fabricating the same 有权
公开(公告)号：US07451651B2
公开(公告)日：2008-11-18
申请号：US11636822
申请日：2006-12-11
申请人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
发明人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
IPC分类号： G01N29/00
CPC分类号： G01D11/245 , B06B1/0292 , B06B1/0629 , G01N29/2437 , G01N2291/106 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/16145 , H01L2224/48091 , H01L2224/73257 , H01L2924/00014 , H01L2924/01322 , Y10T29/49004 , Y10T29/49007 , H01L2924/00 , H01L2224/05099
摘要： A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.

4. 发明授权

US07892176B2 Monitoring or imaging system with interconnect structure for large area sensor array 有权
标题翻译：具有互连结构的大面积传感器阵列的监控或成像系统
公开(公告)号：US07892176B2
公开(公告)日：2011-02-22
申请号：US11743391
申请日：2007-05-02
申请人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
发明人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
IPC分类号： A61B8/14
CPC分类号： H01L27/0207 , A61B8/0833 , A61B8/4483 , B06B1/0629 , H01L27/11803 , H01L27/14634
摘要： An ultrasonic monitoring system is formed with a probe unit. In one example an array of transducer cells is arranged in rows and columns formed along a first plane with a first pitch along a first direction. An integrated circuit including an array of circuit cells is formed along a second plane parallel to the first plane. The circuit cells are spaced apart along the first direction at a second pitch smaller than the first pitch. A first of the transducer cells is vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto. A second of the transducer cells is offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell. A connection subsystem is positioned between the array of transducer cells and the array of circuit cells, configured to form connection of the first transducer cell to the first circuit cell and connection of the second transducer cell with the second circuit cell.
摘要翻译：用探针单元形成超声波监测系统。在一个示例中，换能器单元的阵列沿着沿着第一方向以第一间距沿第一平面形成的行和列布置。包括电路单元阵列的集成电路沿与第一平面平行的第二平面形成。电路单元沿着第一方向以比第一间距小的第二间距分开。换能器单元中的第一个沿着垂直于一个平面的方向与第一个电路单元垂直对齐并且具有与其的连接。第二个换能器单元相对于第二电路单元的位置偏离垂直对准，以便不覆盖第二电路单元。连接子系统位于换能器单元阵列和电路单元阵列之间，被配置为形成第一换能器单元与第一电路单元的连接以及第二换能器单元与第二电路单元的连接。

5. 发明申请

US20080315331A1 ULTRASOUND SYSTEM WITH THROUGH VIA INTERCONNECT STRUCTURE 审中-公开
标题翻译：超声波系统通过互连结构
公开(公告)号：US20080315331A1
公开(公告)日：2008-12-25
申请号：US11767554
申请日：2007-06-25
申请人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
发明人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
IPC分类号： H01L21/00 , H01L27/14
CPC分类号： B06B1/0629 , G01S7/52079 , G01S15/8925 , G01S15/8927 , G10K11/004
摘要： An ultrasound monitoring system. In one embodiment, an array of transducer cells is formed along a first plane and an integrated circuit structure, formed along a second plane parallel to the first plane, includes an array of circuit cells. A connector provides electrical connections between the array of transducer cells and the array of circuit cells, and an interconnection structure is connected to transfer signals between the circuit cells and processing and control circuitry. The integrated circuit structure includes a semiconductor substrate and a plurality of conductive through-die vias formed through the substrate to provide Input/Output (I/O) connections between the transducer cells and the interconnection structure. The monitoring system may be configured as an imaging system and the processing and control circuitry may be external to the probe unit.
摘要翻译：超声波监测系统。在一个实施例中，沿着第一平面形成一组换能器单元，并且沿着平行于第一平面的第二平面形成的集成电路结构包括电路单元阵列。连接器提供换能器阵列阵列与电路单元阵列之间的电连接，并且连接互连结构以在电路单元和处理和控制电路之间传送信号。集成电路结构包括半导体衬底和通过衬底形成的多个导电贯通管道通孔，以在换能器单元和互连结构之间提供输入/输出（I / O）连接。监视系统可以被配置为成像系统，并且处理和控制电路可以在探针单元的外部。

6. 发明申请

US20080273424A1 MONITORING OR IMAGING SYSTEM WITH INTERCONNECT STRUCTURE FOR LARGE AREA SENSOR ARRAY 有权
标题翻译：用于大面积传感器阵列的互连结构的监测或成像系统
公开(公告)号：US20080273424A1
公开(公告)日：2008-11-06
申请号：US11743391
申请日：2007-05-02
申请人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
发明人： Robert Gideon Wodnicki , David Martin Mills , Rayette Ann Fisher , Charles Gerard Woychik
IPC分类号： H02N2/00
CPC分类号： H01L27/0207 , A61B8/0833 , A61B8/4483 , B06B1/0629 , H01L27/11803 , H01L27/14634
摘要： An ultrasonic monitoring system is formed with a probe unit. In one example an array of transducer cells is arranged in rows and columns formed along a first plane with a first pitch along a first direction. An integrated circuit including an array of circuit cells is formed along a second plane parallel to the first plane. The circuit cells are spaced apart along the first direction at a second pitch smaller than the first pitch. A first of the transducer cells is vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto. A second of the transducer cells is offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell. A connection subsystem is positioned between the array of transducer cells and the array of circuit cells, configured to form connection of the first transducer cell to the first circuit cell and connection of the second transducer cell with the second circuit cell.
摘要翻译：用探针单元形成超声波监测系统。在一个示例中，换能器单元的阵列沿着沿着第一方向以第一间距沿第一平面形成的行和列布置。包括电路单元阵列的集成电路沿与第一平面平行的第二平面形成。电路单元沿着第一方向以比第一间距小的第二间距分开。换能器单元中的第一个沿着垂直于一个平面的方向与第一个电路单元垂直对齐并且具有与其的连接。第二个换能器单元相对于第二电路单元的位置偏离垂直对准，以便不覆盖第二电路单元。连接子系统位于换能器单元阵列和电路单元阵列之间，被配置为形成第一换能器单元与第一电路单元的连接以及第二换能器单元与第二电路单元的连接。

7. 发明申请

US20080134793A1 Modular sensor assembly and methods of fabricating the same 有权
标题翻译：模块化传感器组件及其制造方法
公开(公告)号：US20080134793A1
公开(公告)日：2008-06-12
申请号：US11636822
申请日：2006-12-11
申请人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
发明人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
IPC分类号： G01D5/12 , G01H11/00 , G01H11/08 , G01N29/22 , G01R3/00
CPC分类号： G01D11/245 , B06B1/0292 , B06B1/0629 , G01N29/2437 , G01N2291/106 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/16145 , H01L2224/48091 , H01L2224/73257 , H01L2924/00014 , H01L2924/01322 , Y10T29/49004 , Y10T29/49007 , H01L2924/00 , H01L2224/05099
摘要： A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.
摘要翻译：提供了模块化传感器组件和制造模块化传感器组件的方法。模块化传感器组件包括以堆叠配置耦合到电子阵列的传感器阵列。传感器阵列包括多个传感器模块，每个传感器模块包括多个传感器子阵列。电子阵列包括多个集成电路模块，每个集成电路模块包括多个集成电路芯片。传感器模块可以通过倒装芯片技术耦合到电子模块。

8. 发明授权

US07781238B2 Methods of making and using integrated and testable sensor array 有权
标题翻译：制作和使用集成和可测量传感器阵列的方法
公开(公告)号：US07781238B2
公开(公告)日：2010-08-24
申请号：US11951360
申请日：2007-12-06
申请人： Robert Gideon Wodnicki , Stacey Joy Kennerly , Wei-Cheng Tian , Kevin Matthew Durocher , David Martin Mills , Charles Gerard Woychik , Lowell Scott Smith
发明人： Robert Gideon Wodnicki , Stacey Joy Kennerly , Wei-Cheng Tian , Kevin Matthew Durocher , David Martin Mills , Charles Gerard Woychik , Lowell Scott Smith
IPC分类号： H01L21/66
CPC分类号： H01L22/20 , H01L22/14
摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.
摘要翻译：提供了制造可测试的传感器组件的方法。该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

9. 发明申请

US20090148967A1 METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY 有权
标题翻译：制造和使用集成和可测传感器阵列的方法
公开(公告)号：US20090148967A1
公开(公告)日：2009-06-11
申请号：US11951360
申请日：2007-12-06
申请人： Robert Gideon Wodnicki , Stacey Joy Kennerly , Wei-Cheng Tian , Kevin Matthew Durocher , David Martin Mills , Charles Gerard Woychik , Lowell Scott Smith
发明人： Robert Gideon Wodnicki , Stacey Joy Kennerly , Wei-Cheng Tian , Kevin Matthew Durocher , David Martin Mills , Charles Gerard Woychik , Lowell Scott Smith
IPC分类号： H01L21/66
CPC分类号： H01L22/20 , H01L22/14
摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.
摘要翻译：提供了制造可测试的传感器组件的方法。该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

10. 发明授权

US08742646B2 Ultrasound acoustic assemblies and methods of manufacture 有权
标题翻译：超音波组件及其制造方法
公开(公告)号：US08742646B2
公开(公告)日：2014-06-03
申请号：US13433422
申请日：2012-03-29
申请人： Robert Gideon Wodnicki , Charles Edward Baumgartner , David Martin Mills , Kevin Matthew Durocher , William Hullinger Huber , George Charles Sogoian , Christopher James Kapusta
发明人： Robert Gideon Wodnicki , Charles Edward Baumgartner , David Martin Mills , Kevin Matthew Durocher , William Hullinger Huber , George Charles Sogoian , Christopher James Kapusta
IPC分类号： H01L41/08 , B06B1/06
CPC分类号： B06B1/0622 , H01L41/338 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1433 , H01L2924/15321 , Y10T29/42 , H01L2924/00
摘要： An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.
摘要翻译：超声波声学组件包括多个超声波阵列，每个阵列包括声叠层，声堆叠包括与至少一个声阻抗分配层和支撑层组装的压电层。声学堆叠限定了多个切割切口和多个声学元件，使得切割切口形成在相邻的声学元件之间。切割切口延伸穿过压电层并通过声阻抗分层，但仅部分延伸穿过支撑层。超声波组件还包括许多专用集成电路（ASIC）芯片。每个超声波阵列耦合到相应的ASIC管芯，以形成相应的声电传感器模块。还提供了制造方法。

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