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1. 发明专利

DE69938271T2 未知
公开(公告)号：DE69938271T2
公开(公告)日：2009-03-19
申请号：DE69938271
申请日：1999-05-28
申请人： KYOCERA CORP
发明人： NAGATA KOICHI , KITAZAWA KENJI , KORIYAMA SHINICHI , KUBO TAKANORI , MINAMIUE HIDEHIRO , ISHIDA MASANOBU , NAKAYAMA AKIRA , SHINO NAOYUKI , MORIOKA SHIGEKI
IPC分类号： H01L23/66 , H01P5/18 , H05K1/00 , H05K1/02 , H05K3/00 , H05K9/00
摘要： A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices in the cavities and are located in the cavities, the internal high-frequency signal transmission lines being electromagnetically coupled to an external high-frequency signal transmission line, and the high-frequency devices in the cavities are connected to each other relying on the electromagnetic coupling through the external line. The high-frequency module enables high-frequency signals to be transmitted among the high-frequency devices with a small loss. The module has a very simple structure, and is cheaply produced, and offers an advantage that it can be easily obtained in a small size.

2. 发明专利

DE69938271D1 未知
公开(公告)号：DE69938271D1
公开(公告)日：2008-04-17
申请号：DE69938271
申请日：1999-05-28
申请人： KYOCERA CORP
发明人： NAGATA KOICHI , KITAZAWA KENJI , KORIYAMA SHINICHI , KUBO TAKANORI , MINAMIUE HIDEHIRO , ISHIDA MASANOBU , NAKAYAMA AKIRA , SHINO NAOYUKI , MORIOKA SHIGEKI
IPC分类号： H01L23/66 , H01P5/18 , H05K1/00 , H05K1/02 , H05K3/00 , H05K9/00
摘要： A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices in the cavities and are located in the cavities, the internal high-frequency signal transmission lines being electromagnetically coupled to an external high-frequency signal transmission line, and the high-frequency devices in the cavities are connected to each other relying on the electromagnetic coupling through the external line. The high-frequency module enables high-frequency signals to be transmitted among the high-frequency devices with a small loss. The module has a very simple structure, and is cheaply produced, and offers an advantage that it can be easily obtained in a small size.

3. 发明公开

EP2963002A4 CERAMIC BONDED BODY AND CHANNEL BODY 审中-公开
标题翻译：陶瓷坯体及相关通道主体
公开(公告)号：EP2963002A4
公开(公告)日：2016-10-26
申请号：EP14757217
申请日：2014-02-27
申请人： KYOCERA CORP
发明人： SHINO NAOYUKI , NAKAMURA KIYOTAKA , HIRANO YOSHINORI
IPC分类号： C04B37/00
CPC分类号： B32B18/00 , B32B1/08 , B32B7/12 , B32B2250/02 , B32B2255/205 , B32B2307/306 , B32B2597/00 , C04B37/003 , C04B37/005 , C04B2237/083 , C04B2237/095 , C04B2237/16 , C04B2237/365 , C04B2237/72 , C04B2237/76 , C04B2237/765

4. 发明专利

JP2013068343A Channel member, and heat exchanger equipped with the same 有权
标题翻译：通道会员和与之交换的热交换器
公开(公告)号：JP2013068343A
公开(公告)日：2013-04-18
申请号：JP2011206244
申请日：2011-09-21
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHINO NAOYUKI
IPC分类号： F28F21/04 , B23K20/00 , B23K35/30 , C22C5/06 , C22C19/05
摘要： PROBLEM TO BE SOLVED: To provide a reliable channel member which is high in rigidity and does not cause trouble such as joint exfoliation even if a hot fluid flows therein or it is placed in a hot environment, and to provide a heat exchanger which is equipped with the reliable channel member.SOLUTION: The channel member 10 which is configured with its inside serving as a channel for fluid, is composed by joining a first member 1 formed of a ceramic sintered body of non-oxide and a second member 2 made of an alloy containing nickel via a third member 3 made of a cemented carbide. Moreover, the heat exchanger is equipped with the channel member 10.
摘要翻译：要解决的问题：为了提供一种可靠的通道构件，其刚性高，即使热流体流入或放置在热环境中也不会引起接头剥离等麻烦，并且提供热交换器它配备了可靠的通道成员。解决方案：构成其内部的用作流体通道的通道构件10通过将由非氧化物的陶瓷烧结体形成的第一构件1和由含有氧化物的合金制成的第二构件2接合而构成镍通过由硬质合金制成的第三构件3。此外，热交换器配备有通道构件10.版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2008131166A Antenna module 审中-公开
标题翻译：天线模块
公开(公告)号：JP2008131166A
公开(公告)日：2008-06-05
申请号：JP2006311576
申请日：2006-11-17
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHINO NAOYUKI
IPC分类号： H01Q1/52 , H01Q1/38 , H01Q1/46 , H01Q23/00
CPC分类号： H01L2223/6677 , H01L2224/48137 , H01L2224/73265 , H01L2924/15313 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a compact antenna module which suppresses interaction between electromagnetic waves radiated from a signal line and an antenna and improves the reliability of connection between a connection terminal of an antenna substrate and a connection terminal of a printed wiring board.
SOLUTION: This antenna module is characterized in that the connection terminal which is formed on the top surface of the antenna substrate 3, connected to a semiconductor element 8, and exposed inside a through hole 10 and the connection terminal formed on the top surface of the printed wiring board 2 nearby the through hole 10 and connected to the transmission line are connected by an electric connecting means 6 made of a metallic wire or ribbon and a shielding conductor layer 12 is formed in the antenna substrate 3 with the antenna element 4, semiconductor element 8, and electric connecting means 6 disposed inside in top-surface view.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种抑制从信号线辐射的电磁波与天线之间的相互作用的小型天线模块，并且提高天线基板的连接端子和印刷线路的连接端子之间的连接的可靠性板。解决方案：该天线模块的特征在于，形成在天线基板3的顶表面上，连接到半导体元件8并暴露在通孔10内的连接端子和形成在顶部上的连接端子通过连接到传输线的通孔10附近的印刷电路板2的表面通过由金属线或带形成的电连接装置6连接，并且在天线基板3中形成屏蔽导体层12，天线元件 4，半导体元件8和设置在顶面视图内的电连接装置6。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007067581A Circularly polarized wave array antenna 有权
标题翻译：圆极化波阵列天线
公开(公告)号：JP2007067581A
公开(公告)日：2007-03-15
申请号：JP2005248409
申请日：2005-08-29
申请人： Kyocera Corp , 京セラ株式会社
发明人： MIYASATO KENTARO , UCHIMURA HIROSHI , SHINO NAOYUKI
IPC分类号： H01Q21/08 , H01Q13/22
摘要： PROBLEM TO BE SOLVED: To reduce an axial ratio and expand a bandwidth of a circularly polarized wave array antenna provided with a plurality of radiation elements receiving power from a feeding circuit.
SOLUTION: The circularly polarized wave array antenna is configured such that a slot 12 is formed to one of opposed faces of the feeding circuit 1 of a waveguide or dielectric waveguide structure and a radiation element group (columnar dielectric resonators 2a to 2j) is provided to the other of the opposed faces of the feeding circuit 1. The slot 12 is formed to be a shape extended in a direction perpendicular to a length direction nearly at the middle of the feeding circuit 1 in the length direction, the radiation elements (columnar dielectric resonators 2a to 2e) arranged at one end side of the feeding circuit 1 in the length direction and the radiation elements (columnar dielectric resonators 2f to 2j) arranged at the other end side from the slot 12 form a pair to configure the radiation element group, and it is characterized in that both end faces 1a, 1b of the feeding circuit 1 in the length direction are opened.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了减小轴向比并扩大设置有从馈电电路接收功率的多个辐射元件的圆偏振波阵列天线的带宽。解决方案：圆偏振阵列天线被配置为使得槽12形成在波导或电介质波导结构的馈电电路1和辐射元件组（柱状介质谐振器2a至2j）的相对面之一中，被提供给馈电电路1的另一个相对面。槽12形成为在长度方向上几乎在馈电电路1的中间沿垂直于长度方向的方向延伸的形状，辐射元件布置在供电电路1的长度方向的一端侧的柱状介质谐振器2a〜2e和配置在与槽12的另一端侧的放射元件（柱状介质谐振器2f〜2j）形成一对，辐射元件组，其特征在于，供电电路1的长度方向的两端面1a，1b都被打开。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2001244409A HIGH-FREQUENCY MODULE 失效
公开(公告)号：JP2001244409A
公开(公告)日：2001-09-07
申请号：JP2000053999
申请日：2000-02-29
申请人： KYOCERA CORP
发明人： KORIYAMA SHINICHI , SHINO NAOYUKI , NANJIYOU HIDEHIRO
IPC分类号： H01L25/10 , H01L23/52 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To reduce the transmission loss of a high-frequency signal in a high-frequency module where a high-frequency element module accommodating the high-frequency element is packaged in a circuit substrate. SOLUTION: The high-frequency module is provided with a circuit substrate B also having first high-frequency lines 12a, 12b, and 12c with at least a pair of connection terminals 13a and 13b while deposited and formed on the surface of a first dielectric substrate 11. A high-frequency element package A having a high-frequency element 2 that is mounted on the surface of a second dielectric substrate 1, and second high-frequency lines 4a and 5a that are formed on the second dielectric substrate 1, are connected to the high-frequency element 2, and have connection terminals 6a and 6b for making connection to an external circuit at an end. The high-frequency element package is packaged on the surface of the circuit substrate B, and a ratio L2/L1 is set to 0.5 or less where total high-frequency length in a module is set to L1 and total high-frequency circuit length on the circuit substrate is set to L2.

8. 发明专利

JP2000196241A CERAMIC MULTI-LAYER WIRING BOARD 失效
公开(公告)号：JP2000196241A
公开(公告)日：2000-07-14
申请号：JP37116798
申请日：1998-12-25
申请人： KYOCERA CORP
发明人： SHINO NAOYUKI , ARIKAWA HIDEHIRO
IPC分类号： H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a ceramic multilayer wiring board having a high substrate strength and a low dielectric loss by relieving generation of stress due to difference in thermal expansion or in firing shrinkage between an insulation substrate and an inner wiring circuit layer, in the multilayer wiring substrate formed by simultaneously firing with the insulation substrate comprising an aluminous ceramics containing high amount of alumina. SOLUTION: In a ceramic wiring board in which a wiring circuit layer 2b is arranged at least the inside of a ceramic insulating board 2 containing alumina of 98 weight % or more, the wiring board is constituted by a multilayer structure comprising a high void layer 2a containing a void of 0.2 to 5 μm and in which the thickness of a single layer is 8 to 100 μm, and a low void layer 2b whose voidage is lower than that of the high void layer by 10% or more, and the high void layer 2a is arranged on one of the surfaces of the inner wiring circuit layer 2b and the uppermost surface of the insulating board 2 is constituted by the low void layer 2a.

9. 发明专利

JPH09142969A METALLIZED COMPOSITION AND PRODUCTION OF WIRING BOARD FORMED BY USING THE SAME 失效
公开(公告)号：JPH09142969A
公开(公告)日：1997-06-03
申请号：JP30950595
申请日：1995-11-28
申请人： KYOCERA CORP
发明人： HAYASHI KATSURA , SHINO NAOYUKI , ARIKAWA HIDEHIRO
IPC分类号： H05K1/09 , C04B35/111 , C04B41/88 , H01L23/12 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To form a layer having a low sheet resistance and high tight adhesion strength by using a metallized compsn. which contains Mo, Al2 O3 and Nb compd. at prescribed ratios and is specified in the contents of Si, Ca and Na to specified values or below in order to form the metallized layer on aluminous ceramics. SOLUTION: The metallized compsn. which contains 50 to 90vol.% Mo, 10 to 50vol.% Al2 O3 and the Nb compd.. at 0 to 5vol.% in terms of Nb2 O3 and has the contents of Si, Ca and Na to be incorporated as impurities at =99.3wt.% Al2 O3 . The metallized layer by simultaneous firing is thereby made possible. The fig. illustrates the reproduced diagram of the boundary structure between the metallized layer 1 and the high-purity aluminous sintered compact 2. The adhesion of these two layers is preferably such that the surface roughness Rmax to form ruggedness by conjugation of the Al2 O3 particles 3 in the metallized layer and the Al2 O3 particles 4 in the sintered compact is >=100nm.

10. 发明专利

JPH08104597A DIAMOND LAMINATED FILM AND MEMBER WITH THE SAME 失效
公开(公告)号：JPH08104597A
公开(公告)日：1996-04-23
申请号：JP23650894
申请日：1994-09-30
申请人： KYOCERA CORP
发明人： HAYASHI KATSURA , FUKUMARU FUMIO , ATSUNUSHI SHIGEO , SHINO NAOYUKI
IPC分类号： C30B29/04 , C23C16/26 , C23C16/27
摘要： PURPOSE: To obtain a diamond laminated film suppressing chipping in a producing process and at the time of use and capable of stabilizing performance at the time of use and to obtain a member with the diamond laminated film. CONSTITUTION: Diamond crystal layers 2 and diamondlike carbon layers 3 are alternately laminated in three or more layers to obtain the objective diamond laminated film 1. Each of the diamondlike carbon layers 3 is preferably thinner than each of the diamond crystal layers 2 and the diamond crystal layers 2 are preferably formed in three or more layers. The diamond laminated film is joined to a substrate to obtain the objective member.

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